公开(公告)号：US11805600B2

公开(公告)日：2023-10-31

申请号：US18157918

申请日：2023-01-23

Applicant: SAINT-GOBAIN PERFORMANCE PLASTICS CORPORATION

Inventor： Jennifer Adamchuk ,  Gerard T. Buss ,  Theresa M. Besozzi

IPC: H05K1/03 ,  H05K1/09 ,  H05K1/05

CPC classification number: H05K1/0373 ,  H05K1/05 ,  H05K1/09 ,  H05K2201/0358

Abstract: The present disclosure relates to a dielectric substrate that may include a polyimide layer and a first filled polymer layer overlying the polyimide layer. The first filled polymer layer may include a resin matrix component, and a first ceramic filler component. The first ceramic filler component may include a first filler material. The first filler material may further have a mean particle size of at not greater than about 10 microns.

公开(公告)号：US11680332B2

公开(公告)日：2023-06-20

申请号：US17211400

申请日：2021-03-24

Applicant: FURUKAWA ELECTRIC CO., LTD. ,  MURATA MANUFACTURING CO., LTD.

Inventor： Takahiro Tsuruta ,  Takeo Uno ,  Yuko Okuno ,  Sunao Fukutake ,  Yoshimasa Nishi

IPC: B32B15/08 ,  C25D3/38 ,  C25D5/00 ,  B32B5/02 ,  B32B15/14 ,  B32B15/18 ,  B32B15/20 ,  C25D7/06 ,  H05K1/05 ,  C25D1/04

CPC classification number: C25D5/605 ,  B32B5/024 ,  B32B15/08 ,  B32B15/14 ,  B32B15/18 ,  B32B15/20 ,  C25D3/38 ,  C25D7/0614 ,  H05K1/056 ,  B32B2262/103 ,  B32B2307/538 ,  B32B2457/08 ,  C25D1/04 ,  H05K2201/0141 ,  H05K2201/0358

Abstract: Provided is a surface-treated copper foil excellent in laser processability. The surface-treated copper foil includes a roughened surface formed by subjecting a surface to a roughening treatment, in which when measured using a three-dimensional roughness meter, the roughened surface has a surface skewness Ssk within a range of from −0.300 to less than 0 and an arithmetic mean summit curvature Ssc within a range of from 0.0220 nm−1 to less than 0.0300 nm−1.

公开(公告)号：US20190254169A1

公开(公告)日：2019-08-15

申请号：US16088993

申请日：2017-03-28

Applicant: AT&S (China) Co. Ltd.

Inventor： Annie TAY ,  Mikael TUOMINEN

IPC: H05K1/18 ,  H05K1/11 ,  H05K3/46 ,  H05K1/02 ,  H05K1/09

CPC classification number: H05K1/186 ,  H01L2224/04105 ,  H01L2224/18 ,  H01L2224/2518 ,  H01L2224/96 ,  H05K1/0271 ,  H05K1/09 ,  H05K1/115 ,  H05K1/185 ,  H05K3/4652 ,  H05K3/4655 ,  H05K2201/0358 ,  H05K2201/09136

Abstract: A component carrier includes a core having a recess, an electronic component arranged in the recess, a laminated electrically insulating sheet covering at least part of the core and of the electronic component and filling a gap between a lateral surface of the electronic component and a lateral surface of the core in the recess, and a further electrically insulating layer structure laminated on top of the sheet.

公开(公告)号：US20180354233A1

公开(公告)日：2018-12-13

申请号：US15861346

申请日：2018-01-03

Applicant: Isola USA Corp.

Inventor： Johann R. Schumacher ,  Steven M. Schultz ,  Stanley E. Wilson ,  Tarun Amla

IPC: B32B15/14 ,  B32B5/02 ,  B32B15/20 ,  H05K1/03 ,  H05K3/02 ,  B32B38/00

CPC classification number: B32B15/14 ,  B32B5/024 ,  B32B15/20 ,  B32B2038/0076 ,  B32B2260/021 ,  B32B2260/046 ,  B32B2262/101 ,  B32B2309/105 ,  B32B2311/12 ,  B32B2315/085 ,  B32B2457/08 ,  H05K1/0366 ,  H05K3/022 ,  H05K2201/029 ,  H05K2201/0358 ,  H05K2203/1545 ,  Y10T428/24975

Abstract: Ultrathin copper clad laminates including a fabric sheet material layer having a first planar surface, a second planar surface and an original thickness of from about 10 to about 30 microns and at least one copper foil sheet that is adhered to a planar surface of the fabric sheet material by a cured resin wherein the base laminate has a thickness of from about 1.0 to about 1.75 mils.

公开(公告)号：US09949371B2

公开(公告)日：2018-04-17

申请号：US15241749

申请日：2016-08-19

Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC. ,  PI R&D CO., LTD.

