-
公开(公告)号：US20190332098A1
公开(公告)日：2019-10-31
申请号：US16407052
申请日：2019-05-08
Applicant: LedEngin, Inc.
Inventor： Xiantao Yan , Kachun Lee
IPC: G05B19/418 , F21K9/90 , F21K9/64 , F21K9/60 , H01L33/00
Abstract: An emitter for an LED-based lighting device has multiple groups of LEDs that are independently addressable, allowing the emitter to be tuned to a desired color bin (e.g., a specific white color) by adjusting the relative current supplied to different groups. The LED dies for the groups and a phosphor chip for each LED die are individually selected such that each LED-die/phosphor-chip combination produces light in a desired source region associated with the group to which the LED belongs. Robotic pick-and-place systems can be used to automate assembly of the emitters by selecting LED dies from a bin based on spectral characteristics and phosphor chips from a number of distinct phosphor chip types.
-
公开(公告)号：US20190293261A1
公开(公告)日：2019-09-26
申请号：US15974567
申请日：2018-05-08
Applicant: LedEngin, Inc.
Inventor： Wu Jiang
IPC: F21V5/00
Abstract: An optical system for a multi-color, multi-emitter LED-based lighting device can include a lens array. The lens array can include a number of color-mixing rod members extending parallel to each other along an optical axis, the color-mixing rod members being arranged and spaced so that the rear end of each color-mixing rod member aligns with a different one of the emitters. A beam-forming section can be formed at the front ends of the color mixing rod members. The beam-forming section can include nonplanar (e.g., convex or concave) front surface features, each nonplanar front surface feature being aligned with a front end of a corresponding one of the color-mixing rod members. The beam-forming section and color-mixing rod members can be formed as a unitary structure.
-
公开(公告)号：US10219345B2
公开(公告)日：2019-02-26
申请号：US15348940
申请日：2016-11-10
Applicant: LedEngin, Inc.
Inventor： Xiantao Yan , Kachun Lee , Shifan Cheng , Julio Cesar Alvarado
Abstract: A light emitting device can include a substrate with LED chips disposed on a surface of the substrate. The LED chips can include chips of at least four different colors. Electrical paths disposed in part on the substrate and in part within the substrate can connect the LED chips into at least three independently addressable groups, and the number of independently addressable groups can be less than the number of colors of LED chips, so that at least one of the groups includes LED chips of two or more different colors.
-
公开(公告)号：US10149363B2
公开(公告)日：2018-12-04
申请号：US15144747
申请日：2016-05-02
Applicant: LedEngin, Inc.
Inventor： Xiantao Yan , Kachun Lee , David Tahmassebi
Abstract: A method for making a light-emitting diode (LED) emitter module includes providing a substrate and providing two or more groups of LED dies disposed on the substrate. Each group has one or more LED dies, and each of the LED dies is coupled to an electrical contact and electrical paths are configured for feeding separate electrical currents to the groups of LED dies. The method also includes determining information associating a plurality output light colors with a corresponding plurality of combinations of electrical currents, each combination specifying a plurality of electrical current values, each electrical current value being associated with an LED die from one of the two or more groups of LED dies. The method also includes storing the information in the memory device, and providing a circuit for accessing the information in the memory device.
-
公开(公告)号：US09842973B2
公开(公告)日：2017-12-12
申请号：US14338307
申请日：2014-07-22
Applicant: LedEngin, Inc.
Inventor： Xiantao Yan
CPC classification number: H01L33/58 , H01L25/0753 , H01L33/48 , H01L33/483 , H01L33/486 , H01L33/52 , H01L33/62 , H01L33/64 , H01L2924/0002 , H01L2933/0058 , H01L2924/00
Abstract: Methods of fabricating a light-emitting device are provided. A light-emitting device can be formed from bonding a lens including a plug and a cap to an LED package including a socket configured to receive the plug. The lens can be fabricated using an injection mold formed from a well secured to the LED package and injecting a material into the injection mold to cure into a shape of the lens. The lens can also be fabricated using a blank about the shape of the lens and machining the blank to produce the plug and the cap of the lens. The lens can be bonded to the LED package using a convex bead of adhesive deposited on the surface of the LED package and spreading the adhesive between the lens and the LED package.
-
Patent Agency Ranking
公开(公告)号：US09653663B2
公开(公告)日：2017-05-16
申请号：US14229550
申请日：2014-03-28
Applicant: LedEngin, Inc.
Inventor： Xiantao Yan
CPC classification number: H01L33/58 , H01L25/0753 , H01L33/48 , H01L33/483 , H01L33/486 , H01L33/52 , H01L33/62 , H01L33/64 , H01L2924/0002 , H01L2933/0058 , H01L2924/00
Abstract: A package for multiple LED's and for attachment to a substrate includes a body, which includes a top body layer, a cavity disposed through the top body layer and having a floor for bonding to the multiple LED's, and a thermal conduction layer bonded to the top body layer and having a top surface forming the floor of the cavity and a bottom surface. The thermal conduction layer includes a thermally conducting ceramic material disposed between the floor and the bottom surface. The package also includes a plurality of LED bonding pads in direct contact with the floor and configured to bond to the multiple LED's and a plurality of electrical bonding pads in direct contact with the floor, proximate to the LED bonding pads, and in electrical communication with a plurality of electrical contacts disposed on a surface of the body.
