公开(公告)号：US20080048008A1

公开(公告)日：2008-02-28

申请号：US11508082

申请日：2006-08-22

Applicant: Mark D. Schultz

Inventor： Mark D. Schultz

IPC: B23K1/08 ,  B23K31/02

CPC classification number: B23K3/0623 ,  B23K2101/40 ,  H01L2224/11 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2224/0401

Abstract: A method for dispensing solder bumps on a mold plate includes the steps of: relatively moving a fill head comprising an o-ring from a first location to a second location such that the o-ring decompresses as it crosses from the first location to the second location; filling at least one cavity in the mold plate with solder; and then relatively moving the fill head from the second location to a third location such that the o-ring decompresses as it crosses from the second location to the third location. The step of relatively moving the fill head from the first location to the second location includes moving from a higher elevation to a lower elevation. A mold plate to parking location interface includes: a mold plate for holding solder; a fill head with an o-ring for dispensing solder bumps on the mold plate; a parking location for locating the fill head; and a platform between the mold plate and the parking location for relatively moving the fill head from the first location to the second location such that the o-ring decompresses as it passes over the interface.

Abstract translation: 一种用于在模具板上分配焊料凸块的方法包括以下步骤：将包括O形环的填充头从第一位置相对移动到第二位置，使得O形环在从第一位置穿过第二位置时减压 位置; 用焊料填充模具板中的至少一个空腔; 然后将填充头从第二位置相对移动到第三位置，使得O形环在从第二位置到第三位置越过时解压缩。 将填充头从第一位置相对移动到第二位置的步骤包括从较高的高度移动到较低的高度。 停车位置界面的模板包括：用于保持焊料的模板; 具有用于在模板上分配焊料凸块的O形环的填充头; 用于定位填充头的停车位置; 以及在模板和停车位置之间的平台，用于将填充头从第一位置相对移动到第二位置，使得O形环在通过界面时减压。

公开(公告)号：US07236323B2

公开(公告)日：2007-06-26

申请号：US10930163

申请日：2004-08-31

Applicant: Blake O. Finstad ,  Gary A. Herbst ,  Kishan K. Kumbia ,  Mark D. Schultz ,  Scott A. Thomas ,  Satoshi Yamamoto

Inventor： Blake O. Finstad ,  Gary A. Herbst ,  Kishan K. Kumbia ,  Mark D. Schultz ,  Scott A. Thomas ,  Satoshi Yamamoto

IPC: G11B21/02 ,  G11B5/09

CPC classification number: G11B5/59633 ,  G11B5/59666

Abstract: A method and apparatus for providing combined radial and timing multislot self-servowrite propagation is disclosed. Radial bursts are combined with each timing mark and requires only three recovery/read-write spacing allocations per sector. The channel operates without requiring the writing of any bursts between reading radial bursts.

Abstract translation: 公开了一种用于提供组合的径向和定时多槽自伺服传播的方法和装置。 辐射脉冲串与每个定时标记组合，每扇区只需要三个恢复/读写间距分配。 信道操作而不需要在读取径向脉冲串之间写入任何脉冲串。

公开(公告)号：US07019926B2

公开(公告)日：2006-03-28

申请号：US10184343

申请日：2002-06-27

Applicant: Timothy J. Chainer ,  Mark D. Schultz ,  Bucknell C. Webb

Inventor： Timothy J. Chainer ,  Mark D. Schultz ,  Bucknell C. Webb

IPC: G11B5/09

CPC classification number: G11B5/59633 ,  G11B5/59605

Abstract: A system and method for self-servo-writing of multi-slot timing patterns is described. Individual timing marks are replaced with groups of timing mark slots. At each timing mark location, a time measurement is made by detecting a timing mark in one of the slots. Also, extensions to the existing timing marks are written in other slots. The combination of timing measurements at every timing mark and extensions to those timing marks written at every opportunity improves the overall precision of the timing propagation. The improved accuracy of timing mark placement produces a commensurate improvement in the placement of the concomitantly written servo-data. In addition, the alignment accuracy of the written pattern is less sensitive to variations in rotation speed and variations in the shape of written transitions. Moreover, only a single disk revolution is required at each servo radius to write servo data and propagate the timing marks.

Abstract translation: 描述了一种用于多时隙定时模式的自伺服写入的系统和方法。 单个定时标记被定时标记位置组替换。 在每个定时标记位置，通过检测其中一个时隙中的定时标记来进行时间测量。 此外，现有时序标记的扩展也写在其他插槽中。 每个定时标记的定时测量和在每个机会上写入的定时标记的扩展的组合可以提高定时传播的总体精度。 定时标记放置的改进精度在同时写入的伺服数据的位置上产生相应的改进。 此外，写入的图案的对准精度对旋转速度的变化和写入的转变的形状的变化较不敏感。 此外，在每个伺服半径处仅需要一次盘旋转以写入伺服数据并传播定时标记。

