公开(公告)号：US08420210B2

公开(公告)日：2013-04-16

申请号：US11836963

申请日：2007-08-10

Applicant: Satoru Amou ,  Morimichi Umino ,  Akira Nagai ,  Yoshihiro Nakamura ,  Nobuyuki Minami

Inventor： Satoru Amou ,  Morimichi Umino ,  Akira Nagai ,  Yoshihiro Nakamura ,  Nobuyuki Minami

IPC: B32B27/04 ,  B32B27/12

CPC classification number: H05K1/032 ,  H05K1/024 ,  H05K3/4626 ,  H05K2201/012 ,  H05K2201/0158 ,  H05K2201/0209 ,  H05K2201/0239 ,  Y10T428/12569 ,  Y10T428/24917 ,  Y10T428/24994 ,  Y10T428/24995 ,  Y10T428/249951 ,  Y10T428/249952 ,  Y10T428/31645

Abstract: There are provided a resin composition comprising a crosslinking component with a weight average molecular weight of 1,000 or less having a plurality of styrene groups and represented by the following formula: wherein R is a hydrocarbon skeleton, each of R1s is a hydrogen atom or a hydrocarbon group, each of R2, R3 and R4 is a hydrogen atom or an alkyl group, m is an integer of 1 to 4, and n is an integer of 2 or more, at least one high-molecular weight compound, an inorganic filler, and at least one treating agent for said inorganic filler; its cured product; and a prepreg, a laminate sheet having a conductor layer, and a multilayer printed wiring board obtained by processing the conductor layer of the laminate sheet into wiring.

Abstract translation: 提供一种树脂组合物，其包含具有多个苯乙烯基团的重均分子量为1,000以下的交联组分，由下式表示：其中R为烃骨架，R 1为氢原子或烃 基团，R2，R3和R4各自为氢原子或烷基，m为1〜4的整数，n为2以上的整数，至少一种高分子化合物，无机填充剂， 和至少一种用于所述无机填料的处理剂; 其固化产品; 和预浸料，具有导体层的层叠片材和通过将层压片材的导体层加工成布线而获得的多层印刷布线板。

公开(公告)号：US20130075138A1

公开(公告)日：2013-03-28

申请号：US13240551

申请日：2011-09-22

Applicant: Li-Chih YU ,  Tse-An Lee

Inventor： Li-Chih YU ,  Tse-An Lee

IPC: H05K1/09 ,  C08K13/02 ,  B32B15/08 ,  C08L35/06 ,  C08L71/12 ,  C08L63/00 ,  C08K5/5399 ,  C08L79/00

CPC classification number: C08K3/0033 ,  C08G73/0655 ,  C08K3/013 ,  C08K3/26 ,  C08K3/36 ,  C08K5/09 ,  C08K5/3415 ,  C08K5/5399 ,  C08L35/06 ,  C08L63/00 ,  C08L71/12 ,  C08L79/04 ,  H05K1/0353 ,  H05K3/022 ,  H05K2201/012 ,  Y10T428/31692

Abstract: The halogen-free resin composition comprises (A)100 parts by weight of cyanate ester resin; (B) 5 to 50 parts by weight of styrene-maleic anhydride; (C) 5 to 100 parts by weight of polyphenylene oxide resin; (D) 5 to 100 parts by weight of maleimide; (E) 10 to 150 parts by weight of phosphazene; and (F) 10 to 1000 parts by weight of inorganic filler. By using specific components at specific proportions, the halogen-free resin composition of the invention offers the features of low dielectric constant, low dissipation factor, high heat resistance and high flame retardancy, and can be made into prepreg or resin film, and thereby used in copper clad laminate or printed circuit board.

Abstract translation: 无卤树脂组合物包含（A）100重量份氰酸酯树脂; （B）5〜50重量份苯乙烯 - 马来酸酐; （C）5〜100重量份聚苯醚树脂; （D）5〜100重量份的马来酰亚胺; （E）10〜150重量份的磷腈; 和（F）10〜1000重量份的无机填料。 通过使用特定比例的特定成分，本发明的无卤素树脂组合物具有低介电常数，低耗散因数，高耐热性和高阻燃性的特征，并且可以制成预浸料或树脂膜，由此使用 在铜箔层压板或印刷电路板上。

公开(公告)号：US20120308832A1

公开(公告)日：2012-12-06

申请号：US13577235

申请日：2011-01-19

Applicant: Yutaka Satou ,  Kazuo Arita ,  Ichirou Ogura

Inventor： Yutaka Satou ,  Kazuo Arita ,  Ichirou Ogura

IPC: C08G8/28 ,  B32B27/38 ,  C08G59/14

CPC classification number: H05K1/0326 ,  C08G8/08 ,  C08G8/12 ,  C08K5/13 ,  H05K2201/012 ,  Y10T428/31515 ,  C08L61/06

