公开(公告)号：US07902639B2

公开(公告)日：2011-03-08

申请号：US11280986

申请日：2005-11-16

Applicant: Philip E. Garrou ,  Michael R. Knapp ,  Hash Pakbaz ,  Florian Pschenitzka ,  Xina Quan ,  Michael A. Spaid

Inventor： Philip E. Garrou ,  Michael R. Knapp ,  Hash Pakbaz ,  Florian Pschenitzka ,  Xina Quan ,  Michael A. Spaid

IPC: H01L29/40

CPC classification number: C23C18/1608 ,  B82Y10/00 ,  B82Y30/00 ,  C23C18/1639 ,  C23C18/1692 ,  C23C18/1879 ,  C23C18/1889 ,  C23C18/206 ,  C23C18/208 ,  C23C18/30 ,  G02F1/136204 ,  H05K1/162 ,  H05K1/165 ,  H05K1/167 ,  H05K3/105 ,  H05K3/12 ,  H05K3/389 ,  H05K2201/0209 ,  H05K2201/0257 ,  H05K2201/086 ,  H05K2203/0545 ,  H05K2203/122

Abstract: Improved methods and articles providing conformal coatings for a variety of devices including electronic, semiconductor, and liquid crystal display devices. Peptide formulations which bind to nanoparticles and substrates, including substrates with trenches and vias, to provide conformal coverage as a seed layer. The seed layer can be further enhanced with use of metallic films deposited on the seed layer. Seed layers can be characterized by AFM measurements and improved seed layers provide for better enhancement layers including lower resistivity in the enhancement layer. Peptides can be identified by phage display.

Abstract translation: 改进的方法和制品为包括电子，半导体和液晶显示装置的各种装置提供保形涂层。 结合纳米颗粒和底物的肽制剂，包括具有沟槽和通孔的底物，以提供作为种子层的保形覆盖。 通过使用沉积在种子层上的金属膜可进一步增强籽晶层。 可以通过AFM测量来表征种子层，并且改进的种子层提供包括增强层中较低电阻率的更好的增强层。 可以通过噬菌体展示来鉴定肽。

公开(公告)号：US20110043987A1

公开(公告)日：2011-02-24

申请号：US12938759

申请日：2010-11-03

Applicant: Rabindra N. Das ,  John M. Lauffer ,  Voya R. Markovich

Inventor： Rabindra N. Das ,  John M. Lauffer ,  Voya R. Markovich

IPC: G06F1/16 ,  H05K7/00 ,  B82Y30/00

CPC classification number: H05K1/167 ,  H01G4/206 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/0102 ,  H01L2924/01025 ,  H01L2924/01046 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/15311 ,  H01L2924/16195 ,  H01L2924/3011 ,  H05K1/095 ,  H05K1/162 ,  H05K3/0023 ,  H05K2201/0187 ,  H05K2201/0209 ,  H05K2201/0215 ,  H05K2201/0257 ,  H05K2203/1453 ,  Y10T29/49082 ,  Y10T29/49087 ,  Y10T29/49089 ,  Y10T29/49091 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49165 ,  H01L2224/0401

Abstract: A method of making a circuitized substrate including a resistor comprised of material which includes a polymer resin and a quantity of nano-powders including a mixture of at least one metal component and at least one ceramic component. The ceramic component may be a ferroelectric ceramic and/or a high surface area ceramic and/or a transparent oxide and/or a dope manganite. Alternatively, the material will include the polymer resin and nano-powders, with the nano-powders comprising at least one metal coated ceramic and/or at least one oxide coated metal component. An electrical assembly (substrate and at least one electrical component) and an information handling system (e.g., personal computer) utilizing such a circuitized substrate are also provided.

