公开(公告)号：US07738248B2

公开(公告)日：2010-06-15

申请号：US12330266

申请日：2008-12-08

Applicant: Kentaro Tomioka

Inventor： Kentaro Tomioka

IPC: H05K7/20 ,  H01L23/36

CPC classification number: G06F1/203 ,  G06F2200/201 ,  H01L2924/0002 ,  H01L2924/00

Abstract: According to one embodiment, an electronic device includes a heat generating part housed inside a cabinet and a loop heat pipe housed inside the cabinet, which includes an internal flow path having a loop shape in which a working fluid is sealed. The loop heat pipe further includes a heat receiving unit, a heat radiating unit, a vapor flow path which allows a gasified portion of the working fluid to flow from the heat receiving unit towards the heat radiating unit, a liquid returning flow path which allows a liquefied portion of the working fluid to flow from the heat radiating unit towards the heat receiving unit, and a wick provided at a position adjacent to the vapor flow path inside the liquid returning flow path. The wick also serves as a partition portion which partitions the vapor flow path and the liquid returning flow path from each other.

Abstract translation: 根据一个实施例，电子设备包括容纳在机壳内部的发热部分和容纳在机壳内的回路热管，其包括具有工作流体被密封的环形的内部流路。 回路热管还包括热接收单元，散热单元，允许工作流体的气化部分从热接收单元朝向散热单元流动的蒸气流路，允许 工作流体的液化部分从热辐射单元朝向热接收单元流动，并且设置在与返回液流路径内部的蒸气流路相邻的位置处的芯。 芯也用作将蒸气流路和液体返回流路彼此隔开的分隔部。

公开(公告)号：US07724518B1

公开(公告)日：2010-05-25

申请号：US12146281

申请日：2008-06-25

Applicant: Andrew B. Carlson ,  William Hamburgen ,  Jimmy Clidaras ,  Wolf-Dietrich Weber ,  Xiaobo Fan

Inventor： Andrew B. Carlson ,  William Hamburgen ,  Jimmy Clidaras ,  Wolf-Dietrich Weber ,  Xiaobo Fan

IPC: H05K7/20 ,  G06F1/20 ,  E04C2/52

CPC classification number: G06F1/189 ,  G06F1/20 ,  G06F2200/201 ,  H05K7/20745

Abstract: A facility is described that includes one or more enclosures defining an interior space, a plurality of power taps, a plurality of coolant supply taps, and a plurality of coolant return taps. A flow capacity of the supply taps and a flow capacity of the return taps can be approximately equal over a local area of the interior space. The plurality of power taps, the plurality of supply taps, and the plurality of return taps can be divided into a plurality of zones, with taps of each zone are configured to be controllably coupled to a power source or a coolant source independently of the taps of other zones. The taps can be positioned along paths, and paths of the power taps can be spaced from associated proximate paths of supply and return taps by a substantially uniform distance along a substantial length of the first path.

Abstract translation: 描述了一种设备，其包括限定内部空间的一个或多个外壳，多个电源抽头，多个冷却剂供给开关和多个冷却剂返回抽头。 供应水龙头的流量和返回水龙头的流量可以在内部空间的局部区域上大致相等。 多个电源抽头，多个供给抽头和多个返回抽头可以被分成多个区域，每个区域的抽头被配置为独立于抽头而被可控地耦合到电源或冷却剂源 的其他区域。 水龙头可以沿着路径定位，并且功率水龙头的路径可以与相关联的供应和返回水龙头的近似路径间隔开沿着第一路径的实质长度的基本均匀的距离。

公开(公告)号：US07724517B2

公开(公告)日：2010-05-25

申请号：US12098559

申请日：2008-04-07

Applicant: Chad Daniel Attlesey ,  R. Daren Klum ,  Allen James Berning

Inventor： Chad Daniel Attlesey ,  R. Daren Klum ,  Allen James Berning

IPC: H05K5/00 ,  H05K5/06 ,  H05K1/00 ,  H01L23/34 ,  F28F7/00

CPC classification number: G06F1/20 ,  G06F1/181 ,  G06F2200/201 ,  H01L23/427 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A case for a liquid submersion cooled computer includes a plurality of walls defining a liquid-tight interior space. At least a portion of one of the walls is made of a material that permits viewing of objects, for example, a motherboard, within the interior space. A removable lid closes the top of the interior space. The lid forms a liquid-tight seal with the plurality of walls, and the lid includes a sealed electrical connector fixed thereto that is configured to attach to the motherboard disposed in the interior space and to provide electrical connection between the motherboard and an exterior of the case. The case can include a drain valve for draining liquid from the case. Further, the lid can have an opening for introducing liquid into the interior space, and a handle to facilitate lifting of the lid along with the motherboard connected to the lid.

