公开(公告)号：US5010450A

公开(公告)日：1991-04-23

申请号：US247151

申请日：1988-09-21

Applicant: David A. Werdin ,  Reinhold Henke

Inventor： David A. Werdin ,  Reinhold Henke

IPC: G06F13/40 ,  H05K1/02 ,  H05K7/14

CPC classification number: G06F13/409 ,  H05K1/0231 ,  H05K7/1445 ,  H05K2201/09772 ,  H05K2201/10522 ,  H05K2201/10689

Abstract: Front and rear modular conversion unit has a chassis including four side-walls and open and front rear ends. A motherboard printed circuit board mounted inside the chassis forms front and rear module insertion areas and has a plurality of connectors for receiving a cooperating mating connector, with the connecters mounted on both sides. Conversion card modules are mounted in the front end of the chassis and mate with the connectors to convert electrical signals to fiber optic signals. Rear card modules condition the electrical signals.

Abstract translation: 前后模块转换单元具有底盘，包括四个侧壁和开放前后端。 安装在机箱内的主板印刷电路板形成前后模块插入区域，并且具有多个用于接收配合的配合连接器的连接器，连接器安装在两侧。 转换卡模块安装在机箱的前端，并与连接器配合，将电信号转换为光纤信号。 后卡模块对电气信号进行调节。

公开(公告)号：US4352994A

公开(公告)日：1982-10-05

申请号：US261698

申请日：1981-05-08

Applicant: Luciano Inzoli ,  Gino Piccioni

Inventor： Luciano Inzoli ,  Gino Piccioni

IPC: H05K1/00 ,  H05K1/02 ,  H02J1/00

CPC classification number: H05K1/0218 ,  H05K1/0287 ,  H05K2201/09236 ,  H05K2201/09772 ,  H05K2201/10689

Abstract: A printed-circuit board designed to energize a multiplicity of integrated chips or other modular units comprises on a first face two closely spaced main conductor strips, respectively connected to an ungrounded and a grounded terminal of a d-c source, extending along an edge thereof, together with a number of ancillary ground conductors paralleling these strips at substantially equispaced locations. The second face carries a multiplicity of branch lines perpendicular to the strips, each line consisting of two closely spaced leads respectively joined to the ungrounded strip and to the main and ancillary ground conductors through connectors traversing the board. The leads of each branch line are bridged by several storage capacitors and are so spaced apart and dimensioned as to provide a line inductance low enough to make the resonance frequency of the line substantially higher than the operating frequency of the associated loads. Each modular unit has two rows of terminal pins which straddle one of the branch lines and are connected to the leads thereof by short stubs, these chips lying singly or in small groups between the mutually parallel conductors located on the opposite face.

Abstract translation: 设计用于激励多个集成芯片或其他模块化单元的印刷电路板包括在第一面上的两个紧密间隔的主导体条，分别连接到直流源的未接地端子和接地端子，沿其边缘延伸 其中许多辅助接地导体在基本上等间隔的位置处与这些条平行。 第二面带有垂直于条带的多条分支线，每条线由两个紧密间隔的引线组成，分别通过穿过该板的连接器连接到未接地的条带以及主和辅助接地导体。 每个分支线的引线由几个存储电容器桥接，并且被间隔开并且尺寸设置成提供足够低的线路电感，以使线路的谐振频率基本上高于相关负载的工作频率。 每个模块单元具有两排端子销，其跨越分支线之一并且通过短截线连接到其引线，这些芯片在位于相对面上的相互平行的导体之间单独地或者小组地位于相互平行的导体之间。

公开(公告)号：US4326239A

公开(公告)日：1982-04-20

申请号：US74471

申请日：1979-09-11

Applicant: Mitsuo Ohsawa ,  Masato Yamamura ,  Toshio Takahashi

Inventor： Mitsuo Ohsawa ,  Masato Yamamura ,  Toshio Takahashi

IPC: H05K3/34 ,  H01R12/00 ,  H05K1/02 ,  H05K1/18 ,  H05K3/30

CPC classification number: H05K3/305 ,  H05K1/0269 ,  H05K2201/09772 ,  H05K2201/10583 ,  H05K2201/10636 ,  H05K2203/161 ,  H05K2203/168 ,  H05K3/3452 ,  Y02P70/611 ,  Y02P70/613

Abstract: A printed circuit board includes an insulating board; at least one pair of conductive patterns arranged on the insulating board and spaced from each other by a predetermined length; and a paint layer formed in the space between the conductive patterns within a predetermined range.

Abstract translation: 印刷电路板包括绝缘板; 至少一对导电图案布置在绝缘板上并彼此隔开预定长度; 以及在预定范围内在导电图案之间的空间中形成的涂料层。

公开(公告)号：US4016463A

公开(公告)日：1977-04-05

申请号：US407181

申请日：1973-10-17

Applicant: Robert J. Beall ,  Fred K. Buelow ,  John J. Zasio

Inventor： Robert J. Beall ,  Fred K. Buelow ,  John J. Zasio

IPC: H05K1/18 ,  H05K1/00 ,  H05K1/02 ,  H05K1/11 ,  H05K3/22 ,  H05K3/42 ,  H05K3/46 ,  H02B1/00

CPC classification number: H05K1/112 ,  H05K1/0287 ,  H05K1/0292 ,  H05K1/0237 ,  H05K1/0298 ,  H05K2201/09227 ,  H05K2201/09609 ,  H05K2201/09772 ,  H05K2201/10689 ,  H05K3/429 ,  H05K3/4611

Abstract: A high density multilayer printed circuit card assembly having plated through holes in electrical contact with the layers of conducting metal. The card is provided with bonding pads in contact with the plated through holes whereby wiring may be selectively utilized to form interconnections for components carried by the card. Signal lines are brought to the surface so that they can be interrupted and changes be made by wiring. Components of various types are arranged in rows to facilitate cooling.

Abstract translation: 一种高密度多层印刷电路卡组件，其具有与导电金属层电接触的通孔。 该卡设置有与电镀通孔接触的接合焊盘，由此可以选择性地利用布线来形成用于由卡承载的部件的互连。 信号线被带到表面，使得它们可以被中断并且通过布线进行改变。 各种类型的部件被排列成行以便于冷却。