公开(公告)号：US20200292131A1

公开(公告)日：2020-09-17

申请号：US16748854

申请日：2020-01-22

Applicant: KCTECH CO., LTD.

Inventor： Dong Min Kim

IPC: F17C7/00 ,  H05B1/02 ,  H01L21/67

Abstract: The present invention relates to a fluid supply apparatus, that is, a fluid supply apparatus configured to supply a fluid having a predetermined temperature to a chamber. The fluid supply apparatus according to the present invention includes a supply line through which a fluid to be supplied to a chamber flows, at least one bypass line which branches off from a first branch portion of the supply line and connected to a second branch portion of the supply line, and a heater configured to heat the fluid flowing through the bypass line.

公开(公告)号：US20200157382A1

公开(公告)日：2020-05-21

申请号：US16323514

申请日：2017-06-16

Applicant: KCTECH CO.,LTD.

Inventor： Han Teo PARK ,  Hyun Goo KONG ,  Sang Mi LEE

IPC: C09G1/02 ,  C09K3/14

Abstract: The present invention relates to a slurry composition for polishing a tungsten barrier layer. A slurry composition for polishing a tungsten barrier layer according to an embodiment of the present invention comprises abrasive grains and a sulfur-containing amino acid, and can improve edge over erosion (EOE).

公开(公告)号：US20200002573A1

公开(公告)日：2020-01-02

申请号：US16426906

申请日：2019-05-30

Applicant: KCTECH CO., LTD.

Inventor： Hyungoo Kong ,  Jinsook Hwang ,  Sangmi Lee ,  Inseol Hwang ,  Nara Shin

IPC: C09G1/02

Abstract: Provided is a polishing slurry composition including colloidal silica abrasive particles, a metal oxide monomolecular complexing agent, an oxidizer, and a pH adjusting agent, a water-soluble polymer, or both.

公开(公告)号：US20250145858A1

公开(公告)日：2025-05-08

申请号：US18938286

申请日：2024-11-06

Applicant: KCTECH CO., LTD.

Inventor： Jin Sook HWANG ,  Se Jin LIM

IPC: C09G1/02 ,  B24B37/04 ,  C08F226/02

Abstract: A slurry composition for polishing a metal film, and a method for chemical mechanical polishing (CMP) of a substrate using the slurry composition are provided. The slurry composition includes a polishing regulator, and the polishing regulator includes a copolymer comprising a polymer with an allylamine-based structural unit and a polymer with a structural unit including at least one element among sulfur (S), phosphorus (P), and nitrogen (N).

公开(公告)号：US20250002755A1

公开(公告)日：2025-01-02

申请号：US18684241

申请日：2022-08-08

Applicant: KCTECH CO., LTD.

Inventor： Jin Sook HWANG ,  Hyun Goo KONG ,  Yun Su KIM

IPC: C09G1/02 ,  C09K3/14

Abstract: The present invention relates to a slurry composition for metal polishing, comprising: colloidal silica; and an oxidizing agent; and at least one selected from among a polishing catalyst, a metal polishing enhancer, a polishing inhibitor, and a dishing and erosion reducer, wherein the colloidal silica has a particle size distribution of colloidal silica according to equation 1.

公开(公告)号：US20240066657A1

公开(公告)日：2024-02-29

申请号：US18140977

申请日：2023-04-28

Applicant: KCTECH CO., LTD.

Inventor： Ji Hoon SON ,  Jeong Heon HAN ,  Ki Hyuk YANG

IPC: B24B37/005 ,  G01B11/06 ,  G01N21/31 ,  G06N3/08

CPC classification number: B24B37/005 ,  G01B11/06 ,  G01N21/31 ,  G06N3/08

Abstract: Provided are a control method, a control apparatus, a training method, and a training apparatus based on thickness estimation of a wafer substrate. The training method includes generating a training spectrum signal according to a thickness of a wafer substrate using an optical model, generating a training spectrum signal having a noise by applying a noise based on a noise parameter to the training spectrum signal, calculating a similarity between the training spectrum signal having the noise and an actually measured spectrum signal, and when the similarity satisfies a set condition, training a noise reduction model using the training spectrum signal having the noise.

公开(公告)号：US20230212429A1

公开(公告)日：2023-07-06

申请号：US18088607

申请日：2022-12-25

Applicant: KCTECH CO., LTD.

Inventor： Jung Yoon KIM ,  In Seol HWANG ,  Hyun Goo KONG

IPC: C09G1/02

CPC classification number: C09G1/02

Abstract: Provided is a slurry composition for a metal film for a contact process. A polishing slurry composition includes abrasive particles, a compound including one or more functional groups capable of hydrogen bonding, a nonionic polymer including one or more hydrophilic functional groups in a repeating unit structure, and an oxidizer.

公开(公告)号：US11592342B2

公开(公告)日：2023-02-28

申请号：US16823705

申请日：2020-03-19

Applicant: KCTECH CO., LTD.

Inventor： Jae Won Lee ,  Ju Young Lee ,  Kyung Cheol Jeong ,  Jun Ho Lee ,  Yong Guk Park

IPC: G01K13/02 ,  G01K1/14 ,  G01K1/143

Abstract: Disclosed is a temperature detection device. The device for detecting temperature of a processing liquid for substrate processing according to an embodiment includes a temperature measurement sensor installed adjacent to an outer surface of a tube through which the processing liquid flows, in which the temperature measurement sensor senses the temperature of the processing liquid in the tube.

公开(公告)号：US11332641B2

公开(公告)日：2022-05-17

申请号：US17123115

申请日：2020-12-16

Applicant: KCTECH CO., LTD.

Inventor： Gi Joo Shin ,  Jung Yoon Kim ,  Kwang Soo Park ,  Soo Wan Choi

IPC: C09G1/02 ,  C09K3/14 ,  H01L21/3105

Abstract: A polishing slurry composition enabling implementation of multi-selectivity is provided. The polishing slurry composition includes: a polishing liquid including abrasive particles; and an additive liquid, in which the additive liquid includes a polymer having an amide bond, and a cationic polymer.

公开(公告)号：US20220119679A1

公开(公告)日：2022-04-21

申请号：US17418546

申请日：2019-11-18

Applicant: KCTECH CO., LTD.

Inventor： Jae Woo LEE ,  Ji Hye KIM ,  Bo Hyeok CHOI

IPC: C09G1/02 ,  H01L21/321

Abstract: The present disclosure relates to a CMP slurry composition for polishing polycrystalline silicon and a polishing method using the same. A CMP slurry composition for polishing polycrystalline silicon according to an embodiment of the present disclosure includes: abrasive particles; a surface roughness reducing agent; a polishing regulator containing an organic acid; and a pH regulator.