Abstract translation: 用于液体浸没冷却计算机的壳体包括限定液密内部空间的多个壁。 其中一个壁的至少一部分由允许在内部空间内观察物体（例如，主板）的材料制成。 可拆卸的盖子封闭内部空间的顶部。 盖与多个壁形成液密密封，并且盖包括固定到其上的密封电连接器，其被配置为附接到设置在内部空间中的母板并且提供母板与外壳之间的电连接 案件。 壳体可以包括用于从壳体排出液体的排水阀。 此外，盖子可以具有用于将液体引入内部空间的开口，以及用于便于与连接到盖子的母板一起提起盖子的手柄。

公开(公告)号：US07660116B2

公开(公告)日：2010-02-09

申请号：US12107010

申请日：2008-04-21

Applicant: Alan Claassen ,  Eric Alan Eckberg ,  Dennis John Hansen ,  Vinod Kamath ,  Madhusudan K. Iyengar ,  Howard Victor Mahaney, Jr. ,  Michael Sven Miller ,  Stephen Peter Mroz

Inventor： Alan Claassen ,  Eric Alan Eckberg ,  Dennis John Hansen ,  Vinod Kamath ,  Madhusudan K. Iyengar ,  Howard Victor Mahaney, Jr. ,  Michael Sven Miller ,  Stephen Peter Mroz

IPC: H05K7/20

CPC classification number: G06F1/20 ,  G06F2200/201 ,  H05K7/20736 ,  H05K7/2079 ,  Y10T29/49826

Abstract: Rack assemblies and methods for cooling one or more rack-based computer systems, as well as data center configurations that utilize the rack assembly. The rack assembly comprises a rack providing support for multiple columns of heat-generating electronic devices and device fans for moving air from an air inlet side of the rack through the devices and through an air outlet side of the rack. The rack assembly also comprises a unitary door having a support frame spanning the air outlet side of the rack and hingedly coupling the door to a rear vertical edge of the rack. The door includes an air-to-liquid heat exchanger panel spanning an air outlet passage inside the support frame so that substantially all of the air passing through the air outlet must pass through the heat exchanger panel. The air outlet passage has a cross-sectional area that is substantially equal to or greater than the cross-sectional area of the multiple columns of heat-generating devices.

Abstract translation: 用于冷却一个或多个基于机架的计算机系统的机架组件和方法，以及利用机架组件的数据中心配置。 机架组件包括一个支架，用于支撑多列发热电子设备和设备风扇，用于将空气从机架的空气入口侧移动穿过设备并通过机架的空气出口侧。 机架组件还包括一个整体门，其具有横跨机架的空气出口侧的支撑框架，并将门铰接地连接到机架的后垂直边缘。 门包括空气到液体的热交换器面板，其横跨支撑框架内的空气出口通道，使得通过出气口的空气基本上必须通过热交换器面板。 空气出口通道的横截面积基本上等于或大于多列发热装置的横截面面积。

公开(公告)号：US07649737B2

公开(公告)日：2010-01-19

申请号：US11723207

申请日：2007-03-16

Applicant: Toshihiko Matsuzawa ,  Mitsuo Okimoto ,  Sadayuki Nishimura ,  Yoshie Kodera ,  Nobuo Masuoka

Inventor： Toshihiko Matsuzawa ,  Mitsuo Okimoto ,  Sadayuki Nishimura ,  Yoshie Kodera ,  Nobuo Masuoka

IPC: H05K7/20

CPC classification number: G06F1/20 ,  G06F2200/201 ,  H05K7/20963

Abstract: The invention provides a technique enabling an image of high quality to be displayed while decreasing an effect of an outside light proceeding toward a back surface of PDP through a through hole for mounting an electric circuit on a chassis. A flat panel display of the invention includes a display panel, a metallic chassis having a through hole and joints for connecting the back surface of the display panel and the chassis to each other. The joints are on the back surface of the display panel distant from each other in a predetermined direction, and one of the joints is arranged at a position corresponding to the through hole of the chassis.

