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公开(公告)号:US20200214285A1
公开(公告)日:2020-07-09
申请号:US16638580
申请日:2018-08-08
Applicant: ADEKA CORPORATION
Inventor: Yasuhiro TSUSHIMA , Hiroshi SUZUKI , Makiko YAZAWA , Shotan YAMASHITA
Abstract: Provided is an antibacterial and antifungal composition, including: (A) at least one kind of 1,2-alkanediol having a linear alkyl group containing 6 to 8 carbon atoms; (B) at least one kind of monoalkyl glyceryl ether having a linear alkyl group containing 6 to 8 carbon atoms, a branched alkyl group containing 6 to 8 carbon atoms, or a cycloalkyl group containing 6 to 8 carbon atoms; and (C) at least one kind of aromatic alcohol represented by the following general formula (1): wherein n represents a natural number of from 1 to 4.
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152.
公开(公告)号:US20200207950A1
公开(公告)日:2020-07-02
申请号:US16609832
申请日:2019-01-28
Applicant: ADEKA CORPORATION
Inventor: Takuya FUKUDA , Yuri YOKOTA
Abstract: A particulate nucleating agent of the present invention is a particulate nucleating agent including a predetermined aromatic phosphate metal salt, in which a content of aliphatic amine is equal to or more than 3 ppm and equal to or less than 190 ppm based on a mass of the entirety of the particulate nucleating agent.
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公开(公告)号:US20200165448A1
公开(公告)日:2020-05-28
申请号:US16638241
申请日:2018-08-22
Applicant: ADEKA CORPORATION
Inventor: Yang NI , Yutaka YONEZAWA , Naoko TANJI
IPC: C08L75/04 , C08K5/52 , C08K3/26 , C08K3/22 , C08K5/1515 , C08L83/04 , C08K5/10 , C08L23/12 , C08K5/3492 , C08K5/3462
Abstract: A composition contains the following components (A), (B), and (C), the component (A) being at least one melamine salt selected from the group consisting of melamine orthophosphate, melamine pyrophosphate, and melamine polyphosphate, the component (B) being at least one piperazine salt selected from the group consisting of piperazine orthophosphate, piperazine pyrophosphate, and piperazine polyphosphate, and the component (C) being a monohydrate of alumina. As disclosed, it is possible to provide a composition that can impart excellent levels of processability/moldability and flame retardancy to a resin by being mixed with the resin.
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公开(公告)号:US20200148954A1
公开(公告)日:2020-05-14
申请号:US16629134
申请日:2018-06-14
Applicant: ADEKA CORPORATION
Inventor: Yang NI , Yohei INAGAKI , Yutaka YONEZAWA , Naoko TANJI
Abstract: A composition includes first, second, and third components. The composition preferably includes 0.1 to 50 parts by mass of the third component with respect to 100 parts by mass in total of the first and second components. The first component is at least one type of melamine salt selected from the group consisting of melamine orthophosphate, melamine pyrophosphate, and melamine polyphosphate. The second component is at least one type of piperazine salt selected from the group consisting of piperazine orthophosphate, piperazine pyrophosphate, and piperazine polyphosphate. The third component is cyanuric acid or zinc cyanurate.
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公开(公告)号:US10508194B2
公开(公告)日:2019-12-17
申请号:US15540085
申请日:2016-01-21
Applicant: ADEKA CORPORATION
Inventor: Tatsuya Shimizu , Yang Ni , Kei Asai , Yutaka Yonezawa , Shinichi Ishikawa
IPC: C08L23/00 , C08K3/22 , C08K7/14 , C08K5/3462 , C08K5/3492
Abstract: Provided are a flame-retardant polyolefin resin composition with high flame retardancy, particularly sufficient flame retardancy to meet the UL94 5VA standard and a molded article with high flame retardancy, particularly sufficient flame retardancy to meet the UL94 5VA standard. The composition includes 100 parts by mass of a polyolefin resin, (A) 10 to 60 parts by mass of at least one melamine salt selected from the group consisting of melamine orthophosphate, melamine pyrophosphate, and melamine polyphosphate, (B) 15 to 90 parts by mass of at least one piperazine salt selected from the group consisting of piperazine orthophosphate, piperazine pyrophosphate, and piperazine polyphosphate, and (C) 10 to 140 parts by mass of glass fiber.
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公开(公告)号:US20190322816A1
公开(公告)日:2019-10-24
申请号:US16462981
申请日:2017-12-18
Applicant: ADEKA CORPORATION
Inventor: Atsushi KOBAYASHI , Ryo TANIUCHI , Tomoaki SAIKI
Abstract: A solution is prepared that contains (A) a polymer compound that includes at least one of a hydrolyzable polymer compound or a thermally-decomposable polymer compound, (B) an oxoacid-based compound that includes at least one of a phosphate-based compound, a sulfate-based compound, a sulfonate-based compound, or a perchlorate-based compound, and (C) a laminate of layered substances, and the solution is irradiated with at least one of sonic waves or radio waves, or the solution is heated.
