公开(公告)号：US5939472A

公开(公告)日：1999-08-17

申请号：US841312

申请日：1997-04-30

Applicant: Hiromi Ito ,  Takumi Kikuchi ,  Hirofumi Fujioka ,  Hirozoh Kanegae ,  Yoshifumi Itabashi ,  Fumio Nogami

Inventor： Hiromi Ito ,  Takumi Kikuchi ,  Hirofumi Fujioka ,  Hirozoh Kanegae ,  Yoshifumi Itabashi ,  Fumio Nogami

IPC: B29C39/10 ,  B29K63/00 ,  B29L31/34 ,  C08G59/20 ,  C08G59/22 ,  C08G59/24 ,  C08G59/26 ,  C08G59/30 ,  C08G59/40 ,  C08G59/42 ,  C08K3/22 ,  C08K3/36 ,  C08K5/5415 ,  C08K5/56 ,  C08L63/00 ,  H01B3/40 ,  C08L63/02

CPC classification number: H01B3/40 ,  C08G59/226 ,  C08G59/245 ,  C08G59/26 ,  C08G59/30 ,  C08G59/42 ,  C08L63/00

Abstract: Epoxy resin composition for molding comprising epoxy resin (A), acid anhydride (B), curing accelerator (C), coupling agent (D) and filler (E), process for preparing molded product used for apparatus for high voltage made of the epoxy resin composition for molding and molded product produced by the process for preparing the molded product. The epoxy resin composition has excellent mechanical properties such as high mechanical strength and high toughness and excellent thermal resistance, the process for preparing the molded product can provide molded product made of the epoxy resin composition, and the produced molded product has excellent crack resistance and high reliability.

Abstract translation: 环氧树脂（A），酸酐（B），固化促进剂（C），偶联剂（D）和填料（E））的模塑用环氧树脂组合物，用于制备由环氧树脂 用于模塑的树脂组合物和通过制备模制产品的方法制备的模塑产品。 环氧树脂组合物具有机械强度高，韧性高，耐热性优异的机械性能优异，制备成型体的方法可以提供由环氧树脂组合物制成的模制品，并且生产的模制产品具有优异的抗裂性和高 可靠性。

公开(公告)号：US5880179A

公开(公告)日：1999-03-09

申请号：US774068

申请日：1996-12-23

Applicant: Hiromi Ito ,  Takumi Kikuchi ,  Hirofumi Fujioka ,  Hirozoh Kanegae ,  Yoshifumi Itabashi ,  Fumio Nogami

Inventor： Hiromi Ito ,  Takumi Kikuchi ,  Hirofumi Fujioka ,  Hirozoh Kanegae ,  Yoshifumi Itabashi ,  Fumio Nogami

IPC: B29C39/10 ,  B29K63/00 ,  B29L31/34 ,  C08G59/20 ,  C08G59/22 ,  C08G59/24 ,  C08G59/26 ,  C08G59/30 ,  C08G59/40 ,  C08G59/42 ,  C08K3/22 ,  C08K3/36 ,  C08K5/5415 ,  C08K5/56 ,  C08L63/00 ,  H01B3/40 ,  C08L63/02 ,  H01F27/30 ,  H02K1/04

CPC classification number: H01B3/40 ,  C08G59/226 ,  C08G59/245 ,  C08G59/26 ,  C08G59/30 ,  C08G59/42 ,  C08L63/00

Abstract: "Molded products for high voltage apparatus comprising an" epoxy resin composition for molding comprising an epoxy resin (A), an acid anhydride (B), a curing accelerator (C), at least one coupling agent (D) and a filler (E). The epoxy resin (A) is a bifunctional brominated bisphenol A or a brominated bisphenol F, "epoxy resin and at least one bisphenol A, bisphenol F or bisphenol epoxy resin". The coupling agent (D) is selected from the group consisting of epoxysilane type coupling agents, phenylaminosilane type coupling agents, mercaptosilane type coupling agents and titanate type coupling agents, which has an average particle diameter of not more than 60 .mu.m and in which the content of particles having a diameter of not more than 5 .mu.m is not less than 5% by weight. The filler (E) comprises at least one of silica fillers or alumina fillers. The ratio of the number of acid anhydride groups of the acid anhydride (B) to the number of epoxy groups of the epoxy resin (A) is 0.5 to 1.5; the amount of the curing accelerator (C) is 0.5 to 10 parts by weight based on 100 parts by weight of the epoxy resin (A); the amount of the coupling agent (D) is 0.05 to 5 parts by weight based on 100 parts by weight of the filler (E); and the content of the filler (E) is 35 to 95% by weight of the resin composition. The epoxy resin composition has excellent mechanical properties such as high mechanical strength and toughness, and excellent thermal resistance.

