公开(公告)号：US20080083481A1

公开(公告)日：2008-04-10

申请号：US11875010

申请日：2007-10-19

Applicant: Sundaresan Jayaraman ,  Sungmee Park

Inventor： Sundaresan Jayaraman ,  Sungmee Park

IPC: B29C65/00 ,  B32B37/00 ,  B65H69/00

CPC classification number: H01R43/0207 ,  H01H2203/0085 ,  H05K1/0289 ,  H05K3/10 ,  H05K3/328 ,  H05K3/4069 ,  H05K3/4084 ,  H05K2201/0281 ,  H05K2201/029 ,  H05K2203/0126 ,  H05K2203/0783 ,  Y10S2/905 ,  Y10T156/10 ,  Y10T442/3228

Abstract: Disclosed are systems or apparatuses and methods for forming a junction between conductive fibers that are incorporated into a fabric. Briefly, one method includes the steps of removing insulation from two intersecting individually insulated conductive fibers to expose the individually conductive fibers, bringing the exposed individually conductive fibers into contact with each other at a junction point, and forming a molecular bond between the conductive fibers at the junction point. Also disclosed are systems for forming a junction between conductive fibers that are incorporated into a fabric. In this regard, one embodiment of such a system can include a first apparatus that removes insulation from two intersecting individually insulated conductive fibers to expose the individually conductive fibers, a second apparatus that brings the exposed individually conductive fibers into contact with each other at a junction point, and a third apparatus that aids in formation of a molecular bond between the conductive fibers at the junction point.

Abstract translation: 公开了用于形成结合到织物中的导电纤维之间的接合部的系统或装置和方法。 简而言之，一种方法包括以下步骤：从两个相交的单独绝缘的导电纤维去除绝缘体以暴露单独的导电纤维，使暴露的单独的导电纤维在接合点处彼此接触，并且在导电纤维之间形成分子键 交点。 还公开了用于形成结合到织物中的导电纤维之间的接合部的系统。 在这方面，这种系统的一个实施例可以包括第一装置，其从两个相交的单独绝缘的导电纤维去除绝缘以暴露单独的导电纤维;第二装置，其使暴露的单独的导电纤维在接合处彼此接触 点和第三装置，其有助于在接合点处在导电纤维之间形成分子键。

公开(公告)号：US20080011507A1

公开(公告)日：2008-01-17

申请号：US11879256

申请日：2007-07-16

Applicant: Kalu Vasoya

Inventor： Kalu Vasoya

IPC: H05K1/16

CPC classification number: H05K3/4608 ,  H01L2224/16225 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/15311 ,  H05K1/0284 ,  H05K1/0313 ,  H05K1/0366 ,  H05K1/11 ,  H05K3/429 ,  H05K3/4644 ,  H05K2201/0281 ,  H05K2201/029 ,  H05K2201/0323 ,  H05K2201/09309 ,  H05K2201/09536 ,  H05K2201/0959 ,  H01L2224/0401

Abstract: Integrated circuits and processes for manufacturing integrated circuits are described that use printed wiring board substrates having a core layer that is part of the circuit of the printed wiring board. In a number of embodiments, the core layer is constructed from a carbon composite. In several embodiments, techniques are described for increasing the integrity of core layers in designs calling for high density clearance hole drilling. One embodiment of the invention includes a core layer that includes electrically conductive material and at least one build-up wiring portion formed on an outer surface of the core layer. In addition, the build-up portion comprises at least one micro wiring layer including a circuit that is electrically connected to the electrically conductive material in the core layer via a plated through hole.

Abstract translation: 描述了用于制造集成电路的集成电路和工艺，其使用具有作为印刷线路板的电路的一部分的芯层的印刷线路板基板。 在多个实施例中，芯层由碳复合材料构成。 在几个实施例中，描述了在要求高密度间隙孔钻孔的设计中增加芯层的完整性的技术。 本发明的一个实施例包括芯层，其包括导电材料和形成在芯层的外表面上的至少一个堆积布线部分。 此外，积层部分包括至少一个微布线层，其包括通过电镀通孔与芯层中的导电材料电连接的电路。

公开(公告)号：US07299964B2

公开(公告)日：2007-11-27

申请号：US10759691

申请日：2004-01-15

Applicant: Sundaresan Jayaraman ,  Sungmee Park

Inventor： Sundaresan Jayaraman ,  Sungmee Park

IPC: B23K1/06 ,  B23K31/02 ,  D03D23/00 ,  D03D3/02 ,  D03D15/00

CPC classification number: H01R43/0207 ,  H01H2203/0085 ,  H05K1/0289 ,  H05K3/10 ,  H05K3/328 ,  H05K3/4069 ,  H05K3/4084 ,  H05K2201/0281 ,  H05K2201/029 ,  H05K2203/0126 ,  H05K2203/0783 ,  Y10S2/905 ,  Y10T156/10 ,  Y10T442/3228

