公开(公告)号：US09433078B2

公开(公告)日：2016-08-30

申请号：US13673986

申请日：2012-11-09

Applicant: SANMINA CORPORATION

Inventor： Vladimir Duvanenko

IPC: H05K1/16 ,  H05K1/02 ,  H05K1/18 ,  H05K3/00 ,  H05K1/11

CPC classification number: H05K1/0216 ,  H05K1/0245 ,  H05K1/0251 ,  H05K1/116 ,  H05K1/182 ,  H05K3/00 ,  H05K2201/09781 ,  Y10T29/49146

Abstract: A printed circuit board (PCB) is provided comprising a plurality of non-conductive layers with conductive or signal layers in between. The PCB includes a first conductive via traversing the plurality of non-conductive and conductive or signal layers as well as a second conductive via traversing the plurality of non-conductive layers and conductive or signal layers, the second conductive via located substantially parallel to the first conductive via. An embedded electro-optical passive element is also provided that extends perpendicular to and between the first conductive via and the second conductive via. The electro-optical passive element embedded is located within a selected layer at a first depth in the printed circuit board, wherein such first depth is selected to reflect an incident electromagnetic wave back into the printed circuit board to enhance or diminish an electrical signal in the first conductive via by creating a positive or negative electromagnetic interference.

Abstract translation: 提供了一种印刷电路板（PCB），包括多个非导电层，其间具有导电层或信号层。 PCB包括穿过多个非导电和导电或信号层的第一导电通孔以及穿过多个非导电层和导电层或信号层的第二导电通孔，第二导电通孔基本上平行于第一导电通孔 导电通孔。 还提供了嵌入的电光无源元件，其垂直于第一导电通孔和第二导电通孔之间延伸。 嵌入的电光无源元件位于印刷电路板的第一深度处的选定层内，其中选择这样的第一深度以将入射的电磁波反射回印刷电路板，以增强或减少印刷电路板中的电信号 通过产生正或负电磁干扰的第一导电通孔。

公开(公告)号：US20160103472A1

公开(公告)日：2016-04-14

申请号：US14732559

申请日：2015-06-05

Applicant: Sanmina Corporation

Inventor： Franz Michael Schuette ,  Lawrence Allan Freymuth ,  Ritesh Kumar

IPC: G06F1/18

CPC classification number: G06F1/189 ,  G06F1/185 ,  G06F1/187

Abstract: One feature pertains to an advanced computer device configured for storing data on a plurality of non-volatile memory mass storage devices. The mass storage devices may interface with the computer device through a plurality of base boards mounted in an enclosure that are configured to couple with at least one non-volatile memory storage drive. Each base board may further be configured to couple with a high speed interconnect cable to exchange data to be loaded or stored with the computer device. According to one aspect, the high speed cable transfers Serially Attached SCSI (SAS) or PCIe data packets or frames.

Abstract translation: 一个特征涉及被配置为在多个非易失性存储器大容量存储设备上存储数据的高级计算机设备。 大容量存储设备可以通过安装在外壳中的多个基板与计算机设备接口，该多个基板被配置为与至少一个非易失性存储器驱动器耦合。 每个基板还可以被配置为与高速互连电缆耦合以交换要与计算机设备一起加载或存储的数据。 根据一个方面，高速电缆传输串行连接SCSI（SAS）或PCIe数据包或帧。

公开(公告)号：US20150173231A1

公开(公告)日：2015-06-18

申请号：US14569487

申请日：2014-12-12

Applicant: Sanmina Corporation

Inventor： Peter RADO ,  David BAKER ,  Dimitry Struve ,  Richard BENNETT

IPC: H05K7/02 ,  H05K7/14 ,  H05K7/18

CPC classification number: H05K7/1491

Abstract: A novel tray assembly for a rack mount type storage unit is provided. The tray assembly is adapted to receive an enclosure. When within the tray assembly, the enclosure may be located within a first position, a second position or a third position. When in the first position, the enclosure is fully received within the tray assembly and the tray assembly is fully received within the rack and is operational. When in the second position, the tray assembly is fully received within the rack and the enclosure is partially slid out of the tray assembly and rack for maintenance, repair, etc. while the enclosure is still powered and running. When in the third position, the enclosure is fully received within the tray assembly for easy insertion into or removal from a rack.