Abstract translation: 一种制造电路化基板的方法，包括由包括聚合物树脂的材料和包括至少一种金属组分和至少一种陶瓷组分的混合物的纳米粉末的量组成的电阻器。 陶瓷部件可以是铁电陶瓷和/或高表面积陶瓷和/或透明氧化物和/或掺杂亚锰酸盐。 或者，材料将包括聚合物树脂和纳米粉末，其中纳米粉末包含至少一种金属涂覆的陶瓷和/或至少一种氧化物涂覆的金属组分。 还提供了使用这种电路化基板的电气组件（基板和至少一个电气部件）以及信息处理系统（例如，个人计算机）。

公开(公告)号：US07887905B2

公开(公告)日：2011-02-15

申请号：US12324006

申请日：2008-11-26

Applicant: Beom Joon Cho ,  Jong Myeon Lee

Inventor： Beom Joon Cho ,  Jong Myeon Lee

IPC: B32B9/00

CPC classification number: B32B18/00 ,  C04B38/0022 ,  C04B2111/00844 ,  C04B2235/6025 ,  C04B2235/6562 ,  C04B2235/6567 ,  C04B2235/721 ,  C04B2235/9615 ,  C04B2237/32 ,  C04B2237/562 ,  C04B2237/68 ,  C04B2237/702 ,  C04B2237/704 ,  H05K1/0306 ,  H05K3/4611 ,  H05K3/4629 ,  H05K2201/0209 ,  H05K2201/0269 ,  H05K2203/308 ,  Y10T428/24926 ,  Y10T428/25 ,  Y10T428/252 ,  C04B35/10 ,  C04B38/0054 ,  C04B38/0675 ,  C04B38/068

Abstract: There is provided a constraining green including a first constraining layer having a surface disposed on the one of the top and bottom surfaces of the ceramic laminated body, the first constraining layer containing a first inorganic powder; and a second constraining layer disposed on a top of the first constraining layer and containing a second inorganic powder and a fly ash. The constraining green sheet serves to ensure less shrinkage of the ceramic laminated body and improve debinding characteristics.

Abstract translation: 提供了一种约束绿色，其包括第一约束层，其具有设置在陶瓷层叠体的顶表面和底表面中的一个上的表面，第一约束层包含第一无机粉末; 以及第二约束层，其设置在所述第一约束层的顶部并且包含第二无机粉末和飞灰。 约束生片用于确保陶瓷层压体的收缩较小，并改善脱脂特性。

公开(公告)号：US20110031003A1

公开(公告)日：2011-02-10

申请号：US12937018

申请日：2009-02-13

Applicant: Sankar Paul ,  Dirk M. Baars

Inventor： Sankar Paul ,  Dirk M. Baars

IPC: H05K1/00 ,  H05K3/00 ,  B32B27/08

CPC classification number: H05K1/0373 ,  B32B7/12 ,  B32B15/06 ,  B32B15/08 ,  B32B15/085 ,  B32B15/20 ,  B32B27/285 ,  B32B27/32 ,  B32B2255/06 ,  B32B2255/10 ,  B32B2255/26 ,  B32B2262/0276 ,  B32B2264/0278 ,  B32B2307/204 ,  B32B2307/302 ,  B32B2307/3065 ,  B32B2307/50 ,  B32B2307/54 ,  B32B2307/714 ,  B32B2307/7265 ,  B32B2307/734 ,  B32B2457/00 ,  C08K3/22 ,  C08L15/00 ,  C08L19/006 ,  C08L71/12 ,  C08L2666/14 ,  C09D5/24 ,  C09D7/61 ,  C09J107/00 ,  C12Q1/6886 ,  C12Q2600/154 ,  C12Q2600/156 ,  H05K1/032 ,  H05K3/386 ,  H05K3/4626 ,  H05K2201/012 ,  H05K2201/0133 ,  H05K2201/0158 ,  H05K2201/0209 ,  H05K2201/0212 ,  H05K2201/0355 ,  H05K2203/122 ,  Y10T156/10 ,  Y10T428/24802 ,  Y10T428/2804 ,  Y10T428/31826 ,  Y10T428/31833 ,  Y10T428/31855 ,  Y10T428/31909 ,  Y10T428/31924 ,  Y10T428/31931 ,  Y10T428/31938 ,  C08L2666/08

