Abstract:
A double-face display device is formed of a substrate sheet having a first surface and a second surface, a first display medium disposed over the first surface, a second display medium disposed over the second surface, and a first display electrode and a second display electrode disposed in association with the first display medium and the second display medium, respectively. A first switching device and a second switching device are electrically connected to the first display electrode and the second display electrode, respectively, so that voltages are applied to the first and second display electrodes via the first and second switching devices, respectively, thereby driving the first and second display media to display data on both faces of the display device. The production of the double-face display device is rationalized by disposing the first and second switching devices on a common surface within the display device. The common surface may be given by one of the first and second surfaces of the substrate sheet or an inter-layer surface between layer sheets forming the substrate sheet in a laminated form.
Abstract:
A method of fabricating LCOS devices and testing them at the wafer-scale to identify known-bad dice, to facilitate completing fabrication of only known-good dice. A wafer-scale transparent electrode glass is temporarily placed over the wafer, and liquid crystal material is injected into the LCOS device cavities through fill holes extending through the wafer. After removing the glass and separating the wafer into dice, only the good dice have their die-scale glass attached, liquid crystal material re-injected, solder bumps affixed, and substrate attached.
Abstract:
An electrophoretic device 20 is provided which includes a circuit board 1 provided with a plurality of pixel electrodes 3, a transparent electrode (counter electrode) 4 opposed to the individual pixel electrodes 3, an electrophoretic dispersion layer 11 containing an electrophoretic dispersion 11, the electrophoretic dispersion layer 11 being partially interposed between the electrodes, a plurality of thin-film transistors 30 disposed on a surface of the circuit board 1 remote from the electrophoretic dispersion layer 11, and conducting parts 8 extending through the circuit board 1 and electrically connecting the pixel electrodes 3 and the thin-film transistors to each other.
Abstract:
There is provided a display apparatus. The apparatus includes (1) a substrate, (2) a display element disposed on the substrate, the display element having (a) a first electrical conductor, (b) a second electrical conductor, and (c) a light switching material disposed between the first electrical conductor and the second electrical conductor, and (3) a via through the substrate for electrically coupling a signal to the first electrical conductor.
Abstract:
There is provided a display apparatus. The apparatus includes (1) a substrate, (2) a display element disposed on the substrate, the display element having (a) a first electrical conductor, (b) a second electrical conductor, and (c) a light switching material disposed between the first electrical conductor and the second electrical conductor, and (3) a via through the substrate for electrically coupling a signal to the first electrical conductor.
Abstract:
An integrated circuit may have a spatial light modulator formed on one side of a semiconductor support and a microprocessor formed on the opposite side. The microprocessor and the spatial light modulator may communicate with one another through electrical connections which extend completely through the semiconductor support. The microprocessor may be contacted using bump packaging techniques.
Abstract:
A silicon dioxide etch stop layer (30) is formed on an inner surface (28b) of a monocrystalline silicon semiconductor layer (28), and a silicon carrier wafer (52) is bonded to the etch stop layer (30). The exposed outer surface (28a) of the layer (28) is uniformly thinned to approximately 4 micrometers. Vertical interconnects or vias (49) are formed through the layer (28), and microelectronic transistor driver devices (42) and storage capacitors (47) are formed on the outer surface (28a) of the layer (28) in connection with the respective vias (49). A substrate (12) is adhered to the outer surface (28a) of the layer (28), and the carrier (52) is removed. Reflective metal back electrodes (20) are formed on the insulating layer (30) in connection with the respective vias (49). A transparent front plate (14) having a transparent front electrode (16) formed thereon is adhered to the insulating layer ( 30) such that a sealed space (24) is defined between the electrodes (16,20) which is filled with liquid crystal material (26). Large scale integrated driver circuitry (38,40) is fabricated in the peripheral portion (28c) of the layer (28) laterally external of the plate (14) and is externally interconnected by via holes (28d,28e) and wirebonds (44,45).
Abstract:
A wide-frame display consisting of a plurality of constituent display cells is described. The display cell comprises a pair of substrates between which a light influencing layer is disposed. The light influencing layer changes its optical property in accordance with an electric field applied thereacross by means of an electrode arrangement. Driving signals are supplied to the electrode arrangement through holes opened in the substrate and receiving leads which make contact with the electrode arrangement at one end and extends from the external surface of the substrate for coupling with a driving circuit for supplying the driving signals.
Abstract:
A small, pocket size, direct current flat electroluminescent display panel made of a single crystalline substrate having electroluminescent material on the front face and addressing circuitry on the back face. The addressing circuitry is conductively connected to the electroluminescent material through feedthrough holes in the substrate. The feedthrough holes are produced by electrons beams or laser beams, or by photo-etching techniques. The addressing circuitry may be, for example, metallic oxide semiconductors or thin film transistors. A large scale integrated thin film transistor circuit could be deposited into a matrix, from a multiple of evaporation sources, through a system of registered masks positioned on the back side of the substrate. The electroluminescent material may comprise a matrix of light emitting diodes, or alternatively a solid sheet of Group II-VI heterojunction sandwich structure. The matrix of light emitting diodes may be made of gallium arsenide phosphide materials that are in exact registration with the addressing circuitry and connected thereto by conductors connected through the feedthrough holes. Voltage pulses from shift registers in a predetermined pattern are applied to the matrix of addressing circuitry. Outputs from the addressing circuitry cause the electroluminescent material that is conductively connected thereto to conduct, providing a display in the predetermined pattern of the voltage pulses from the shift registers.
Abstract:
According to the invention there is provided a liquid crystal display device comprising a pair of parallel, transparent plates with associated electrode configurations and between which there is enclosed a liquid crystal layer by means of a gasket or seal around the edges of the plates. The construction of the seal is such that it provides a flexible joining of the plates with a bellows-like effect. The seal comprises inner and outer portions which are hermetically sealed to the respective plates and are joined by way of a flexible transition portion, the extension of the respective plates corresponding to the adjacent inner and outer portions of the seal. The seal, together with a number of wafers for the sealing of lead-in holes for electrical connection to external leads, are secured to the plates by means of a special method which according to the invention comprises a combination of heat, ultrasound and mechanical pressure under the influence of an electric voltage.