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    TIE BAR AND MOLD CAVITY BAR ARRANGEMENTS FOR MULTIPLE LEADFRAME STACK PACKAGE
    11.
    发明申请
    TIE BAR AND MOLD CAVITY BAR ARRANGEMENTS FOR MULTIPLE LEADFRAME STACK PACKAGE 有权
    用于多个LEADFRAME堆叠包装的条形和模具袋安排

    公开(公告)号：US20110140249A1

    公开(公告)日：2011-06-16

    申请号：US12635059

    申请日：2009-12-10

    Applicant: Lee Han Meng Eugene LEE ,  Kuan Yee WOO

    Inventor： Lee Han Meng Eugene LEE ,  Kuan Yee WOO

    IPC: H01L23/52 ,  H01L23/495

    CPC classification number: H01L23/49537 ,  H01L21/561 ,  H01L21/565 ,  H01L23/3107 ,  H01L23/495 ,  H01L23/49575 ,  H01L23/49589 ,  H01L24/97 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/00

    Abstract: A semiconductor chip package having multiple leadframes is disclosed. Packages can include a first leadframe having a first plurality of electrical leads and a die attach pad having a plurality of tie bars, a second leadframe generally parallel to the first leadframe and having a second plurality of electrical leads, and a mold or encapsulant. Tie bars can be located on three main sides of the die attach pad, but not the fourth main side. Gaps in the first and second plurality of electrical leads can be enlarged or aligned with each other to enable the elimination of mold flash outside the encapsulated region, which can be accomplished with mold cavity bar protrusions. Additional components can include a primary die, a secondary die, an inductor and/or a capacitor. The first and second leadframes can be substantially stacked atop one another, and one or both leadframes can be leadless leadframes.

    Abstract translation: 公开了一种具有多个引线框架的半导体芯片封装。 封装可以包括具有第一多个电引线的第一引线框架和具有多个连接条的管芯附接焊盘，大体上平行于第一引线框架并具有第二多个电引线的第二引线框架以及模具或密封剂。 连接杆可以位于管芯安装垫的三个主要侧面，而不是第四个主要侧面。 可以使第一和第二多个电引线中的间隙彼此扩大或对准，从而能够消除封装区域之外的模具闪光，这可以通过模具型腔突起来实现。 另外的部件可以包括主管芯，次级管芯，电感器和/或电容器。 第一引线框架和第二引线框架可以基本上彼此层叠，并且一个或两个引线框架可以是无引线引线框架。

    Three piece mold cavity design for packaging integrated circuits
    13.
    发明授权
    Three piece mold cavity design for packaging integrated circuits 有权
    封装集成电路三片模腔设计

    公开(公告)号：US08105063B1

    公开(公告)日：2012-01-31

    申请号：US12869630

    申请日：2010-08-26

    Applicant: Lee Han Meng @Eugene Lee

    Inventor： Lee Han Meng @Eugene Lee

    IPC: B29C70/72 ,  H01L21/56

    CPC classification number: H01L21/565 ,  B29C45/14016 ,  B29C45/14655 ,  H01L24/97 ,  H01L2224/16245 ,  H01L2224/97 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2224/81 ,  H01L2924/00

    Abstract: One aspect of the present invention relates to a molding system for use in packaging integrated circuits. The molding system includes a top cavity bar, a middle cavity bar, a bottom cavity bar, a tape and an injection unit. When an electronic substrate is positioned between the top and middle cavity bars, the top and middle cavity bars are arranged to sandwich the electronic substrate. The top and middle cavity bars are also arranged to help form one or more mold cavities over device areas of the electronic substrate. The tape is positioned below the middle cavity bar and is arranged to cover and relieve pressure on a bottom of each mold cavity. The bottom cavity bar is positioned below the tape and is arranged to support the tape. The injection unit is arranged to inject a molding material into the mold cavities.

    Abstract translation: 本发明的一个方面涉及一种用于封装集成电路的模制系统。 该模制系统包括顶腔杆，中空杆，底腔杆，带和注射单元。 当电子基板定位在顶部和中间空腔条之间时，顶部和中间空心条被布置成夹住电子基板。 顶部和中间的腔棒还被布置成有助于在电子基底的装置区域上形成一个或多个模腔。 胶带定位在中空杆下方，并布置成覆盖和减轻每个模腔的底部的压力。 底部空腔棒位于带的下方并且被布置成支撑带。 注射单元布置成将模制材料注入模腔中。

    Tie bar and mold cavity bar arrangements for multiple leadframe stack package
    15.
    发明授权
    Tie bar and mold cavity bar arrangements for multiple leadframe stack package 有权
    用于多个引线框架堆叠的扎带和模腔排列

    公开(公告)号：US08203199B2

    公开(公告)日：2012-06-19

    申请号：US12635059

    申请日：2009-12-10

    Applicant: Lee Han Meng Eugene Lee ,  Kuan Yee Woo

    Inventor： Lee Han Meng Eugene Lee ,  Kuan Yee Woo

    IPC: H01L23/495

    CPC classification number: H01L23/49537 ,  H01L21/561 ,  H01L21/565 ,  H01L23/3107 ,  H01L23/495 ,  H01L23/49575 ,  H01L23/49589 ,  H01L24/97 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/00

    Abstract: A semiconductor chip package having multiple leadframes is disclosed. Packages can include a first leadframe having a first plurality of electrical leads and a die attach pad having a plurality of tie bars, a second leadframe generally parallel to the first leadframe and having a second plurality of electrical leads, and a mold or encapsulant. Tie bars can be located on three main sides of the die attach pad, but not the fourth main side. Gaps in the first and second plurality of electrical leads can be enlarged or aligned with each other to enable the elimination of mold flash outside the encapsulated region, which can be accomplished with mold cavity bar protrusions. Additional components can include a primary die, a secondary die, an inductor and/or a capacitor. The first and second leadframes can be substantially stacked atop one another, and one or both leadframes can be leadless leadframes.

    Abstract translation: 公开了一种具有多个引线框架的半导体芯片封装。 封装可以包括具有第一多个电引线的第一引线框架和具有多个连接条的管芯附接焊盘，大体平行于第一引线框架并具有第二多个电引线的第二引线框架以及模具或密封剂。 连接杆可以位于管芯安装垫的三个主要侧面，而不是第四个主要侧面。 可以使第一和第二多个电引线中的间隙彼此扩大或对准，从而能够消除封装区域之外的模具闪光，这可以通过模具型腔突起来实现。 另外的部件可以包括主管芯，次级管芯，电感器和/或电容器。 第一引线框架和第二引线框架可以基本上彼此层叠，并且一个或两个引线框架可以是无引线引线框架。

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