公开(公告)号：US08405975B2

公开(公告)日：2013-03-26

申请号：US13004741

申请日：2011-01-11

Applicant: Christopher Helberg ,  David M. Meyers

Inventor： Christopher Helberg ,  David M. Meyers

IPC: H05K7/20

CPC classification number: G06F1/1632 ,  G06F1/203 ,  G06F1/206 ,  G06F2200/201 ,  Y02D10/16

Abstract: Liquid cooling is selectively enabled at a portable information handling system to provide enhanced processing capabilities when needed or desired. A liquid cooling cold plate conducts thermal energy from a processing component heat pipe or heat sink to a liquid pumped from external to the information handling system housing. The pump operates with power provided from an AC/DC adapter of the information handling system or power provided from an interface with the information handling system, such as a USB port and cable. Alternatively, liquid cooling is included in a cradle to automatically engage with the information handling system is coupled to the cradle.

Abstract translation: 在便携式信息处理系统中选择性地启用液体冷却，以在需要或期望时提供增强的处理能力。 液体冷却冷板将热能从处理部件热管或散热器传导到从外部泵送到信息处理系统壳体的液体。 该泵由信息处理系统的AC / DC适配器提供的电力或者与信息处理系统的接口（例如USB端口和电缆）提供的电力一起工作。 或者，液体冷却被包括在支架中以与信息处理系统自动接合，该信息处理系统耦合到支架。

公开(公告)号：US20130058038A1

公开(公告)日：2013-03-07

申请号：US13593157

申请日：2012-08-23

Applicant: Monem H. Alyaser ,  Jeremy A. Rice

Inventor： Monem H. Alyaser ,  Jeremy A. Rice

IPC: G06F1/20 ,  F28F13/12 ,  F28F3/14

CPC classification number: H05K7/20254 ,  F28D15/00 ,  F28D15/02 ,  F28D2021/0019 ,  G06F1/20 ,  G06F2200/201 ,  H01L23/427 ,  H01L23/473 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A thermal interposer for a heat-generating electronic component located on an adapter card of a computer includes a thermally conducting planar body. The thermally conducting planar body may be configured to be coupled to the adapter card such that a first surface of the planar body is in thermal contact with a surface of the electronic component. The thermal interposer may also include a cold plate assembly removably coupled to a second surface of the planar body opposite the first surface. The cold plate assembly may include an inlet adapted to receive a cooling liquid into the cold plate assembly and an outlet adapted to discharge the cooling liquid from the cold plate assembly.

Abstract translation: 位于计算机的适配器卡上的用于发热电子部件的热插入件包括导热平面体。 导热平面体可以被配置为联接到适配器卡，使得平面体的第一表面与电子部件的表面热接触。 热插入件还可以包括可拆卸地联接到与第一表面相对的平面体的第二表面的冷板组件。 冷板组件可以包括适于将冷却液体接收到冷板组件中的入口和适于从冷板组件排出冷却液体的出口。

公开(公告)号：US20130044426A1

公开(公告)日：2013-02-21

申请号：US13387092

申请日：2010-03-22

Applicant: Matthew Daniel Neumann ,  Timothy Michael Rau

Inventor： Matthew Daniel Neumann ,  Timothy Michael Rau

IPC: G06F1/20 ,  H05K13/00

CPC classification number: H05K7/1497 ,  G06F1/20 ,  G06F1/206 ,  G06F2200/201 ,  H05K5/00 ,  H05K5/0004 ,  H05K5/02 ,  H05K7/14 ,  H05K7/1485 ,  H05K7/1488 ,  H05K7/20254 ,  H05K7/2039 ,  H05K7/20409 ,  H05K7/2049 ,  H05K7/2079 ,  Y10T29/49002

Abstract: A data center includes a modular building structure forming an enclosure having a bottom side. An external support system extends from the modular building structure. A series of heat sinks are each configured to extend from an interior to an exterior of the enclosure and protrude below the bottom side of the modular building structure into a fluid. Electronic components and devices are housed within the enclosure.

Abstract translation: 数据中心包括形成具有底侧的外壳的模块化建筑结构。 外部支持系统从模块化建筑结构延伸。 一系列散热器各自构造成从外壳的内部延伸到外部并且突出到模块化建筑结构的底侧下方成为流体。 电子组件和设备安装在外壳内。

公开(公告)号：US08379386B2

公开(公告)日：2013-02-19

申请号：US12976104

申请日：2010-12-22

Applicant: Toshiya Senoh ,  Takeshi Mori ,  Jun Sato

Inventor： Toshiya Senoh ,  Takeshi Mori ,  Jun Sato

IPC: H05K7/20

CPC classification number: G06F1/203 ,  G06F2200/201

Abstract: An electronic apparatus includes the following: a heat dissipation chamber that is formed by liquid tightly separating the inside of a main unit case with a partition, has an inlet air vent and an outlet air vent in the partition, and includes a heat dissipation portion; a cooling fan that is located in the heat dissipation chamber; an inlet that is provided in the main unit case to introduce outside air into the heat dissipation chamber through the inlet air vent; and an outlet that is provided in the main unit case to exhaust an air flow sent from the cooling fan to the outside through the outlet air vent. An air channel that extends from the inlet air vent through a side wall of the main unit case to communicate the heat dissipation chamber with the inlet is liquid tightly sealed from the internal space of the main unit case with a sealing wall. A plurality of plate-shaped ribs are provided in the air channel so as to extend in a flow path direction and arranged in a lateral direction of the inlet air vent. The rigidity of the main unit case can be ensured sufficiently while maintaining the liquid tightness between the inside of the main unit case and the heat dissipation chamber.

