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公开(公告)号：US11714011B2
公开(公告)日：2023-08-01
申请号：US16843659
申请日：2020-04-08
Applicant: TEXAS INSTRUMENTS INCORPORATED
Abstract: A system comprises a member to receive a mechanical force, and a sensor to sense the mechanical force. The sensor is mounted on the member using a set of nanoparticles and a set of nanowires coupled to the set of nanoparticles.
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公开(公告)号：US20220384252A1
公开(公告)日：2022-12-01
申请号：US17710139
申请日：2022-03-31
Applicant: TEXAS INSTRUMENTS INCORPORATED
Inventor： Scott Robert Summerfelt , Benjamin Stassen Cook , Sebastian Meier
IPC: H01L21/762
Abstract: A device includes a die with a protective overcoat and a substrate, the substrate comprising a first region and a second region that are spaced apart. The device also includes an isolation dielectric between the protective overcoat and the die. A pre-metal dielectric (PMD) barrier is between the isolation dielectric and the substrate, the PMD barrier having a first region that contacts the first region of the substrate and a second region that contacts the second region of the substrate, the first region and the second region of the PMD barrier being spaced apart. A through trench filled with a polymer dielectric extends between the first region and the second region of the substrate, and between the first region and the second region of the PMD barrier to contact the isolation dielectric.
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公开(公告)号：US11487206B2
公开(公告)日：2022-11-01
申请号：US16729919
申请日：2019-12-30
Applicant: Texas Instruments Incorporated
Inventor： Daniel Lee Revier , Sean Ping Chang , Benjamin Stassen Cook , Scott Robert Summerfelt
IPC: G03F7/16 , G03F7/30 , H01L23/00 , H01L21/266 , H01L21/308 , H01L21/027 , G03F7/095
Abstract: A microelectronic device is formed by dispensing discrete amounts of a mixture of photoresist resin and solvents from droplet-on-demand sites onto a wafer to form a first photoresist sublayer, while the wafer is at a first temperature which allows the photoresist resin to attain less than 10 percent thickness non-uniformity. The wafer moves under the droplet-on-demand sites in a first direction to form the first photoresist sublayer. A portion of the solvents in the first photoresist sublayer is removed. A second photoresist sublayer is formed on the first photoresist sublayer using the droplet-on-demand sites while the wafer is at a second temperature to attain less than 10 percent thickness non-uniformity in the combined first and second photoresist sublayers. The wafer moves under the droplet-on-demand sites in a second direction for the second photoresist sublayer, opposite from the first direction.
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公开(公告)号：US11387271B2
公开(公告)日：2022-07-12
申请号：US16716652
申请日：2019-12-17
Applicant: Texas Instruments Incorporated
Inventor： Scott Robert Summerfelt , Hassan Omar Ali , Benjamin Stassen Cook
IPC: H01L27/146
Abstract: In described examples an integrated circuit (IC) has multiple layers of dielectric material overlying at least a portion of a surface of a substrate. A trench is etched through the layers of dielectric material to expose a portion the substrate to form a trench floor, the trench being surrounded by a trench wall formed by the layers of dielectric material. A metal perimeter band surrounds the trench adjacent the trench wall, the perimeter band being embedded in one of the layers of the dielectric material.
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公开(公告)号：US11320453B2
公开(公告)日：2022-05-03
申请号：US16856488
申请日：2020-04-23
Applicant: TEXAS INSTRUMENTS INCORPORATED
Inventor： Scott Robert Summerfelt , Benjamin Stassen Cook
Abstract: A method includes measuring a first signal from a set of pyroelectric devices at a first temperature and measuring a second signal from a set of piezoelectric devices at a first acceleration. The method also includes measuring a third signal from the set of pyroelectric devices at a second temperature and measuring a fourth signal from the set of piezoelectric devices at a second acceleration. The method further includes adjusting a piezoelectric calibration using the first, second, third, and fourth signals.