-
公开(公告)号：US09642206B2
公开(公告)日：2017-05-02
申请号：US14952648
申请日：2015-11-25
Applicant: LedEngin, Inc.
Inventor： Xiantao Yan , Kachun Lee
IPC: H01L33/48 , H01L33/62 , H01L25/075 , H05B33/08
CPC classification number: H05B33/0857 , H01L25/0753 , H01L33/62 , H01L2924/0002 , H01L2924/15174 , H05B33/0869 , H01L2924/00
Abstract: A substrate for an LED emitter includes a body with a recess region formed therein. Bonding pads are disposed within the recess region, including LED bonding pads for LEDs and supporting chip bonding pads for one or more semiconductor chips that provide supporting circuitry (e.g., driver and/or controller circuitry) to support operation of the LEDs. External electrical contacts can be disposed outside the recess region. Electrical paths, disposed at least partially within the body of the substrate, connect the external electrical contacts to a first subset of the supporting chip bonding pads and connect a second subset of the supporting chip bonding pads to the plurality of LED bonding pads such that one or more supporting chips connected to the controller pads can be operated to deliver different operating currents to different ones of the LEDs.
-
公开(公告)号：US09634214B2
公开(公告)日：2017-04-25
申请号：US14072387
申请日：2013-11-05
Applicant: LedEngin, Inc.
Inventor： Xiantao Yan
IPC: H05K1/14 , H05K1/00 , H01L33/00 , H01L31/0203 , H01L23/12 , H01L23/053 , H01L23/14 , H01L23/06 , H01L23/15 , H01L23/48 , H01L23/52 , H01L29/40 , H01L33/64 , H01L23/495 , H01L23/373 , H01L21/48 , H01L33/48 , H01L29/16
CPC classification number: H01L33/641 , H01L21/4807 , H01L23/15 , H01L23/3731 , H01L23/49506 , H01L29/1606 , H01L33/48 , H01L33/64 , H01L2224/05187 , H01L2224/05193 , H01L2224/29187 , H01L2224/29193 , H01L2924/0002 , H01L2924/05032 , H01L2924/15787 , H01L2924/15793 , H01L2924/00
Abstract: Substrates and packages for LED based light devices can incorporate a material with high thermal conductivity in at least the lateral direction (e.g., graphite or graphene) to spread heat across the surface of the substrate. A substrate or layer in a multi-layer substrate can have a graphite core disposed between ceramic sublayers that provide electrical insulation and thermal conductivity in the transverse direction. Another substrate or layer in a multi-layer substrate can be fabricated using a composite of graphite and ceramic materials.
-
公开(公告)号：US09528665B2
公开(公告)日：2016-12-27
申请号：US13838812
申请日：2013-03-15
Applicant: LedEngin, Inc.
Inventor： Zequn Mei , Truc Phoung Thi Vu
CPC classification number: F21K9/64 , H01L33/504 , H01L2933/0041 , H05B33/0866
Abstract: A method for fabricating light-emitting devices includes obtaining a plurality of light-emitting diode (LED) chips fabricated to emit blue light and preparing a phosphor-containing material comprising a matrix material having dispersed therein a mixture of a red phosphor and a green phosphor in a fixed ratio to each other. The method also includes disposing different thicknesses of the phosphor-containing material on different ones of the LED chips. The fixed ratio is chosen such that LED chips having different thicknesses of the phosphor-containing material emit light characterized by different points along the Planckian locus in a CIE chromaticity diagram.
Abstract translation: 一种制造发光器件的方法包括获得制造成发射蓝光的多个发光二极管（LED）芯片，并制备含有基体材料的含磷材料，其中分散有红色磷光体和绿色荧光体的混合物 以相互固定的比例。 该方法还包括将不同厚度的含磷光体材料设置在不同的LED芯片上。 选择固定比例使得具有不同厚度的含磷光体材料的LED芯片在CIE色度图中发射沿着普朗克轨迹的不同点的特征。
-
公开(公告)号：US20160254416A1
公开(公告)日：2016-09-01
申请号：US14634348
申请日：2015-02-27
Applicant: LedEngin, Inc.
Inventor： Shifan Cheng
CPC classification number: H01L33/502 , H01L25/0753 , H01L27/15 , H01L27/156 , H01L33/26 , H05B33/086
Abstract: A color-tunable LED emitter with high CRI can be made by mounting multiple LED chips onto a ceramic substrate that has been patterned with metal contacts and paths so as to connect the LED chips into multiple independently addressable LED groups. Each LED group can produce light of a different color, allowing the color of the emitter to be tuned by adjusting the relative amount of operating current supplied to each LED group. At least some of the LED groups include LEDs coated with a broad spectrum phosphor that can reduce the sharpness of spectral peaks, thereby improving CRI and particular components of CRI, such as R9.
Abstract translation: 可以通过将多个LED芯片安装在已经用金属触点和路径图案化的陶瓷基板上，以将LED芯片连接到多个可独立寻址的LED组中，从而制成具有高CRI的可调色LED发光器。 每个LED组可以产生不同颜色的光，通过调节提供给每个LED组的工作电流的相对量来调节发射器的颜色。 至少一些LED组包括涂覆有广谱磷光体的LED，其可以降低光谱峰值的清晰度，从而改善CRI和诸如R9的CRI的特定组分。
-
-
-
-
-
-
-
-
-
Search Results
69
records
(took 0.017 seconds)