Abstract: A circuit subassembly, comprising: a conductive layer, a dielectric layer formed from a thermosetting composition, wherein the thermosetting composition comprises, based on the total weight of the thermosetting composition a polybutadiene or polyisoprene resin, about 30 to about 70 percent by weight of a magnesium hydroxide having less than about 1000 ppm of ionic contaminants, and about 5 to about 15 percent by weight of a nitrogen-containing compound, wherein the nitrogen-containing compound comprises at least about 15 weight percent of nitrogen; and an adhesive layer disposed between and in intimate contact with the conductive layer and the dielectric layer, wherein the adhesive comprises a poly(arylene ether), wherein the circuit subassembly has a UL-94 rating of at least V-1.

Abstract translation: 一种电路子组件，包括：导电层，由热固性组合物形成的电介质层，其中所述热固性组合物基于所述热固性组合物的总重量包含聚丁二烯或聚异戊二烯树脂，约30至约70重量％ 具有小于约1000ppm的离子污染物的氢氧化镁和约5至约15重量％的含氮化合物，其中所述含氮化合物包含至少约15重量％的氮; 以及设置在所述导电层和所述电介质层之间并且与所述电介质层紧密接触的粘合剂层，其中所述粘合剂包括聚（亚芳基醚），其中所述电路子组件具有至少V-1的UL-94等级。

公开(公告)号：US07851707B2

公开(公告)日：2010-12-14

申请号：US11591559

申请日：2006-11-02

Applicant: Daisuke Mizutani ,  Tatsuhiko Tajima

Inventor： Daisuke Mizutani ,  Tatsuhiko Tajima

IPC: H05K1/03

CPC classification number: H05K1/024 ,  H05K1/0298 ,  H05K2201/0187 ,  H05K2201/0195 ,  H05K2201/0209 ,  Y10T29/49126

Abstract: A circuit board for reducing a transmission loss and a method for manufacturing the circuit board. In the circuit board including a ground layer and power layer facing each other, a wiring layer disposed between the ground layer and the power layer, and an insulating section formed between the ground layer and the power layer so as to sandwich the wiring layer therebetween, a low dielectric loss layer having a dielectric tangent lower than that of the insulating section is formed at least on an upper or lower surface of the wiring layer. According to such a circuit board, the low dielectric loss layer is formed on an interface between the insulating section and the wiring layer, and therefore, a transmission loss in a high frequency region is reduced.

Abstract translation: 一种用于降低传输损耗的电路板和一种用于制造电路板的方法。 在包括接地层和功率层相对的电路板中，布置在接地层和功率层之间的布线层以及形成在接地层和功率层之间以将布线层夹在其间的绝缘部分， 至少在布线层的上表面或下表面上形成具有低于绝缘部分的介电切线的低介电损耗层。 根据这种电路板，低介电损耗层形成在绝缘部分和布线层之间的界面上，因此降低了高频区域的传输损耗。

公开(公告)号：US20100304180A1

公开(公告)日：2010-12-02

申请号：US12744685

申请日：2008-12-03

Applicant: Daniel I. Amey ,  Deborah R. Gravely ,  Michael J. Green ,  Steven H. White

Inventor： Daniel I. Amey ,  Deborah R. Gravely ,  Michael J. Green ,  Steven H. White

IPC: B32B15/088 ,  B32B15/20

CPC classification number: F21V21/00 ,  H05K1/0271 ,  H05K1/028 ,  H05K1/056 ,  H05K1/189 ,  H05K3/22 ,  H05K3/386 ,  H05K2201/0154 ,  H05K2201/0209 ,  H05K2201/10106 ,  H05K2203/0315 ,  H05K2203/302 ,  Y10T29/49002 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49144 ,  Y10T29/49147 ,  Y10T428/12569 ,  Y10T428/24 ,  Y10T428/24975 ,  Y10T428/31678 ,  Y10T428/31681

Abstract: This invention is directed to bendable circuit substrate structures useful for LED mounting and interconnection.