Abstract: Disclosed are systems or apparatuses and methods for forming a junction between conductive fibers that are incorporated into a fabric. Briefly, one method includes the steps of removing insulation from two intersecting individually insulated conductive fibers to expose the individually conductive fibers, bringing the exposed individually conductive fibers into contact with each other at a junction point, and forming a molecular bond between the conductive fibers at the junction point. Also disclosed are systems for forming a junction between conductive fibers that are incorporated into a fabric. In this regard, one embodiment of such a system can include a first apparatus that removes insulation from two intersecting individually insulated conductive fibers to expose the individually conductive fibers, a second apparatus that brings the exposed individually conductive fibers into contact with each other at a junction point, and a third apparatus that aids in formation of a molecular bond between the conductive fibers at the junction point.

Abstract translation: 公开了用于形成结合到织物中的导电纤维之间的接合部的系统或装置和方法。 简而言之，一种方法包括以下步骤：从两个相交的单独绝缘的导电纤维去除绝缘体以暴露单独的导电纤维，使暴露的单独的导电纤维在接合点处彼此接触，并且在导电纤维之间形成分子键 交点。 还公开了用于形成结合到织物中的导电纤维之间的接合部的系统。 在这方面，这种系统的一个实施例可以包括第一装置，其从两个相交的单独绝缘的导电纤维去除绝缘以暴露单独的导电纤维;第二装置，其使暴露的单独的导电纤维在接合处彼此接触 点和第三装置，其有助于在接合点处在导电纤维之间形成分子键。

公开(公告)号：US07271472B2

公开(公告)日：2007-09-18

申请号：US10928616

申请日：2004-08-27

Applicant: Maksim Kuzmenka

Inventor： Maksim Kuzmenka

IPC: H01L23/02

CPC classification number: H05K3/4641 ,  H05K2201/0281 ,  H05K2201/029 ,  H05K2201/09309

Abstract: A circuit board comprises a dielectric layer, a net of first power supply lines for providing a first reference voltage plane and a net of second power supply lines for providing a second reference voltage plane. The nets of first and second power supply lines are arranged such that first power supply lines and second power supply lines are alternately arranged in the direction of a first surface of the dielectric layer.

Abstract translation: 电路板包括电介质层，用于提供第一参考电压平面的第一电源线的网和用于提供第二参考电压平面的第二电源线的网。 第一和第二电源线的网布置成使得第一电源线和第二电源线在电介质层的第一表面的方向上交替布置。

公开(公告)号：US07248756B2

公开(公告)日：2007-07-24

申请号：US10984923

申请日：2004-11-10

Applicant: Thomas Ebbesen ,  Per-Erik Nordal

Inventor： Thomas Ebbesen ,  Per-Erik Nordal

IPC: G02B6/12 ,  G02B6/00 ,  C07C5/42 ,  G09G3/28

CPC classification number: D04B1/16 ,  D02G3/441 ,  D03D1/0088 ,  D03D9/00 ,  D03D15/00 ,  D03D15/0011 ,  D03D15/0027 ,  D03D15/0083 ,  D03D15/0088 ,  D03D15/02 ,  D03D27/00 ,  D04B21/16 ,  D10B2101/06 ,  D10B2101/20 ,  D10B2401/16 ,  D10B2401/20 ,  D10B2403/02431 ,  G02B6/3608 ,  G02B6/3628 ,  G02B6/43 ,  H01L25/065 ,  H01L27/32 ,  H01L2924/0002 ,  H01L2924/3011 ,  H05K1/038 ,  H05K1/189 ,  H05K2201/0281 ,  H01L2924/00

Abstract: An apparatus/method for producing fabric-like electronic circuit patterns created by methodically joining electronic elements using textile fabrication-like methods in a predetermined arrangement.

Abstract translation: 一种用于制造通过以预定布置方式使用纺织品制造方法以方法连接电子元件而制造的类似织物的电子电路图案的装置/方法。

公开(公告)号：US07224046B2

公开(公告)日：2007-05-29

申请号：US11141643

申请日：2005-06-01

Applicant: Tomoyuki Abe ,  Nobuyuki Hayashi ,  Motoaki Tani

Inventor： Tomoyuki Abe ,  Nobuyuki Hayashi ,  Motoaki Tani

IPC: H01L23/48 ,  H05K3/40

CPC classification number: H01L23/49822 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K1/0366 ,  H05K1/056 ,  H05K1/09 ,  H05K3/429 ,  H05K3/4608 ,  H05K3/4641 ,  H05K3/4688 ,  H05K2201/0281 ,  H05K2201/0323 ,  H05K2201/0355 ,  H05K2201/09536 ,  H05K2203/1105 ,  Y10S428/901 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49162 ,  Y10T428/24917 ,  H01L2924/00