Abstract translation: 提供了一种用于机架安装型存储单元的新型托盘组件。 托盘组件适于接纳外壳。 当在托盘组件内时，外壳可以位于第一位置，第二位置或第三位置内。 当处于第一位置时，外壳完全容纳在托盘组件内，托盘组件被完全接收在机架内并且可操作。 当处于第二位置时，托盘组件完全容纳在机架内，并且外壳在机箱仍然供电并运行时部分地滑出托盘组件和机架以进行维护，修理等。 当处于第三位置时，外壳完全容纳在托盘组件内，以便容易地插入或移出机架。

公开(公告)号：US20140365714A1

公开(公告)日：2014-12-11

申请号：US14300231

申请日：2014-06-09

Applicant: Sanmina Corporation

Inventor： Paul Sweere ,  Jay Patel ,  Irfan Syed

IPC: G06F12/02 ,  G06F13/40

CPC classification number: G06F12/0246 ,  G06F1/206 ,  G06F1/3206 ,  G06F1/3268 ,  G06F3/0625 ,  G06F3/0659 ,  G06F3/0679 ,  G06F11/3041 ,  G06F11/3058 ,  G06F13/409 ,  G06F2212/7211 ,  G11C7/04 ,  Y02D10/151 ,  Y02D10/154 ,  Y02D10/16

Abstract: A peripheral component interconnect express (PCIe) solid state drive (SSD) accelerator, having a PCIe card and separate a flash daughter-card, is provided. By including flash memory devices on a separate daughter-card, the flash memory devices are thermally decoupled from the hotter devices on the main PCIe providing additional thermal operating margins for the entire design. Furthermore, as flash memory devices are the most likely part of the subsystem to wear out over time due, including flash memory devices on a separate daughter-card allows the flash memory devices to become a field replaceable unit that can be easily replaced. EEPROMs may be included on the flash daughter-card to record the current wear state of the NAND flash devices. Knowing the wear history of the flash memory device allows the seller to replace the flash daughter-card of a customer with a daughter-card having a similar wear state.

Abstract translation: 提供了具有PCIe卡和单独的闪存子卡的外围组件互连快速（PCIe）固态驱动器（SSD）加速器。 通过将闪存设备包含在单独的子卡上，闪存设备与主PCIe上较热的设备进行热分离，为整个设计提供额外的热操作余量。 此外，由于闪存设备是子系统中随时间磨损的最可能的部分，包括单独的子卡上的闪存设备允许闪存设备成为可以容易地更换的现场可更换单元。 闪存子卡中可能包含EEPROM，以记录NAND闪存器件的当前磨损状态。 了解闪存设备的磨损历史可以让卖方用具有类似磨损状态的子卡替换客户的闪存子卡。

公开(公告)号：US20140262455A1

公开(公告)日：2014-09-18

申请号：US14205331

申请日：2014-03-11

Applicant: SANMINA CORPORATION

Inventor： Shinichi Iketani ,  Dale Kersten

IPC: H05K1/11 ,  H05K1/02

CPC classification number: H05K3/429 ,  H05K1/0251 ,  H05K1/115 ,  H05K2201/0187 ,  H05K2201/09536 ,  H05K2201/09645 ,  H05K2203/061 ,  H05K2203/0713 ,  Y10T29/49165

Abstract: A multilayer printed circuit board is provided having a first dielectric layer and a first plating resist selectively positioned in the first dielectric layer. A second plating resist may be selectively positioned in the first dielectric layer or a second dielectric layer, the second plating resist separate from the first plating resist. A through hole extends through the first dielectric layer, the first plating resist, and the second plating resist. An interior surface of the through hole is plated with a conductive material except along a length between the first plating resist and the second plating resist. This forms a partitioned plated through hole having a first via segment electrically isolated from a second via segment.