Abstract translation: 本发明涉及可用于LED安装和互连的可弯曲电路衬底结构。

公开(公告)号：US20100294548A1

公开(公告)日：2010-11-25

申请号：US12735235

申请日：2008-07-29

Applicant: Hiroyuki Fujisawa ,  Hiroki Tamiya

Inventor： Hiroyuki Fujisawa ,  Hiroki Tamiya

IPC: H05K1/00 ,  C08K9/10 ,  B32B15/092

CPC classification number: H05K1/0373 ,  B32B5/024 ,  B32B15/08 ,  B32B15/14 ,  B32B15/20 ,  B32B27/04 ,  B32B27/12 ,  B32B27/38 ,  B32B2260/021 ,  B32B2260/046 ,  B32B2262/101 ,  B32B2264/102 ,  B32B2307/306 ,  B32B2307/50 ,  B32B2457/08 ,  C08G59/38 ,  C08G59/621 ,  C08J5/24 ,  C08J2363/08 ,  C08K3/22 ,  C08K3/36 ,  C08K5/13 ,  C08L63/00 ,  H05K3/4626 ,  H05K2201/0209 ,  H05K2201/0239 ,  Y10T428/31529 ,  C08L2666/22

Abstract: The present invention provides an epoxy resin composition exhibiting good workability in drilling, molding, and desmearing as well as good interlayer adhesion strength. This epoxy resin composition comprises an epoxy resin, a curing agent, and an inorganic filler. The epoxy resin is composed of a dicyclopentadiene-based epoxy resin and a novolac-based epoxy resin. The curing agent is a biphenyl-based phenol resin. The inorganic filler is composed of aluminum hydroxide and granular silica having an epoxy-silane treated surface. The epoxy resin composition contains 20 to 50% by weight of the granular silica. The epoxy resin composition contains 2 to 15% by weight, based on total weight of granular silica, of the aluminum hydroxide.

Abstract translation: 本发明提供了一种在钻井，成型和除泥中表现出良好的加工性以及良好的层间粘合强度的环氧树脂组合物。 该环氧树脂组合物包含环氧树脂，固化剂和无机填料。 环氧树脂由二环戊二烯系环氧树脂和酚醛清漆型环氧树脂构成。 固化剂是联苯基酚醛树脂。 无机填料由氢氧化铝和具有环氧硅烷处理表面的颗粒状二氧化硅组成。 环氧树脂组合物含有20〜50重量％的粒状二氧化硅。 环氧树脂组合物含有2〜15重量％，相对于粒状二氧化硅的总重量为氢氧化铝。

公开(公告)号：US20100276187A1

公开(公告)日：2010-11-04

申请号：US12811800

申请日：2009-01-16

Applicant: Tadashi Nakamura ,  Fumio Echigo ,  Masaaki Katsumata

Inventor： Tadashi Nakamura ,  Fumio Echigo ,  Masaaki Katsumata

IPC: H05K1/00

CPC classification number: H05K3/4626 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H05K3/4069 ,  H05K3/462 ,  H05K2201/0129 ,  H05K2201/0133 ,  H05K2201/0209 ,  H05K2201/10121 ,  H05K2201/10378 ,  H05K2203/061 ,  Y10T29/49126 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A multilayer printed wiring board (11) is composed of a plurality of printed wiring boards (21a and 21b) each having wiring on its both sides, and a relaxing connection layer (15) for interconnecting the printed wiring boards (21a and 21b). The relaxing connection layer (15) contains an inorganic filler, a thermosetting resin, and a reliever for relieving internal stress. The multilayer printed wiring board (11) is prevented from warpage by making the relaxing connection layer (15) disposed inside it absorb internal stress caused by heating and cooling in a solder reflow process or other processes.