Abstract: A multilayer wiring board (X1) comprises a core portion (100) and out-core wiring portion (30). The core portion (100) comprises a carbon fiber reinforced portion (10) composed of a carbon fiber material (11) and resin composition (12), and an in-core wiring portion (20) which has a laminated structure of at least one insulating layer (21) containing a glass fiber material (21a) and a wiring pattern (22) composed of a conductor having an elastic modulus of 10 to 40 GPa and which is bonded to the carbon fiber reinforced portion (10). The out-core wiring portion (30) has a laminated structure of at least one insulating layer (31) and a wiring pattern (32) and is bonded to the core portion (100) at the in-core wiring portion (20).

Abstract translation: 多层布线板（X 1）包括芯部（100）和外芯布线部（30）。 芯部（100）包括由碳纤维材料（11）和树脂组合物（12）构成的碳纤维增强部（10），以及具有层叠结构的芯内配线部（20） 包含玻璃纤维材料（21a）的绝缘层（21）和由弹性模量为10〜40GPa的导体构成并与碳纤维增强部（10）接合的布线图案（22）。 外芯接线部（30）具有至少一个绝缘层（31）和布线图案（32）的叠层结构，并且在芯部布线部（20）处与芯部（100）接合。

公开(公告)号：US07220131B1

公开(公告)日：2007-05-22

申请号：US11530932

申请日：2006-09-12

Applicant: Michael G. Pecht ,  Joseph A. Swift ,  Stanley J. Wallace ,  Yuliang Deng

Inventor： Michael G. Pecht ,  Joseph A. Swift ,  Stanley J. Wallace ,  Yuliang Deng

IPC: H01R12/00 ,  H05K1/00

CPC classification number: H05K3/3436 ,  H01L24/10 ,  H01L24/13 ,  H01L24/81 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/81101 ,  H01L2224/81801 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01094 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01R13/2414 ,  H05K2201/0281 ,  H05K2201/10378 ,  H05K2201/10719 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2224/05599

Abstract: According to various embodiments, exemplary interconnects and methods for interconnection are provided that can include contacts formed by fiber bundles. The exemplary interconnects can be used to form separable or non-separable electro-mechanical connections between one or more of the generally accepted six levels of interconnection. In various embodiments, the exemplary interconnects can allow management of the thermal properties of the electronic devices. Exemplary interconnects can also provided reduced thickness allowing redundancy and additional compliance as desired.

Abstract translation: 根据各种实施例，提供了用于互连的示例性互连和方法，其可以包括由纤维束形成的触点。 示例性互连可以用于在通常接受的六个互连层级中的一个或多个之间形成可分离或不可分离的电 - 机械连接。 在各种实施例中，示例性互连可以允许管理电子设备的热性质。 示例性互连还可以提供减小的厚度，允许冗余和根据需要的附加顺应性。

公开(公告)号：US07034403B2

公开(公告)日：2006-04-25

申请号：US10411163

申请日：2003-04-10

Applicant: Ranjith Divigalpitiya ,  David A. Kanno ,  Patrice Jannic ,  Christophe Arnold ,  Richard Sabatier ,  Glen Connell

Inventor： Ranjith Divigalpitiya ,  David A. Kanno ,  Patrice Jannic ,  Christophe Arnold ,  Richard Sabatier ,  Glen Connell

IPC: H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC classification number: H01L24/29 ,  C08L67/00 ,  C08L77/00 ,  C09J9/02 ,  H01L24/83 ,  H01L2224/2919 ,  H01L2224/29499 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01009 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01025 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/07811 ,  H01L2924/14 ,  H01R4/04 ,  H05K3/323 ,  H05K2201/0245 ,  H05K2201/0248 ,  H05K2201/0281 ,  H01L2924/00

Abstract: An electronic assembly comprising a first electronic element, a second electronic element, and a durably flexible bond therebetween. The bond comprises an anisotropic conductive adhesive that includes elongated electrically conductive particles. The bond provides at least one electrical pathway between the first electronic element and the second electronic element through an elongated contact region. This bond is functionally maintained for at least about 200 flexes.