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Patent Agency Ranking
公开(公告)号：US11195811B2
公开(公告)日：2021-12-07
申请号：US16843717
申请日：2020-04-08
Applicant: TEXAS INSTRUMENTS INCORPORATED
Inventor： Scott Robert Summerfelt , Benjamin Stassen Cook , Ralf Jakobskrueger Muenster , Sreenivasan Kalyani Koduri
IPC: H01L23/00
Abstract: In some examples, an electronic device comprises a first component having a surface, a second component having a surface, and a bond layer positioned between the surfaces of the first and second components to couple the first and second components to each other. The bond layer includes a set of metallic nanowires and a dielectric portion. The dielectric portion comprises a polymer matrix and dielectric nanoparticles.
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公开(公告)号：US11105681B2
公开(公告)日：2021-08-31
申请号：US16203536
申请日：2018-11-28
Applicant: Texas Instruments Incorporated
Inventor： Adam Joseph Fruehling , Benjamin Stassen Cook , Simon Joshua Jacobs , Juan Alejandro Herbsommer
Abstract: Millimeter wave energy is provided to a spectroscopy cavity of a spectroscopy device that contains interrogation molecules. The microwave energy is received after it traverses the spectroscopy cavity. The amount of interrogation molecules in the spectroscopy cavity is adjusted by activating a precursor material in one or more sub-cavities coupled to the spectroscopy cavity by a diffusion path to increase the amount of interrogation molecules or by activating the getter material in one or more sub-cavities coupled to the spectroscopy cavity by a diffusion path to decrease the amount of interrogation molecules.
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公开(公告)号：US20210200094A1
公开(公告)日：2021-07-01
申请号：US16729919
申请日：2019-12-30
Applicant: Texas Instruments Incorporated
Inventor： Daniel Lee Revier , Sean Ping Chang , Benjamin Stassen Cook , Scott Robert Summerfelt
IPC: G03F7/16 , G03F7/30 , H01L23/00 , H01L21/266 , H01L21/308 , H01L21/027
Abstract: A microelectronic device is formed by dispensing discrete amounts of a mixture of photoresist resin and solvents from droplet-on-demand sites onto a wafer to form a first photoresist sublayer, while the wafer is at a first temperature which allows the photoresist resin to attain less than 10 percent thickness non-uniformity. The wafer moves under the droplet-on-demand sites in a first direction to form the first photoresist sublayer. A portion of the solvents in the first photoresist sublayer is removed. A second photoresist sublayer is formed on the first photoresist sublayer using the droplet-on-demand sites while the wafer is at a second temperature to attain less than 10 percent thickness non-uniformity in the combined first and second photoresist sublayers. The wafer moves under the droplet-on-demand sites in a second direction for the second photoresist sublayer, opposite from the first direction.
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公开(公告)号：US11031364B2
公开(公告)日：2021-06-08
申请号：US15914761
申请日：2018-03-07
Applicant: Texas Instruments Incorporated
Inventor： Benjamin Stassen Cook , Daniel Lee Revier , Sadia Naseem , Mahmud Halim Chowdhury
IPC: H01L23/00
Abstract: In described examples, a microelectronic device includes a microelectronic die with a die attach surface. The microelectronic device further includes a nanoparticle layer coupled to the die attach surface. The nanoparticle layer may be in direct contact with the die attach surface, or may be coupled to the die attach surface through an intermediate layer, such as an adhesion layer or a contact metal layer. The nanoparticle layer includes nanoparticles having adjacent nanoparticles adhered to each other. The microelectronic die is attached to a package substrate by a die attach material. The die attach material extends into the nanoparticle layer and contacts at least a portion of the nanoparticles.
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公开(公告)号：US20210157130A1
公开(公告)日：2021-05-27
申请号：US17165895
申请日：2021-02-02
Applicant: Texas Instruments Incorporated
Abstract: An apparatus includes a mass detection circuit coupled to a surface covered with a plurality of electrodes. The mass detection circuit is configured to detect a mass of a first droplet present on the surface. The apparatus further includes a transducer circuit coupled to a transducer, which is coupled to the surface and form a lens unit. The transducer circuit configured to excite a first vibration of the surface at a resonant frequency to form a high displacement region on the surface. The apparatus also includes a voltage excitation circuit coupled to the plurality of electrodes. In response to the detection of the mass of the first droplet, the voltage excitation circuit is configured to apply a sequence of differential voltages on one or more consecutive electrodes which moves the first droplet to the high displacement region.
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