公开(公告)号：US20100245202A1

公开(公告)日：2010-09-30

申请号：US12375338

申请日：2008-12-17

Applicant: Gareth Michael Lewis ,  Gary David Panaghiston ,  Larry Brian Tween ,  Richard John Harper

Inventor： Gareth Michael Lewis ,  Gary David Panaghiston ,  Larry Brian Tween ,  Richard John Harper

IPC: H01Q1/50

CPC classification number: H01Q21/0087 ,  H01Q1/38 ,  H01Q21/0075 ,  H01Q23/00

Abstract: A feed module is provided for an array antenna. The feed module comprises a multi-layer printed circuit board (PCB) feed structure for coupling signals between connections to transmitters or receivers and connection points for connecting to antenna elements of the array antenna. The multi-layer PCB feed structure comprises a body portion, incorporating coupling components, and a number of line sections for connecting to elements of the array antenna. The planar layers of the multi-layer PCB are arranged to be mounted substantially perpendicular to a planar array of antenna elements of the array antenna when the feed module is integrated therewith.

Abstract translation: 为阵列天线提供馈电模块。 馈送模块包括多层印刷电路板（PCB）馈送结构，用于将连接到发射器或接收器的连接点和连接到阵列天线的天线元件的连接点相耦合。 多层PCB馈送结构包括主体部分，结合有耦合部件，以及用于连接到阵列天线的元件的多个线路部分。 多层PCB的平面层布置成当馈送模块与其一体化时基本上垂直于阵列天线的天线元件的平面阵列安装。