Abstract translation: 一种电子组件，包括第一电子元件，第二电子元件以及它们之间的耐久性柔性接合。 该键包括包括细长导电颗粒的各向异性导电粘合剂。 该键通过细长的接触区域在第一电子元件和第二电子元件之间提供至少一个电路径。 该键在功能上维持至少约200个弯曲。

公开(公告)号：US20050263124A1

公开(公告)日：2005-12-01

申请号：US11180015

申请日：2005-07-12

Applicant: Thomas Aisenbrey

Inventor： Thomas Aisenbrey

IPC: B29C45/00 ,  B29C47/00 ,  F02M35/10

CPC classification number: B29C45/0013 ,  B29C45/0001 ,  B29K2995/0005 ,  B29L2031/246 ,  B29L2031/3456 ,  F02M35/10085 ,  F02M35/10268 ,  F02M35/10321 ,  F02M35/10327 ,  F02M35/10334 ,  F02M35/10347 ,  G06K19/07749 ,  H01Q1/1271 ,  H01Q1/36 ,  H01Q1/38 ,  H01Q1/40 ,  H01Q9/0407 ,  H01Q9/16 ,  H01Q9/30 ,  H05K1/095 ,  H05K3/101 ,  H05K3/107 ,  H05K2201/0281 ,  H05K2201/09118 ,  H05K2203/0113

Abstract: Vehicle air intake and exhaust handling devices are formed of a conductive loaded resin-based material. The conductive loaded resin-based material comprises micron conductive powder(s), conductive fiber(s), or a combination of conductive powder and conductive fibers in a base resin host. The percentage by weight of the conductive powder(s), conductive fiber(s), or a combination thereof is between about 20% and 50% of the weight of the conductive loaded resin-based material. The micron conductive powders are metals or conductive non-metals or metal plated non-metals. The micron conductive fibers may be metal fiber or metal plated fiber. Further, the metal plated fiber may be formed by plating metal onto a metal fiber or by plating metal onto a non-metal fiber. Any platable fiber may be used as the core for a non-metal fiber. Superconductor metals may also be used as micron conductive fibers and/or as metal plating onto fibers in the present invention.

Abstract translation: 车辆进气和排气处理装置由导电负载的树脂基材料形成。 导电负载树脂基材料在基础树脂主体中包括微米导电粉末，导电纤维或导电粉末和导电纤维的组合。 导电粉末，导电纤维或其组合的重量百分数为导电负载树脂基材料重量的约20％至50％。 微米导电粉末是金属或导电非金属或非金属镀金属。 微米导电纤维可以是金属纤维或金属镀覆的纤维。 此外，金属镀覆的纤维可以通过将金属镀在金属纤维上或通过将金属电镀到非金属纤维上而形成。 可以使用任何可镀纤维作为非金属纤维的芯。 在本发明中，超导体金属也可用作微米导电纤维和/或作为金属镀覆在纤维上。

公开(公告)号：US20050218503A1

公开(公告)日：2005-10-06

申请号：US11141643

申请日：2005-06-01

Applicant: Tomoyuki Abe ,  Nobuyuki Hayashi ,  Motoaki Tani

Inventor： Tomoyuki Abe ,  Nobuyuki Hayashi ,  Motoaki Tani

IPC: A63H30/04 ,  H01L21/48 ,  H01L23/48 ,  H01L23/498 ,  H05K1/03 ,  H05K3/42 ,  H05K3/46

CPC classification number: H01L23/49822 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K1/0366 ,  H05K1/056 ,  H05K1/09 ,  H05K3/429 ,  H05K3/4608 ,  H05K3/4641 ,  H05K3/4688 ,  H05K2201/0281 ,  H05K2201/0323 ,  H05K2201/0355 ,  H05K2201/09536 ,  H05K2203/1105 ,  Y10S428/901 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49162 ,  Y10T428/24917 ,  H01L2924/00

Abstract: A multilayer wiring board (X1) comprises a core portion (100) and out-core wiring portion (30). The core portion (100) comprises a carbon fiber reinforced portion (10) composed of a carbon fiber material (11) and resin composition (12), and an in-core wiring portion (20) which has a laminated structure of at least one insulating layer (21) containing a glass fiber material (21a) and a wiring pattern (22) composed of a conductor having an elastic modulus of 10 to 40 GPa and which is bonded to the carbon fiber reinforced portion (10). The out-core wiring portion (30) has a laminated structure of at least one insulating layer (31) and a wiring pattern (32) and is bonded to the core portion (100) at the in-core wiring portion (20).

Abstract translation: 多层布线板（X 1）包括芯部（100）和外芯布线部（30）。 芯部（100）包括由碳纤维材料（11）和树脂组合物（12）构成的碳纤维增强部（10），以及具有层叠结构的芯内配线部（20） 包含玻璃纤维材料（21a）的绝缘层（21）和由弹性模量为10〜40GPa的导体构成并与碳纤维增强部（10）接合的布线图案（22）。 外芯接线部（30）具有至少一个绝缘层（31）和布线图案（32）的叠层结构，并且在芯部布线部（20）处与芯部（100）接合。