Inventor： Mitsuru Nozaki ,  Akihiro Nomoto ,  Norikatsu Akiyama ,  Eiji Nagata ,  Masashi Yano

IPC: H05K1/09 ,  B32B15/08 ,  C25D1/04 ,  C25D7/06 ,  H05K1/03 ,  H05K3/38 ,  H05K3/46 ,  C25D5/02

CPC classification number: H05K1/09 ,  B32B15/08 ,  C25D1/04 ,  C25D5/022 ,  C25D7/0614 ,  C25D7/0678 ,  H05K1/0346 ,  H05K1/0373 ,  H05K3/384 ,  H05K3/4652 ,  H05K2201/0154 ,  H05K2201/0355 ,  H05K2201/0358 ,  H05K2203/0307 ,  Y10T428/31681

Abstract: The problem of the invention is to provide a resin composite electrolytic copper foil having further improved heat resistance and improved plate adhesion strength when plated after desmear treatment in the work process of an additive method. The solution is to form a roughened surface having a plurality of minute projections, a surface roughness (Rz) within a range of 1.0 pm to 3.0 pm and a lightness value of not more than 30 on one surface of an electrolytic copper foil (A), and form a layer of a resin composition (B) containing a block copolymerized polyimide resin (a) having a structure that imide oligomers of a first structural unit and a second structural unit are bonded alternately and repeatedly on the roughened surface.

公开(公告)号：US20170084509A1

公开(公告)日：2017-03-23

申请号：US14946044

申请日：2015-11-19

Applicant: HongQiSheng Precision Electronics (QinHuangDao) Co.,Ltd. ,  FuKui Precision Component (Shenzhen) Co., Ltd. ,  Zhen Ding Technology Co., Ltd.

Inventor： YU-CHENG HUANG

IPC: H01L23/13 ,  H05K3/46 ,  H05K1/03 ,  H05K1/11 ,  H01L23/00 ,  H01L21/48

CPC classification number: H01L21/481 ,  H01L23/49822 ,  H01L23/49827 ,  H01L24/16 ,  H01L2924/014 ,  H01L2924/15333 ,  H05K1/16 ,  H05K1/162 ,  H05K1/167 ,  H05K3/06 ,  H05K3/383 ,  H05K3/429 ,  H05K3/4608 ,  H05K3/4652 ,  H05K2201/0355 ,  H05K2201/0358 ,  H05K2201/09136 ,  H05K2203/0353

Abstract: A substrate includes a base layer, first and second circuit layers both coupled to the base layer, a third circuit layer, a fourth circuit layer and two solder resist layers. The first/second circuit layer defines a first/second opening. The third and fourth circuit layers are located at two sides of the first and second circuit layers. The solder resist layers cover outer faces of the third and fourth circuit layers. Each solder resist layer defines a window. The first opening is deviated from the second opening. The third and fourth circuit layers each have a portion exposed to the window to be a solder pad. The first circuit layer and the third circuit layer have a total thickness no more than that of the second circuit layer and the fourth circuit layer. A chip package with the substrate and a method for manufacturing the substrate are also provided.

公开(公告)号：US20160338194A1

公开(公告)日：2016-11-17

申请号：US15133471

申请日：2016-04-20

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Youn-Gyu HAN ,  Sang-jae LEE

IPC: H05K1/02 ,  H05K1/03 ,  H05K3/46 ,  H05K3/00 ,  H05K3/40 ,  H05K3/02 ,  H05K3/18 ,  H05K1/09 ,  H05K3/06

CPC classification number: H05K3/0038 ,  H05K3/0035 ,  H05K3/022 ,  H05K3/108 ,  H05K3/427 ,  H05K2201/0358 ,  H05K2203/0156

Abstract: A copper clad laminate and a method to manufacture the same are provided. In one general aspect, a copper clad laminate include a first copper clad layer on a first surface of an insulating layer, and a second copper clad layer on a second surface of the insulating layer. The second copper clad layer includes polymer resin layer, a second copper layer, and a carrier foil layer.

Abstract translation: 提供了一种覆铜层压板及其制造方法。 在一般的方面，覆铜层压板包括在绝缘层的第一表面上的第一铜包覆层和在绝缘层的第二表面上的第二铜包层。 第二铜包覆层包括聚合物树脂层，第二铜层和载体箔层。

公开(公告)号：US20160207287A1

公开(公告)日：2016-07-21

申请号：US15084963

申请日：2016-03-30

Applicant: FURUKAWA ELECTRIC CO., LTD.