Abstract translation: 本发明提供了一种能够通过用于将电路安装在底盘上的通孔减少向PDP背面进行的外部光的影响而显示高品质图像的技术。 本发明的平板显示器包括显示面板，具有通孔的金属底座和用于将显示面板的后表面与底盘相互连接的接头。 接头位于显示面板的在预定方向上彼此远离的背面，并且其中一个接头被布置在与底架的通孔相对应的位置。

公开(公告)号：US20100000720A1

公开(公告)日：2010-01-07

申请号：US12492146

申请日：2009-06-26

Applicant: JI LI

Inventor： JI LI

IPC: F28D15/00

CPC classification number: G06F1/20 ,  G06F2200/201 ,  H01L23/427 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A liquid cooling heat dissipating device with heat tubes gathering heat sources includes a cold plate being disposed on the heat sources and a or a plurality of heat tubes disposed between the heat sources and the cold plate to contact with the heat sources completely, and an end of the respective heat tube is fixedly attached to the cold plate, respectively. The respective heat tube is sealed with a capillary material and a vapor-liquid working median contained inside. The respective heat tube contacts with the heat sources at different spots to gather the heat for being cooled with the cold plate simply.

Abstract translation: 具有收集热源的热管的液体冷却散热装置包括设置在热源上的冷板和设置在热源和冷板之间的一组或多个热管，以完全与热源接触， 分别固定在冷板上。 相应的热管用毛细管材料密封并且内部包含气液工作中值。 相应的热管与不同点处的热源接触以收集用于冷板冷却的热量。

公开(公告)号：US20090296354A1

公开(公告)日：2009-12-03

申请号：US12429948

申请日：2009-04-24

Applicant: Kentaro Tomioka ,  Tomomi Murayama

Inventor： Kentaro Tomioka ,  Tomomi Murayama

IPC: H05K7/20

CPC classification number: H01L23/367 ,  G06F1/20 ,  G06F2200/201 ,  H01L23/427 ,  H01L24/32 ,  H01L2924/01006 ,  H01L2924/01009 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01021 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/19041 ,  H01L2924/3511

Abstract: According to one embodiment, an electronic apparatus includes a semiconductor package including a resin substrate and a die mounted on the resin substrate, a printed circuit board on which the semiconductor package is mounted, and a heat receiving plate that has an area larger than an area of the die. The heat receiving plate has a concave portion that corresponds to a surface of the die at a normal temperature. The concave portion is provided with a pasty heat conductive agent. The heat receiving plate is thermally connected to the semiconductor package via the pasty heat conductive agent.

Abstract translation: 根据一个实施例，一种电子设备包括：半导体封装，包括树脂基板和安装在树脂基板上的管芯，安装有半导体封装的印刷电路板和面积大于面积的热接收板 的死亡。 受热板具有与正常温度下的模具表面对应的凹部。 凹部设有糊状导热剂。 热接收板通过糊状导热剂热连接到半导体封装。

公开(公告)号：US07626815B2

公开(公告)日：2009-12-01

申请号：US11273904

申请日：2005-11-14

Applicant: Zoran Stefanoski

Inventor： Zoran Stefanoski

IPC: H05K5/00 ,  H05K7/00

CPC classification number: G06F1/20 ,  G06F1/187 ,  G06F2200/201

Abstract: The present invention represents a significant advancement in the field of cooling systems for computer hardware. One embodiment of a system for cooling a heat-generating device includes a housing sized to fit within a drive bay of a computing device, a heat exchanger disposed within the housing and configured to transfer heat from liquid to air, a fan disposed within the housing and configured to force air through the heat exchanger, and a pump disposed within the housing and configured to circulate a liquid through a cold plate sub-assembly and back to the heat exchanger. The cold plate sub-assembly is configured to be thermally coupled to the heat-generating device. The disclosed system may be advantageously disposed in any computing device whose chassis has a standard-sized drive bay, thereby enabling the system to be easily implemented across a wide variety of computing devices.

