Abstract:
A light emitting device includes a substrate having a top surface, upper and lower metal layers, multiple LED chips, at least one Zener diode, multiple conductive wires and an encapsulant. The top surface includes a central region bounded by an imaginary boundary with a profile conforming to an outline of a circle stacked with a polygon. The central region has a die bonding area corresponding to the circle, and at least one polygonal extension area formed outside the die bonding area. The upper metal layer includes multiple conducting pads surrounding the central region. The LED chips are disposed on the die bonding area. The Zener diode is disposed on the polygonal extension area. The encapsulant is disposed on the substrate and covers the LED chips.
Abstract:
A white light emitting device includes an LED chip capable of emitting light with a peak wavelength of 390 to 430 nm, and a wavelength conversion layer including first, second and third fluorescent materials. The first fluorescent material is capable of being excited to emit light with a peak wavelength of 450 to 470 nm. The second fluorescent material is capable of being excited to emit light with a peak wavelength of 450 to 470 nm. The third fluorescent material is capable of being excited to emit light with a peak wavelength of 630 to 650 nm. Light emitted by the white light emitting device has a color temperature below 5000 K, and a general color rendering index value (Ra) and special color rendering index values (R9-R15) all greater than 90.
Abstract:
In a method for generating a depth map for an image, an image processing apparatus is configured to: determine a depth level for each of at least two objects in the image according to an angle of incidence in which light incident upon the object is projected onto an image sensor of a light-field camera; calculate a depth value of the depth level associated with one of the objects; estimate a depth value for the depth level associated with another one of the objects; and generate a depth map according to the depth values. The depth value is estimated based on a distance between first and second locations on the image sensor, on which light incident upon the reference and relative objects are projected.
Abstract:
A plugging device includes a supporting frame having two opposite side plates disposed between front and rear ends thereof, at least one slide member adapted to be connected to one side of an electronic component and connected slidably to an inner surface of one of the side plates, and an operating member having at least one lever that includes a fulcrum portion connected pivotally to one of the side plates. When the operating member is pivoted rearwardly about the fulcrum portion, the slide member together with the electronic component is driven to slide relative to the supporting frame in a forward direction for plugging a plug electrical connector of the electronic component into a socket electrical connector.
Abstract:
A relay driving device includes first and second power supply modules, a switching circuit, and a control module. The first power supply module outputs a first voltage that has a magnitude sufficient to activate the relay. The second power supply module outputs a second voltage that has a magnitude sufficient to maintain an activated state of the relay. The control module is configured to control the switching circuit to connect the relay to the first power supply module so as to provide the first voltage to the relay for activating the relay, and to subsequently connect the relay to the second power supply module so as to provide the second voltage to the relay for maintaining the activated state of the relay.
Abstract:
A loudspeaker noise inspection method is to be implemented by an electronic device and includes the steps of: obtaining a frequency sweeping audio signal from an audio output generated by a loudspeaker in response to a frequency sweeping input signal; performing differentiation upon the frequency sweeping audio signal so as to generate a differentiated frequency sweeping audio signal; and dividing the differentiated frequency sweeping audio signal by a constant which is greater than 2π times a maximum frequency of the frequency sweeping audio signal, so as to obtain an attenuated frequency sweeping audio signal for inspection of a noise pulse in the frequency sweeping audio signal.
Abstract:
A hinge for pivotally interconnecting first and second brackets includes a shaft having a shaft body extending through the first and second brackets and formed with an engaging end portion proximate to the second bracket, a fixing member connected to the engaging end portion, a ratchet sleeved rotatably on the shaft body between the fixing member and the second bracket, a friction mechanism having an urging unit sleeved on the shaft body between the ratchet and the fixing member and pressing the ratchet toward the second bracket, and a brake mechanism disposed on the second bracket and having a pawl member releasably engaged to the ratchet.
Abstract:
A clip assembly includes a seat having a surrounding wall with a receiving hole, and a locking mechanism proximate to the surrounding wall and including a pair of movable levers. Each movable lever has an engaging portion movably inserted into the receiving hole, and a driven portion. A drive unit has a button that is moved to a pressed position, where the driven portions are pushed to move away from each other and out of the receiving hole. A clip mechanism includes a connection body received in the receiving hole and having two connecting holes to respectively engage the engaging portions. The engaging portions are disengageable from the connecting holes by pressing the button.
Abstract:
A light source device of a backlight module includes a back frame unit and a light-emitting diode (LED) package structure. The back frame unit includes a thermal conductive base plate, and a casing part having a first plate spaced apart from and parallel to the base plate. The LED package structure is disposed between the base and first plates, and includes a package body having a light-emitting surface, and two lateral surfaces respectively facing the base plate and the first plate. A lead frame unit includes a lead frame partially exposed from the lateral surfaces of the package body to form first and second heat-conducting paths with the base and first plates, respectively.
Abstract:
A light emitting diode (LED) component includes a base having a main body and a wiring pattern. The main body defines an axis and includes two connecting surfaces respectively located at two opposite sides thereof, and a plurality of interconnected mounting surfaces surrounding the axis and connected between the connecting surfaces. The wiring pattern is at least disposed on the mounting surfaces and includes electrically insulated anode and cathode. A plurality of light emitting diode (LED) chips are disposed on the mounting surfaces. Each LED chip is electrically connected to the anode and the cathode.