Abstract: A phenol resin composition used as a curing agent for an epoxy resin includes a naphthol novolac resin (a1) represented by general formula (1) (wherein R1 and R2 each independently represent a hydrogen atom, an alkyl group, or an alkoxy group, and n is a repeating unit and an integer of 1 or more), and a compound (a2) represented by general formula (2) (wherein R1 and R2 each independently represent a hydrogen atom, an alkyl group, or an alkoxy group), wherein the total ratio of compounds with n=1 and n=2 in the general formula (1) present in the composition is in the range of 10 to 35%, the average of n in the general formula (1) is in the range of 3.0 to 7.0, and the content of the compound (a2) in the composition is 1 to 6%.

Abstract translation: 用作环氧树脂固化剂的酚醛树脂组合物包括由通式（1）表示的萘酚酚醛清漆树脂（a1）（其中R1和R2各自独立地表示氢原子，烷基或烷氧基，和 n为重复单元，1以上的整数）和通式（2）表示的化合物（a2）（式中，R 1和R 2各自独立地表示氢原子，烷基或烷氧基），式 存在于组合物中的通式（1）中n = 1且n = 2的化合物的总比例在10〜35％的范围内，通式（1）中n的平均值在 3.0〜7.0，组合物中化合物（a2）的含量为1〜6％。

公开(公告)号：US20110303439A1

公开(公告)日：2011-12-15

申请号：US13203209

申请日：2010-01-18

Applicant: Shingo Kaimori ,  Jun Sugawara ,  Akira Mizoguchi ,  Syougo Asai ,  Takuma Yoshisaka ,  Naota Uenishi

Inventor： Shingo Kaimori ,  Jun Sugawara ,  Akira Mizoguchi ,  Syougo Asai ,  Takuma Yoshisaka ,  Naota Uenishi

IPC: H05K1/02 ,  C09J163/02 ,  C09J11/06 ,  C09J167/00 ,  C09J177/00 ,  B32B7/12 ,  C09J185/02

CPC classification number: C09J177/00 ,  C08G59/304 ,  C08G59/3272 ,  C08K5/0066 ,  C08K5/3437 ,  C08K5/353 ,  C08K5/5399 ,  C08L63/00 ,  C08L67/00 ,  C08L77/00 ,  C08L2666/22 ,  C09J7/35 ,  C09J163/00 ,  C09J167/00 ,  C09J2203/326 ,  C09J2205/102 ,  C09J2463/00 ,  C09J2477/00 ,  H05K1/0393 ,  H05K3/386 ,  H05K2201/012 ,  H05K2201/0129 ,  Y10T428/287

Abstract: Provided are an adhesive composition that is halogen-free and that can satisfy flame retardancy without impairing adhesiveness or solder heat resistance, and a laminate and a flexible printed wiring board using the same. The adhesive resin composition contains an epoxy resin; a thermoplastic resin; a benzoxazine compound; a halogen-free flame retardant; and a curing agent, in which at least one of the epoxy resin and the thermoplastic resin contains a phosphorus-containing resin, and the phosphorus content in the solid portion of the adhesive resin composition is 2.5% by mass or more. Preferably, a phosphorus-containing epoxy resin is used as the epoxy resin, a thermoplastic resin containing 10% to 70% by mass of a phosphorus-containing polyester is used as the thermoplastic resin, and the amount of benzoxazine is 5 to 25 parts by mass and the amount of halogen-free flame retardant is 1 to 30 parts by mass per 100 parts of the resins.

Abstract translation: 提供一种无卤素的粘合剂组合物，并且可以在不损害粘合性或焊料耐热性的情况下满足阻燃性，以及层压体和使用其的柔性印刷线路板。 粘合剂树脂组合物含有环氧树脂; 热塑性树脂; 苯并恶嗪化合物; 无卤阻燃剂; 以及固化剂，其中至少一种环氧树脂和热塑性树脂含有含磷树脂，并且粘合剂树脂组合物的固体部分中的磷含量为2.5质量％以上。 优选使用含磷环氧树脂作为环氧树脂，使用含有10〜70质量％的含磷聚酯的热塑性树脂作为热塑性树脂，苯并恶嗪的量为5〜25重量份 质量和无卤阻燃剂的量为每100份树脂1至30质量份。