Abstract translation: “包含环氧树脂（A），酸酐（B），固化促进剂（C），至少一种偶联剂（D）和填料（E））的成型用环氧树脂组合物的高压设备用成型体 ）。 环氧树脂（A）是双官能溴化双酚A或溴化双酚F“环氧树脂和至少一种双酚A，双酚F或双酚环氧树脂”。 偶联剂（D）选自环氧硅烷型偶联剂，苯基氨基硅烷型偶联剂，巯基硅烷型偶联剂和钛酸酯型偶联剂，其平均粒径不大于60μm，其中 直径不大于5μm的颗粒的含量不小于5重量％。 填料（E）包括二氧化硅填料或氧化铝填料中的至少一种。 酸酐（B）的酸酐基与环氧树脂（A）的环氧基数的比例为0.5〜1.5; 相对于100重量份的环氧树脂（A），固化促进剂（C）的使用量为0.5〜10重量份。 相对于100重量份的填料（E），偶联剂（D）的量为0.05〜5重量份。 填料（E）的含量为树脂组合物的35〜95重量％。 环氧树脂组合物具有优异的机械强度和韧性等机械性能，耐热性优异。

公开(公告)号：US5180691A

公开(公告)日：1993-01-19

申请号：US827220

申请日：1992-01-30

Applicant: Etsushi Adachi ,  Hiroshi Adachi ,  Hiroshi Mochizuki ,  Hirozoh Kanegae

Inventor： Etsushi Adachi ,  Hiroshi Adachi ,  Hiroshi Mochizuki ,  Hirozoh Kanegae

IPC: H01L21/312 ,  H01L21/3205 ,  H01L21/56 ,  H01L21/768 ,  H01L23/29 ,  H01L23/31 ,  H01L23/52 ,  H01L23/522

CPC classification number: H01L24/05 ,  H01L23/296 ,  H01L24/03 ,  H01L24/48 ,  H01L2224/02166 ,  H01L2224/04042 ,  H01L2224/05624 ,  H01L2224/45144 ,  H01L2224/48463 ,  H01L2224/48624 ,  H01L24/45 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01044 ,  H01L2924/01072 ,  H01L2924/01077 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01092 ,  H01L2924/181

Abstract: The disclosed is a method of manufacturing a semiconductor device sealed with molding resin. An aluminum interconnection including an aluminum electrode pad is formed on a semiconductor substrate having an element. A silicone ladder polymer expressed by the following general formula is formed on the semiconductor substrate to cover the element. The silicone ladder polymer film is selectively etched by an aromatic organic solvent to expose the surface of the aluminum electrode pad. The temperature of the silicone ladder polymer film is elevated at a temperature elevating rate of 20.degree. C./min or more, and then, the silicone ladder polymer film is cooled at a cooling rate of 20.degree. C./min or more to form a cured stress buffering protective film for buffering a stress applied to the element. ##STR1## (in the formula, n is an integer which makes the weight-average molecular weight be in the range of 100,000 to 200,000.)

Abstract translation: 所公开的是用模制树脂密封的半导体器件的制造方法。 在具有元件的半导体衬底上形成包括铝电极焊盘的铝互连。 在半导体衬底上形成由以下通式表示的硅树脂聚合物以覆盖该元件。 通过芳族有机溶剂选择性地蚀刻硅树脂聚合物膜以暴露铝电极焊盘的表面。 硅树脂聚合物膜的温度以20℃/分钟以上的升温速度升高，然后将硅树脂聚合物膜以20℃/分钟以上的冷却速度冷却，形成 用于缓冲施加到元件的应力的固化的应力缓冲保护膜。 （式中，n是使重均分子量在100,000〜200000的范围内的整数。