Abstract translation: 本发明代表了计算机硬件冷却系统领域的重大进步。 用于冷却发热装置的系统的一个实施例包括尺寸适于安装在计算装置的驱动室内的壳体，设置在壳体内并被配置为将热量从液体传递到空气的热交换器，设置在壳体内的风扇 并且构造成迫使空气通过热交换器，以及泵，其设置在壳体内并且构造成使液体通过冷板子组件循环并返回到热交换器。 冷板子组件被配置为热耦合到发热装置。 所公开的系统可以有利地设置在其机架具有标准尺寸的驱动器托架的任何计算设备中，从而使系统能够容易地跨越各种各样的计算设备实现。

公开(公告)号：US20090266520A1

公开(公告)日：2009-10-29

申请号：US12428602

申请日：2009-04-23

Applicant: Junhyun YU

Inventor： Junhyun YU

IPC: F28D15/02 ,  F25B1/00

CPC classification number: F28D15/0266 ,  F25B23/006 ,  G06F1/203 ,  G06F2200/201

Abstract: A small and lightweight phase conversion cooler having high cooling efficiency and mobile equipment. The phase conversion cooler has a cooling head having a first side in contact with a cooled object, a first circular port provided in a second side, a second circular port provided in a third side, a first pipe connected to the first circular port, a condenser part placed in a heat dissipation environment and a second pipe connected to the second circular port. The cooling head is formed by resin molding. The first side of the cooling head is provided with a metal plate.

Abstract translation: 具有高冷却效率和移动设备的小而轻便的相位转换冷却器。 相变冷却器具有冷却头，冷却头具有与被冷却物体接触的第一侧，设置在第二侧的第一圆形口，设置在第三侧的第二圆形口，连接到第一圆形口的第一管， 冷凝器部分放置在散热环境中，第二管连接到第二圆形端口。 冷却头通过树脂成型形成。 冷却头的第一侧设有金属板。

公开(公告)号：US20090262501A1

公开(公告)日：2009-10-22

申请号：US12107010

申请日：2008-04-21

Applicant: Alan Claassen ,  Eric Alan Eckberg ,  Dennis John Hansen ,  Vinod Kamath ,  Madhusudan K. Iyengar ,  Howard Victor Mahaney, JR. ,  Michael Sven Miller ,  Stephen Peter Mroz

Inventor： Alan Claassen ,  Eric Alan Eckberg ,  Dennis John Hansen ,  Vinod Kamath ,  Madhusudan K. Iyengar ,  Howard Victor Mahaney, JR. ,  Michael Sven Miller ,  Stephen Peter Mroz

IPC: G06F1/20 ,  H05K7/20 ,  B23P11/00 ,  H05K5/00

CPC classification number: G06F1/20 ,  G06F2200/201 ,  H05K7/20736 ,  H05K7/2079 ,  Y10T29/49826

Abstract: Rack assemblies and methods for cooling one or more rack-based computer systems, as well as data center configurations that utilize the rack assembly. The rack assembly comprises a rack providing support for multiple columns of heat-generating electronic devices and device fans for moving air from an air inlet side of the rack through the devices and through an air outlet side of the rack. The rack assembly also comprises a unitary door having a support frame spanning the air outlet side of the rack and hingedly coupling the door to a rear vertical edge of the rack. The door includes an air-to-liquid heat exchanger panel spanning an air outlet passage inside the support frame so that substantially all of the air passing through the air outlet must pass through the heat exchanger panel. The air outlet passage has a cross-sectional area that is substantially equal to or greater than the cross-sectional area of the multiple columns of heat-generating devices.

Abstract translation: 用于冷却一个或多个基于机架的计算机系统的机架组件和方法，以及利用机架组件的数据中心配置。 机架组件包括一个支架，用于支撑多列发热电子设备和设备风扇，用于将空气从机架的空气入口侧移动穿过设备并通过机架的空气出口侧。 机架组件还包括一个整体门，其具有横跨机架的空气出口侧的支撑框架，并将门铰接地连接到机架的后垂直边缘。 门包括空气到液体的热交换器面板，其横跨支撑框架内的空气出口通道，使得通过出气口的空气基本上必须通过热交换器面板。 空气出口通道的横截面积基本上等于或大于多列发热装置的横截面面积。