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157.
公开(公告)号:US20190294044A1
公开(公告)日:2019-09-26
申请号:US16465097
申请日:2017-11-29
Applicant: ADEKA CORPORATION
Inventor: Taiki MIHARA , Junya MIYAKE , Naomi SATO
Abstract: Provided are: a positive photosensitive composition that exhibits excellent sensitivity at a time of being cured; a pattern using the same; and a method of producing a pattern. The positive photosensitive composition contains: a sulfonic acid derivative compound (A) represented by Formula (I) below, where X1 represents a linear or branched alkyl group having 1 to 14 carbon atoms or the like; and R1 represents a group represented by an aliphatic hydrocarbon group, an aryl group, an arylalkyl group, an acyl group-substituted aryl group, an alicyclic hydrocarbon group or the like, which aliphatic hydrocarbon group, aryl group or arylalkyl group has no substituent or is optionally substituted with a halogen atom or the like; and a polymer compound (B) required to contain a structural unit represented by Formula (III) below, where R5 represents a hydrogen atom or a methyl group; R6 represents an alkyl group having 1 to 4 carbon atoms or the like; f represents a number of 0 to 4; and symbols “*” mean that this group is bound with adjacent groups at the sites “*”:
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公开(公告)号:US10421261B2
公开(公告)日:2019-09-24
申请号:US15547090
申请日:2016-01-26
Applicant: ADEKA CORPORATION
Inventor: Takeshi Endo , Kozo Matsumoto , Ken-ichi Tamaso , Chihiro Asakura , Ryo Ogawa
IPC: B32B27/38 , B32B27/26 , C08G59/40 , C08K5/5313 , C08L63/00 , C08J5/24 , C08K5/5398 , C08K5/5399 , C08K5/00 , B32B15/092 , C07F9/32
Abstract: A flame-retardant epoxy resin composition wherein (A) epoxy resin, (B) a curing agent and (C) a phosphorous-containing compound expressed by the following general formula (1) are contained; a prepreg using the same and a laminated plate using said prepreg; wherein m expresses an integer from 2 to 10, R1 and R2 each independently express an alkyl group or an aryl group, R3 expresses a hydrocarbon group that may contain an oxygen atom, a sulfur atom or a nitrogen atom, X expresses an oxygen atom or a sulfur atom, Y expresses an oxygen atom, a sulfur atom or —NR4—, and in this regard, R4 expresses a hydrogen atom, an alkyl group or an aryl group.
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公开(公告)号:US10385162B2
公开(公告)日:2019-08-20
申请号:US15537114
申请日:2015-11-19
Applicant: ADEKA CORPORATION
Inventor: Tatsuhito Nakamura , Kazukiyo Nomura
IPC: C08G63/16 , C08L23/00 , C08L67/02 , C08G59/22 , C08G65/08 , C08K3/34 , C08L23/08 , C08L23/10 , C08L23/14 , C08L77/02
Abstract: Provided: polyolefin resin composition excellent in antistatic properties with sufficient persistence and wiping resistance, without impairment of intrinsic mechanical properties; and an automotive interior/exterior material containing the same. The polyolefin resin composition contains: 50 to 90 parts by mass of polyolefin resin; 3 to 40 parts by mass of thermoplastic elastomer; 3 to 30 parts by mass of filler, and an antistatic agent of a polymer compound (E) in an amount of 3 to 20 parts by mass with respect to a total amount of 100 parts by mass of the polyolefin resin, thermoplastic elastomer and filler, wherein the polymer compound (E) has a structure in which a diol, an aliphatic dicarboxylic acid, an aromatic dicarboxylic acid, a compound (B) containing at least one group of Formula (1) and having hydroxyl groups at both ends, and an epoxy compound (D) having two or more epoxy groups are bound via ester bonds: —CH2—CH2—O— (1).
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公开(公告)号:US10344191B2
公开(公告)日:2019-07-09
申请号:US15312736
申请日:2015-05-22
Applicant: DENSO CORPORATION , ADEKA CORPORATION
Inventor: Kenji Koga , Daisuke Takama , Ryo Ogawa , Shinsuke Yamada , Takuya Matsuda
Abstract: Provided is a photocurable adhesive with which curing by direct irradiation of laser light is possible with almost no occurrence of surface carbonization and which is capable of satisfactory curing even when the coating thickness is increased. A photocurable adhesive, which is cured by irradiation of laser light, is provided. The curable adhesive contains an epoxy adhesive component, a light-absorbing component for thermal curing of the epoxy adhesive component by absorption of laser light, and an inorganic filler. The content of the light-absorbing component is 0.1 mass % or less. The pre-curing thermal conductivity of the photocurable adhesive is at least 0.2 W/m·K and the post-curing thermal conductivity is at least 0.5 W/m·K.
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