公开(公告)号：US12150254B2

公开(公告)日：2024-11-19

申请号：US17001431

申请日：2020-08-24

Applicant: Sanmina Corporation

Inventor： Shinichi Iketani ,  Dale Kersten

IPC: H05K3/42

Abstract: A core or sub-composite structure is provided including a dielectric layer between a first conductive film and a second conductive film. The first conductive film may include a first peelable/removable cover layer formed on or coupled to a first conductive layer. The second conductive film may include a second peelable/removable cover layer formed on or coupled to a second conductive layer.

公开(公告)号：US20240155800A1

公开(公告)日：2024-05-09

申请号：US17981007

申请日：2022-11-04

Applicant: SANMINA CORPORATION

Inventor： Odie Banks Killen, Jr. ,  John Albert Bauer, Jr.

IPC: H05K7/14 ,  F16L3/06

CPC classification number: H05K7/1492 ,  F16L3/06

Abstract: According to an aspect a perch is provided comprising a bracket configured to be attached to a rack-mount component, a bar having a width and an elongated surface, the bar having tabs configured to engage with the bracket, and an attachment screw to secure the bar to the bracket so that the bar extends horizontally across a portion of the component.

公开(公告)号：US11925004B2

公开(公告)日：2024-03-05

申请号：US17578313

申请日：2022-01-18

Applicant: Sanmina Corporation

Inventor： Odie Banks Killen, Jr. ,  Matthew J. Babcock ,  Brendan Ruggles

IPC: H05K7/20 ,  G06F1/16 ,  G06F1/20 ,  G11B33/14

CPC classification number: H05K7/20563 ,  G06F1/20 ,  G11B33/1406

Abstract: One feature pertains to a data storage cooling module. The data storage cooling module comprises a fan cage assembly, the fan cage assembly including a fan cage that includes at least one fan bay, at least one fan assembly removably coupled to the at least one fan bay, and an interface board removably coupled to the fan cage assembly, the interface board including a first interface surface that includes at least one power connector configured to interface with the at least one fan assembly, and a second interface surface that includes at least one drive connector configured to interface with a baseboard.

公开(公告)号：US11921326B2

公开(公告)日：2024-03-05

申请号：US17714943

申请日：2022-04-06

Applicant: Sanmina Corporation

Inventor： John Michael Dugan ,  Curtis Pastor ,  Mark Alt

IPC: G02B6/36 ,  G02B6/42

CPC classification number: G02B6/3604 ,  G02B6/4206

Abstract: An optical rotary joint includes a first annular portion and a second annular portion configured to rotate with respect to each other. Optical receivers on a receiver face of the second annular portion receive from optical transmit beam launchers on an emitter face of the first annular portion. The transmit beam launchers transmit optical signals to the optical receivers as the second annular portion rotates with respect to the first annular portion.

公开(公告)号：US11851211B2

公开(公告)日：2023-12-26

申请号：US17511509

申请日：2021-10-26

Applicant: Sanmina Corporation

Inventor： Max Edward Klein ,  David Porter ,  Walter Thomas Castleberry

IPC: B64F1/36 ,  G02B6/44 ,  G02B6/42 ,  B64C39/02 ,  H04B10/25 ,  H04B10/80 ,  B64U50/34 ,  B64U30/20

CPC classification number: B64F1/362 ,  B64C39/024 ,  B64U50/34 ,  G02B6/4292 ,  G02B6/4477 ,  H04B10/25 ,  H04B10/807 ,  B64U30/20 ,  B64U2201/20 ,  B64U2201/202 ,  G02B6/4457

Abstract: Aspects of the present disclosure are related unmanned aerial vehicles tethered to ground stations with an expendable airborne fiber-optic link. The tethers may be fiber-optic cables that can be used as a communications conduit between a ground station and a UAV for providing vehicle positioning/control information to the UAV as well as transmitting a large amount of information/data to the UAV. As the information being transmitted between to the UAV the ground station is critical, fiber-optic cables provide the bandwidth and transmission capabilities required with the added benefit of electromagnetic interference (EMI) and radio-frequency interference (RFI) immunity, making this an ideal solution for these applications.