Abstract translation: 一种电子设备，包括以下部分：散热室，其通过将主单元壳体的内部与隔板液密地分离而形成，在隔板中具有入口通气口和出气口，并且包括散热部; 位于散热室内的冷却风扇; 入口，设置在主单元壳体中，以通过入口通风口将外部空气引入散热室; 以及出口，其设置在主单元壳体中，以通过出口空气排出从冷却风扇向外部排出的空气流。 从入口通气口通过主单元壳体的侧壁延伸以将散热室与入口连通的空气通道与主单元壳体的内部空间与密封壁液密密封。 多个板状肋设置在空气通道中，以沿着流路方向延伸并且沿着入口通风口的横向布置。 可以充分确保主单元壳体的刚性，同时保持主单元壳体的内部和散热室之间的液密性。

公开(公告)号：US08361705B2

公开(公告)日：2013-01-29

申请号：US12595925

申请日：2008-04-15

Applicant: Ian Christopher Parsons ,  Dorota A. Bulik ,  Carlos J. Bosques ,  Lakshmanan Thiruneelakantapillai ,  Brian Edward Collins

Inventor： Ian Christopher Parsons ,  Dorota A. Bulik ,  Carlos J. Bosques ,  Lakshmanan Thiruneelakantapillai ,  Brian Edward Collins

IPC: C12Q1/00

CPC classification number: C12Q1/34 ,  F28D15/0266 ,  G06F1/20 ,  G06F2200/201 ,  H01L23/427 ,  H01L2924/0002 ,  H05K7/20809 ,  H01L2924/00

Abstract: The present disclosure provides methods for analyzing structure and/or composition of N-glycans. Such methods often involve digestion of N-glycans with multiple exoglycosidases. In some embodiments, N-glycans are digested with multiple exoglycosidases simultaneously. In some embodiments, N-glycans are digested with multiple exoglycosidases sequentially. In some embodiments, methods in accordance with the present disclosure involve comparison of cleavage products of N-glycans that have been digested with multiple exoglycosidases simultaneously to N-glycans that have been digested with multiple exoglycosidases sequentially.

公开(公告)号：US08353176B2

公开(公告)日：2013-01-15

申请号：US12655587

申请日：2009-12-31

Applicant: Paul J. Gwin ,  Brian J. Long

Inventor： Paul J. Gwin ,  Brian J. Long

IPC: F25D23/12

CPC classification number: F28D15/00 ,  F28D2021/0031 ,  F28F2250/08 ,  F28F2280/105 ,  G06F1/20 ,  G06F2200/201 ,  H05K7/20172

Abstract: In some embodiments, a cooling device may be mounted to a portion of a chassis of an electronic system, wherein the cooling device may be releasably and pivotably attached to the chassis in at least an open position to permit access to components within the electronic system and a closed position to permit installation of a cover on the chassis. Other embodiments are disclosed and claimed.

Abstract translation: 在一些实施例中，冷却装置可以安装到电子系统的底盘的一部分，其中冷却装置可以在至少打开位置可释放地和可枢转地附接到底盘，以允许接近电子系统内的部件， 一个关闭的位置，允许在机箱上安装一个盖子。 公开和要求保护其他实施例。

公开(公告)号：US08336611B2

公开(公告)日：2012-12-25

申请号：US12539344

申请日：2009-08-11

Applicant: Chien Ouyang

Inventor： Chien Ouyang

IPC: F28F27/00 ,  F28D15/00

CPC classification number: F28F13/16 ,  F28D15/00 ,  G06F1/20 ,  G06F1/206 ,  G06F2200/201 ,  H01L23/473 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A heat source is cooled by employing heat pipes, magneto-hydrodynamic fluid pipes, and a heat sink. Heat is transmitted from evaporating ends of the heat pipes connected to the heat source to condensing ends of the heat pipes connected to the heat sink. The magneto-hydrodynamic fluid is circulated inside the magneto-hydrodynamic fluid pipes. Magnetic fields are generated using an array of magnets and an electric potential is created from a top surface to a bottom surface of each magneto-hydrodynamic fluid pipe using metal films. The magnetic fields and electric potential induce an electrically-conductive magneto-hydrodynamic fluid to circulate in the magneto-hydrodynamic fluid pipes thereby dissipating heat from the heat sink.