Inventor： Yong Hoon Kim

IPC: B32B15/08 ,  B32B27/40 ,  B32B27/38 ,  B32B27/28 ,  B32B27/36

CPC classification number: B32B15/08 ,  B32B1/08 ,  B32B27/281 ,  B32B27/36 ,  B32B27/38 ,  B32B27/40 ,  B32B2255/06 ,  B32B2255/20 ,  B32B2264/102 ,  B32B2307/206 ,  B32B2457/00 ,  H05K3/385 ,  H05K2201/0358 ,  H05K2203/0307 ,  H05K2203/0315 ,  H05K2203/0392 ,  H05K2203/107

Abstract: The present invention relates to a copper-resin composite body and provides the copper-resin composite body which is excellent in adhesive property between copper and resin and is applicable to a continuous production process such as a wire production process. The present invention uses the copper-resin composite body including a metal made of copper or a copper alloy and resin adhering to the metal via a nanoporous layer formed on a surface of the metal. It is preferable that the nanoporous layer contains copper-oxide particles of 5 nm to 500 nm in average particle diameter. Further, a process for producing the copper-resin composite body includes a process for forming a copper-oxide nanoporous layer on the surface of the metal made of copper or the copper alloy by irradiating the surface of the metal with laser and a process for forming resin on the copper-oxide nanoporous layer.

Abstract translation: 铜树脂复合体技术领域本发明涉及一种铜树脂复合体，其特征在于，提供铜和树脂之间的粘合性优异的铜树脂复合体，适用于线材生产过程等连续生产工序。 本发明使用包含由铜或铜合金制成的金属的铜树脂复合体以及通过形成在金属表面上的纳米多孔层附着在金属上的树脂。 纳米多孔层优选含有平均粒径为5nm〜500nm的氧化铜粒子。 此外，铜树脂复合体的制造方法包括通过用激光照射金属的表面，在铜或铜合金的金属的表面上形成氧化铜纳米孔层的工序和成形工序 树脂在氧化铜纳米多孔层上。

公开(公告)号：US08826526B2

公开(公告)日：2014-09-09

申请号：US13281735

申请日：2011-10-26

Applicant: Shinnosuke Maeda

Inventor： Shinnosuke Maeda

IPC: H05K3/20 ,  H05K3/36 ,  H05K1/00 ,  H01L21/48 ,  H05K3/46 ,  H05K3/00

CPC classification number: H05K3/4682 ,  H01L21/4857 ,  H05K3/0026 ,  H05K2201/0358 ,  H05K2203/0228 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49156

Abstract: A method of manufacturing a multilayer wiring substrate is provided. A foil of a metal-foil-clad resin insulation material is brought into contact with a foil of a metal-foil-clad support substrate. A peripheral edge portion of the resin insulation material exposed as a result of removal of a peripheral edge portion of the foil is adhered to the foil of the support substrate. A plurality of conductor layers and a plurality of resin insulation layers are laminated so as to obtain a laminate structure having a wiring laminate portion, which is to become the multilayer wiring substrate. The laminate structure is cut along a boundary between the wiring laminate portion and a surrounding portion, and the surrounding portion is removed. The wiring laminate portion is separated from the support substrate along the boundary between the two foils.

Abstract translation: 提供一种制造多层布线基板的方法。 使金属箔包覆的树脂绝缘材料的箔与覆盖金属箔的支撑衬底的箔接触。 由于去除箔的周缘部而露出的树脂绝缘材料的周边部分被粘附到支撑基板的箔上。 层叠多个导体层和多个树脂绝缘层，以获得具有将成为多层布线基板的布线层叠部分的层叠结构。 层叠结构沿着布线层压体部分和周围部分之间的边界被切割，并且周围部分被去除。 布线层叠部分沿着两个箔片之间的边界与支撑基板分离。

公开(公告)号：US20140231007A1

公开(公告)日：2014-08-21

申请号：US14196799

申请日：2014-03-04

Applicant: Isola USA Corp.

Inventor： Johann R. Schumacher ,  Steven M. Schultz ,  Stanley E. Wilson ,  Tarun Amla

IPC: B32B15/14

CPC classification number: B32B15/14 ,  B32B5/024 ,  B32B15/20 ,  B32B2038/0076 ,  B32B2260/021 ,  B32B2260/046 ,  B32B2262/101 ,  B32B2309/105 ,  B32B2311/12 ,  B32B2315/085 ,  B32B2457/08 ,  H05K1/0366 ,  H05K3/022 ,  H05K2201/029 ,  H05K2201/0358 ,  H05K2203/1545 ,  Y10T428/24975

Abstract: Ultrathin copper clad laminates including a fabric sheet material layer having a first planar surface, a second planar surface and an original thickness of from about 10 to about 30 microns and at least one copper foil sheet that is adhered to a planar surface of the fabric sheet material by a cured resin wherein the base laminate has a thickness of from about 1.0 to about 1.75 mils.

Abstract translation: 超薄铜箔层压板包括具有第一平表面，第二平面表面和约10至约30微米的原始厚度的织物片材层和至少一个铜箔片，所述铜箔片粘附到织物片的平坦表面上 材料通过固化树脂，其中基底层压板具有约1.0至约1.75密耳的厚度。