Abstract translation: 多层印刷电路板（11）由在其两侧具有布线的多个印刷电路板（21a和21b）和用于互连印刷电路板（21a和21b）的松弛连接层（15）组成。 松弛连接层（15）包含无机填料，热固性树脂和用于缓解内应力的缓冲器。 通过使位于其内部的松弛连接层（15）通过在回流焊或其它工序中的加热和冷却引起的内部应力来防止多层印刷线路板（11）发生翘曲。

公开(公告)号：US20100258340A1

公开(公告)日：2010-10-14

申请号：US12584596

申请日：2009-09-09

Applicant: Min She Su

Inventor： Min She Su

IPC: H05K1/09 ,  B32B5/02 ,  B32B27/04 ,  B32B17/02

CPC classification number: C08J5/24 ,  C08J5/043 ,  C08J2309/06 ,  H05K1/024 ,  H05K1/0353 ,  H05K1/0366 ,  H05K2201/012 ,  H05K2201/0158 ,  H05K2201/0209 ,  H05K2201/029 ,  Y10T442/2672 ,  Y10T442/2713 ,  Y10T442/2934

Abstract: The invention relates to a composite material and a high-frequency circuit substrate made from the composite material. The composite material includes: a thermosetting composition in an amount of 20 to 70 by weight with respect to the composite material, a fiberglass cloth processed by coupling agent; a powder filler; a fire retardant and a cure initiator. The thermosetting composition includes a resin with molecular weight thereof being less than 11,000, and a low-molecular-weight solid allyl resin. The resin is composed of carbon and hydrogen element. More than 60 percent of the resin is vinyl. The high-frequency circuit substrate made from the composite material comprises: a plurality of prepregs mutually overlapped and copper foils respectively covered on both sides of overlapped prepregs, wherein each prepreg is made from the composite material. The composite material of the present invention realizes easy manufacture of the prepreg and high bonding of the copper foil. The high-frequency circuit substrate made from the composite material has low dielectric constant, low dielectric loss tangent, and excellent heat resistance, and is convenient for process operation. Therefore, the composite material is suitable for making the circuit substrate.

Abstract translation: 本发明涉及由复合材料制成的复合材料和高频电路基板。 复合材料包括：相对于复合材料为20〜70重量％的热固性组合物，由偶联剂处理的玻璃纤维布; 粉末填料; 阻燃剂和固化引发剂。 热固性组合物包括分子量小于11,000的树脂和低分子量固体烯丙基树脂。 树脂由碳和氢元素组成。 超过60％的树脂是乙烯基树脂。 由复合材料制成的高频电路基板包括：相互重叠的多个预浸料和分别覆盖在重叠的预浸料的两侧的铜箔，其中每个预浸料由复合材料制成。 本发明的复合材料实现了预浸料的容易制造和铜箔的高粘合性。 由复合材料制成的高频电路基板具有低介电常数，低介电损耗角正切，耐热性优异，方便操作。 因此，复合材料适合于制造电路基板。

公开(公告)号：US20100248569A1

公开(公告)日：2010-09-30

申请号：US12700725

申请日：2010-02-05

Applicant: Dai Xin PENG ,  Zhuo Wang

Inventor： Dai Xin PENG ,  Zhuo Wang

IPC: B32B5/02 ,  B32B5/22 ,  B32B17/02 ,  B32B15/14 ,  B05D3/00 ,  B32B37/00

CPC classification number: H05K1/0366 ,  H05K2201/0209 ,  H05K2201/029 ,  Y10T428/24917 ,  Y10T428/249921 ,  Y10T428/249986 ,  Y10T428/269 ,  Y10T442/10 ,  Y10T442/152 ,  Y10T442/172 ,  Y10T442/20 ,  Y10T442/2992 ,  Y10T442/322

Abstract: Provided herein are, among other things, epoxy resin varnishes and methods of making and using the same. In some embodiments, the epoxy resin varnishes comprise at least a filler such as silica. In certain embodiments, the epoxy resin varnishes provided herein are used for making laminates such as copper clad laminates. In further embodiments, the copper clad laminates provided herein are used for making printed circuit boards (PCBs).

Abstract translation: 除此之外，本文提供环氧树脂清漆及其制备和使用方法。 在一些实施方案中，环氧树脂清漆至少包含填料如二氧化硅。 在某些实施方案中，本文提供的环氧树脂清漆用于制造层压体，例如覆铜层压板。 在另外的实施例中，本文提供的覆铜层压板用于制造印刷电路板（PCB）。