Abstract translation: 通过使用热管，磁流体动力流体管和散热器来冷却热源。 热量从连接到热源的热管的蒸发端传递到连接到散热器的热管的冷凝端。 磁流体动力流体在磁流体动力流体管内循环。 使用磁体阵列产生磁场，并且使用金属膜从每个磁流体动力流体管的顶表面到底表面产生电势。 磁场和电势引起导电磁流体动力流体在磁流体动力流体管中循环，从而散热来自散热器。

公开(公告)号：US08302419B2

公开(公告)日：2012-11-06

申请号：US12113967

申请日：2008-05-02

Applicant: Pei-Hsi Lin

Inventor： Pei-Hsi Lin

IPC: F25D23/12 ,  H05K7/20

CPC classification number: G06F1/20 ,  G06F2200/201

Abstract: An improved computer cooling apparatus includes: at least one evaporator installed on a surface of at least one heat generating source which is a central processing unit in a computer system unit; a compressor, connected to the evaporator; a condenser, connected to the compressor; an expansion valve, connected between the condenser and the evaporator; a fan, installed on a side of the condenser; and a coolant, circulating among the evaporator, the compressor, the condenser and the expansion valve. The evaporator, compressor, condenser, fan, expansion valve and coolant are used for achieving the effect of quickly dispersing a heat generating source in the computer system unit.

Abstract translation: 一种改进的计算机冷却装置包括：安装在至少一个发热源的表面上的至少一个蒸发器，其是计算机系统单元中的中央处理单元; 连接到蒸发器的压缩机; 连接到压缩机的冷凝器; 连接在冷凝器和蒸发器之间的膨胀阀; 风扇，安装在冷凝器的一侧; 以及在蒸发器，压缩机，冷凝器和膨胀阀之间循环的冷却剂。 蒸发器，压缩机，冷凝器，风扇，膨胀阀和冷却剂用于实现将发热源快速分散在计算机系统单元中的效果。

公开(公告)号：US08296121B2

公开(公告)日：2012-10-23

申请号：US11789677

申请日：2007-04-25

Applicant: Mitchell G. Poplack ,  William F. Beausoleil ,  Tung-Sun Tung ,  James Tomassetti

Inventor： Mitchell G. Poplack ,  William F. Beausoleil ,  Tung-Sun Tung ,  James Tomassetti

IPC: G06F9/455 ,  G06F1/00 ,  G06G7/54 ,  G01K1/00 ,  G01K3/00 ,  G01K5/00 ,  G01K7/00 ,  G01K9/00 ,  G01K11/00 ,  G01K1/08 ,  G01K13/00 ,  G01K17/00

CPC classification number: G06F1/3203 ,  G06F1/206 ,  G06F1/3296 ,  G06F2200/201 ,  Y02D10/16 ,  Y02D10/172

Abstract: Method and apparatus for controlling power in an emulation system are described. In one example, a first interface is configured to receive requirement information for a logic module to be emulated from a host computer system. The requirement information includes at least one of a power requirement or a thermal requirement. A second interface is configured to receive measurement data from sensors in the emulation system. A controller is configured to control at least one of a synchronization system, a power regulation system, or a thermal system in the emulation system in response to the requirement information and the measurement data to reduce power load of the emulation system.

Abstract translation: 描述了用于在仿真系统中控制功率的方法和装置。 在一个示例中，第一接口被配置为接收要从主计算机系统仿真的逻辑模块的需求信息。 需求信息包括功率需求或热要求中的至少一个。 第二接口被配置为从仿真系统中的传感器接收测量数据。 控制器被配置为响应于需求信息和测量数据来控制仿真系统中的同步系统，功率调节系统或热系统中的至少一个，以减少仿真系统的功率负载。

公开(公告)号：US08276397B1

公开(公告)日：2012-10-02

申请号：US12146196

申请日：2008-06-25

Applicant: Andrew B. Carlson ,  William Hamburgen ,  Jimmy Clidaras ,  Donald L. Beaty

Inventor： Andrew B. Carlson ,  William Hamburgen ,  Jimmy Clidaras ,  Donald L. Beaty

IPC: F25D23/12

CPC classification number: G06F1/189 ,  G06F1/20 ,  G06F2200/201 ,  H05K7/20745

Abstract: A facility is described that includes one or more enclosures defining an interior space, a plurality of power taps, a plurality of coolant supply taps, and a plurality of coolant return taps. A flow capacity of the supply taps and a flow capacity of the return taps can be approximately equal over a local area of the interior space. The plurality of power taps, the plurality of supply taps, and the plurality of return taps can be divided into a plurality of zones, with taps of each zone are configured to be controllably coupled to a power source or a coolant source independently of the taps of other zones. The taps can be positioned along paths, and paths of the power taps can be spaced from associated proximate paths of supply and return taps by a substantially uniform distance along a substantial length of the first path.

Abstract translation: 描述了一种设备，其包括限定内部空间的一个或多个外壳，多个电源抽头，多个冷却剂供给开关和多个冷却剂返回抽头。 供应水龙头的流量和返回水龙头的流量可以在内部空间的局部区域上大致相等。 多个电源抽头，多个供给抽头和多个返回抽头可以被分成多个区域，每个区域的抽头被配置为独立于抽头而被可控地耦合到电源或冷却剂源 的其他区域。 水龙头可以沿着路径定位，并且功率水龙头的路径可以与相关联的供应和返回水龙头的近似路径间隔开沿着第一路径的实质长度的基本均匀的距离。