Abstract:
The invention relates to a method of contacting two components to form a pressure-sensitive adhesive (PSA) construction, wherein the first component comprises a conventional PSA modified with an alkoxy-functional silicon compound and the second component comprises the same PSA modified with a cure agent for the alkoxy-functional silicon compound. The method provides improved adhesive bond strength over the unmodified PSA which generally increases with time.
Abstract:
At least three, and as many as eighteen, most preferably at least nine, crosslinking sites are provided through the alkoxy groups in multiple chains on a triazine ring (hence "multisilane"), on a single molecule of the multisilane. The multisilane, useful as a coupling agent, is formed by reacting a triazine-containing compound with a suitable aminoalkyl-alkoxysilane, or, alkyl-aminoalkyl-alkoxysilane in either an anhydrous, or an aqueous liquid medium. A size containing the multisilane, enhances the reinforced properties of organic synthetic resinous materials in which the fibers are used, and most particularly those of rigid poly(vinyl chloride) (PVC) with which it provides cohesive bonding of glass fiber surfaces. Glass fibers coated with a basic film former and the multisilane are covalently bonded on the one hand through some of at least nine alkoxy groups on each of the multisilane molecules, to Si atoms of a glass surface, and on the other hand, through at least some of the amine groups on each of the molecules, to the vinyl chloride (VC) resin in a reaction which involves allylic chloride bonds in the VC resin. The multisilane is effective in adhesives for a wide variety of materials, and in protective coatings.
Abstract:
Electrically conductive adhesive material possessing good adhesive, cohesive, elastomeric and conductive properties is disclosed. The present adhesive material also has improved electrical stability since it is less susceptible to drying out in most ambients. The material comprises a plasticizer, a high molecular weight water-soluble polymer, uncrosslinked polyvinylpyrrolidone as the tackifier, and an electrolyte dopant.
Abstract:
Cohesive flexible curable adhesive coatings formed from a dispersion of first and second powdered curing components, preferably reactive at ambient temperatures, in a solution of a binder, the binder content being not more than 15%, preferably not more than 2.5% by weight of the dried composition. Also claimed are curable compositions having a specific advantageous reactive particle size distribution; specific epoxy-amine adduct curing agents; and specific polyalkylene oxide binders.
Abstract:
A composition for fixing metal powder molding at sintering, which is used, in the case of disposing a metal powder molding formed by rolling a mixture of a metal powder and a synthetic resin-based binder on a metal base material and sintering the metal powder molding in a non-oxidizing atmosphere, to adhere and fix the metal powder molding onto the base material until the metal powder molding is sintered by interposing between the metal powder molding and the base material, comprising a thermosetting resin composition containing a mixture of a thermosetting resin and at least one member selected from the group consisting of a metal fine powder, a thermoplastic resin and an adhesive material, wherein the amount of the residual carbon of the composition after completion of sintering is at least about 0.5% by weight.
Abstract:
Improved bonding agent comprises a reaction product or mixture of an epoxyalkylalkoxysilane and a polyamine, and a resin composition comprising as the main ingredient conventional synthetic resin or synthetic rubber and the bonding agent as set forth above, which has excellent adhesion, particularly durability of adhesion, and is useful as an adhesive or a paint.
Abstract:
Adhesive dispersions for tiling, based on(1) 10-95% by weight of a water-dilutable, cellulose nitrate-containing paste with a weight ratio of solids to solvent .gtoreq.1,(2) 0.1-50% by weight of an adhesive resin dispersion or an adhesive resin which can be emulsified in H.sub.2 O,(3) 0-70% by weight of a tile adhesive filler,(4) 0-75% by weight of water,(5) 0-10% by weight of a conventional thickener.
Abstract:
A film forming dispersion for the heat sealing of dissimilar substrate said dispersion comprising at least two different types of polymers having different adhesive properties in an organic solvent system, at least one of the polymer types being fully miscible at room temperature with the organic solvent system, both of said two polymer types having an acid number ranging from 0 to 160 mg KOH per gram of polymer, and said dispersion further containing a third graft polymer containing components corresponding to said two different polymer types.
Abstract:
A one-component adhesive for metal surfaces such as iron, zinc, copper, cadmium and their alloys will cure upon contact with the metal surface. The adhesive composition includes olefinically unsaturated monomer; reactive or non-reactive polymer; an acidic material; a compound containing sulfonyl halide group; and a compound containing a transition metal. The adhesive composition cures rapdily upon contact with a metal surface to form an adhesive bond between the surfaces. The adhesive composition is especially useful as a thread-lock adhesive, and as an adhesive for bonding structural components.
Abstract:
This invention provides pressure sensitive adhesive (PSA) compositions comprising a copolymer having a vinyl polymeric backbone having grafted thereto polysiloxane moieties. The compositions may contain other ingredients such as tackifier and/or plasticizer. An exposed surface of the PSA composition is initially positionable on a substrate to which it will be adhered but, once adhered, builds adhesion to form a strong bond. The PSA compositions may be used alone or in blends with unsiliconized PSA compositions. The invention also provides sheet materials coated with the PSA composition such as tape, labels, etc.