公开(公告)号：US08062455B2

公开(公告)日：2011-11-22

申请号：US11910314

申请日：2006-03-21

Applicant: Dave Tsuei

Inventor： Dave Tsuei

IPC: B32B27/00 ,  C07F7/00 ,  C08K5/00 ,  C08G65/48 ,  C08L71/12

CPC classification number: C08L63/00 ,  C08G59/184 ,  C08K5/56 ,  C08L79/04 ,  H05K1/0373 ,  H05K2201/012 ,  H05K2201/0209 ,  H05K2203/121 ,  H05K2203/124 ,  C08L2666/22

Abstract: The instant invention relates to compositions comprising a benzoxazine resin and an advancement resin based on bisphenol A diglycidyl ether and bisphenol S and, optionally, ferrocene and aluminium trihydrate. Such compositions are, when cured to form polymeric networks, difficultly inflammable and resistant to high temperatures. Such compositions may especially be used in the production of printed wiring boards.

Abstract translation: 本发明涉及包含苯并恶嗪树脂和基于双酚A二缩水甘油醚和双酚S的进料树脂和任选的二茂铁和三水合铝的组合物。 当固化形成聚合物网络时，这样的组合物难以易燃并且耐高温。 这样的组合物可以特别用于生产印刷线路板。

公开(公告)号：US20110132646A1

公开(公告)日：2011-06-09

申请号：US12793353

申请日：2010-06-03

Applicant: Sergei V. Levchik ,  Fabienne Samyn

Inventor： Sergei V. Levchik ,  Fabienne Samyn

IPC: H05K1/03 ,  C08L63/02 ,  B29C65/02

CPC classification number: H05K1/0373 ,  B32B2038/0076 ,  B32B2305/076 ,  B32B2307/3065 ,  B32B2457/08 ,  C08G59/4071 ,  C08G59/688 ,  C08J5/24 ,  C08J2363/00 ,  H05K2201/012

Abstract: There is provided herein a curable epoxy resin composition comprising at least one brominated epoxy resin, at least one flame retardant curing agent, and at least one curing catalyst.

Abstract translation: 本文提供了包含至少一种溴化环氧树脂，至少一种阻燃固化剂和至少一种固化催化剂的可固化环氧树脂组合物。

公开(公告)号：US07951878B2

公开(公告)日：2011-05-31

申请号：US11916435

申请日：2006-12-12

Applicant: Berthold Just ,  Holger Keller ,  Manfred Doering ,  Uwe Storzer ,  Sebastian Seibold

Inventor： Berthold Just ,  Holger Keller ,  Manfred Doering ,  Uwe Storzer ,  Sebastian Seibold

IPC: C08G59/40 ,  C08G59/00 ,  C08G79/06 ,  C08G79/00

CPC classification number: C08G59/4007 ,  C08G59/3254 ,  H05K1/0326 ,  H05K2201/012

Abstract: The invention relates to a method for preparing halogen-free flameproof epoxy resins, in which a halogen-free epoxy resin is reacted with a polyfunctional aldehyde or ketone and a phosphinic acid derivative, wherein the phosphinic acid derivative contains at least one P—H-active structural unit of the formula ═PH(O) and is used in an amount equivalent to the polyfunctionality of the aldehyde or ketone, to a halogen-free flameproof epoxy resin obtainable by this method, to the use of the epoxy resin as a base material for the manufacture of printed circuit boards and printed circuits and to intermediates used to prepare the epoxy resins.

Abstract translation: 本发明涉及一种制备无卤素防火环氧树脂的方法，其中无卤环氧树脂与多官能醛或酮和次膦酸衍生物反应，其中次膦酸衍生物含有至少一个P-H- 使用式=PH（O）的活性结构单元，并且以与醛或酮的多官能度相当的量使用该方法获得的无卤素防火环氧树脂，以环氧树脂为基础 用于制造印刷电路板和印刷电路的材料以及用于制备环氧树脂的中间体。

公开(公告)号：US07858173B2

公开(公告)日：2010-12-28

申请号：US12593345

申请日：2008-03-24

Applicant: Masao Gunji ,  Chiaki Asano

Inventor： Masao Gunji ,  Chiaki Asano

IPC: B32B27/04

CPC classification number: H05K1/0326 ,  C08G59/1422 ,  C08G59/4071 ,  C08G59/621 ,  C08G2650/56 ,  C08L71/00 ,  C09J163/00 ,  H01B3/427 ,  H05K2201/012 ,  H05K2201/0129 ,  Y10T428/24917 ,  Y10T428/249924 ,  Y10T428/24994 ,  Y10T428/28 ,  Y10T428/287 ,  Y10T428/31529

Abstract: A novel flame-retardant thermoplastic polyhydroxy polyether resin obtained by reacting at least one epoxy resin (A) selected from glycidyl esters of divalent aliphatic carboxylic acids having 15 to 64 carbon atoms or glycidyl ethers of divalent aliphatic alcohols having 15 to 64 carbon atoms with a phosphorus atom-containing divalent phenol compound (B) as essential components, wherein the component (A) accounts for 2 to 52 mol % with respect to the whole resin, the weight average molecular weight thereof is 10,000 to 200,000, and the phosphorus content thereof is 1 to 5 wt %.

Abstract translation: 通过使选自碳原子数为15〜64的二价脂肪族羧酸的缩水甘油酯或碳原子数为15〜64的二价脂肪醇的缩水甘油醚的至少一种环氧树脂（A）与碳原子数为15〜64的二元脂肪醇的缩水甘油醚反应而得到的新型阻燃热塑性多羟基聚醚树脂 含磷原子的二价酚化合物（B）为必须成分，其中，成分（A）相对于整个树脂为2〜52摩尔％，重均分子量为10,000〜200,000，其磷含量 为1〜5重量％。

公开(公告)号：US20100314160A1

公开(公告)日：2010-12-16

申请号：US12483166

申请日：2009-06-11

Applicant: Daniel Chang ,  Sam Najjar

Inventor： Daniel Chang ,  Sam Najjar

IPC: H05K1/03 ,  C08K5/521 ,  C08K5/3492 ,  B32B17/04 ,  B32B27/36 ,  B32B27/34 ,  B32B27/06 ,  C08J5/24

CPC classification number: H01B3/40 ,  C08J5/24 ,  C08J2379/04 ,  C08K3/36 ,  C08K5/523 ,  C08L79/04 ,  H05K1/0298 ,  H05K1/03 ,  H05K1/0353 ,  H05K1/0373 ,  H05K2201/012 ,  Y10T428/249955 ,  Y10T428/31511 ,  Y10T428/31525 ,  Y10T428/31529 ,  Y10T428/31721 ,  Y10T428/31725 ,  Y10T428/31786 ,  Y10T428/31931 ,  Y10T442/20 ,  Y10T442/2475

Abstract: In accordance with the present invention compositions are described which are useful, for example, for the preparation of metal-clad laminate structures, methods for the preparation thereof, and various uses therefor. Invention metal-clad laminate structures are useful, for example, multi-layer board (MLB) industry, in the preparation of burn-in test boards and high reliability boards, applications where low coefficient of thermal expansion (CTE) is beneficial, in the preparation of boards used in down-hole drilling, and the like.

Abstract translation: 根据本发明，描述了组合物，其可用于例如制备覆金属层压板结构体，其制备方法及其各种用途。 本发明的金属包覆层压结构在例如多层板（MLB）工业中可用于制备老化测试板和高可靠性板，其中低热膨胀系数（CTE）有利的应用在 在井下钻孔中使用的板的制备等。

公开(公告)号：US20100273003A1

公开(公告)日：2010-10-28

申请号：US12438132

申请日：2007-09-20

Applicant: Akihiko Tobisawa

Inventor： Akihiko Tobisawa

IPC: B32B27/38 ,  C08L63/00

CPC classification number: H05K1/0353 ,  C08G59/3218 ,  C08G59/38 ,  C08G59/5086 ,  C08J5/24 ,  C08J2363/00 ,  C08L63/00 ,  H05K2201/012 ,  Y10T428/31511 ,  Y10T428/31529

Abstract: A resin composition used to prepare a sheet-like prepreg by impregnating a substrate with the resin composition includes an epoxy resin that contains a naphthalene-modified epoxy resin, and a triazine-modified novolac resin. A sheet-like prepreg is formed by impregnating a substrate with the resin composition. A laminate formed using the prepreg exhibits excellent flame retardancy, solder heat resistance, and lead-free heat resistance, has a small coefficient of linear expansion in the thickness direction, and has excellent adhesion to a conductor circuit.

Abstract translation: 用于通过用树脂组合物浸渍基材来制备片状预浸料的树脂组合物包括含有萘改性环氧树脂的环氧树脂和三嗪改性酚醛清漆树脂。 通过用树脂组合物浸渍基材来形成片状预浸料。 使用该预浸料形成的层压体具有优异的阻燃性，焊料耐热性和无铅耐热性，在厚度方向上的线膨胀系数小，对导体电路的粘附性优异。