公开(公告)号：US09151543B2

公开(公告)日：2015-10-06

申请号：US13184239

申请日：2011-07-15

Applicant: Madhusudan K. Iyengar ,  Pritish R. Parida ,  Mark D. Schultz

Inventor： Madhusudan K. Iyengar ,  Pritish R. Parida ,  Mark D. Schultz

IPC: F25B25/00 ,  F28D15/00 ,  H05K7/20

CPC classification number: H05K7/20836 ,  F28D15/00 ,  H05K7/2079

Abstract: A data center cooling system is operated in a first mode; it has an indoor portion wherein heat is absorbed from components in the data center, and an outdoor heat exchanger portion wherein outside air is used to cool a first heat transfer fluid (e.g., water) present in at least the outdoor heat exchanger portion of the cooling system during the first mode. The first heat transfer fluid is a relatively high performance heat transfer fluid (as compared to the second fluid), and has a first heat transfer fluid freezing point. A determination is made that an appropriate time has been reached to switch from the first mode to a second mode. Based on this determination, the outdoor heat exchanger portion of the data cooling system is switched to a second heat transfer fluid, which is a relatively low performance heat transfer fluid, as compared to the first heat transfer fluid. It has a second heat transfer fluid freezing point lower than the first heat transfer fluid freezing point, and the second heat transfer fluid freezing point is sufficiently low to operate without freezing when the outdoor air temperature drops below a first predetermined relationship with the first heat transfer fluid freezing point.

Abstract translation: 数据中心冷却系统以第一模式运行; 其具有室内部分，其中热量从数据中心的部件吸收;以及室外热交换器部分，其中外部空气被用于冷却至少在室外热交换器部分中存在的第一传热流体（例如，水） 第一模式下的冷却系统。 第一传热流体是相对高性能的传热流体（与第二流体相比），并且具有第一传热流体凝固点。 确定已经达到适当的时间以从第一模式切换到第二模式。 基于该判定，与第一传热流体相比，数据冷却系统的室外热交换器部分切换为相对低性能的传热流体的第二传热流体。 其具有比第一传热流体凝固点低的第二传热流体凝固点，并且当室外空气温度下降到与第一传热的第一预定关系时，第二传热流体凝固点足够低以在不冻结的情况下运行 流体凝固点。

公开(公告)号：US08746000B2

公开(公告)日：2014-06-10

申请号：US13587912

申请日：2012-08-16

Applicant: Mark D. Schultz

Inventor： Mark D. Schultz

IPC: F25D23/12

CPC classification number: H05K7/20836 ,  G05D23/00 ,  H05K7/20281

Abstract: According to one embodiment, a system for removing heat from a rack of information technology equipment may include a sidecar indoor air to liquid heat exchanger that cools warm air generated by the rack of information technology equipment. The system may also include a liquid to liquid heat exchanger and an outdoor heat exchanger. The system may further include configurable pathways to connect and control fluid flow through the sidecar heat exchanger, the liquid to liquid heat exchanger, the rack of information technology equipment, and the outdoor heat exchanger based upon ambient temperature and/or ambient humidity to remove heat from the rack of information technology equipment.

Abstract translation: 根据一个实施例，用于从信息技术设备的机架移除热量的系统可以包括侧面的室内空气 - 液体热交换器，其冷却由信息技术设备的机架产生的热空气。 该系统还可以包括液体与液体热交换器和室外热交换器。 该系统可以进一步包括可配置的路径，以根据环境温度和/或环境湿度连接和控制通过旁侧热交换器，液体到液体热交换器，信息技术设备的机架和室外热交换器的流体流动，以去除热量 从信息技术设备架构。

公开(公告)号：US08649177B2

公开(公告)日：2014-02-11

申请号：US13451714

申请日：2012-04-20

Applicant: Timothy J. Chainer ,  Michael A. Gaynes ,  David P. Graybill ,  Madhusudan K. Iyengar ,  Vinod Kamath ,  Bejoy J. Kochuparambil ,  Roger R. Schmidt ,  Mark D. Schultz ,  Daniel P. Simco ,  Mark E. Steinke

Inventor： Timothy J. Chainer ,  Michael A. Gaynes ,  David P. Graybill ,  Madhusudan K. Iyengar ,  Vinod Kamath ,  Bejoy J. Kochuparambil ,  Roger R. Schmidt ,  Mark D. Schultz ,  Daniel P. Simco ,  Mark E. Steinke

IPC: H05K7/20

CPC classification number: H05K7/20772 ,  H05K7/20781 ,  H05K7/2079

Abstract: A method of fabricating a liquid-cooled electronic system is provided which includes an electronic assembly having an electronics card and a socket with a latch at one end. The latch facilitates securing of the card within the socket. The method includes providing a liquid-cooled cold rail at the one end of the socket, and a thermal spreader to couple the electronics card to the cold rail. The thermal spreader includes first and second thermal transfer plates coupled to first and second surfaces on opposite sides of the card, and thermally conductive extensions extending from end edges of the plates, which couple the respective transfer plates to the liquid-cooled cold rail. The extensions are disposed to the sides of the latch, and the card is securable within or removable from the socket using the latch without removing the cold rail or the thermal spreader.

Abstract translation: 提供一种制造液冷电子系统的方法，其包括具有电子卡的电子组件和在一端具有闩锁的插座。 闩锁有助于将卡固定在插座内。 该方法包括在插座的一端提供液冷冷轨，以及将电子卡耦合到冷轨的散热器。 热散布器包括耦合到卡的相对侧上的第一和第二表面的第一和第二热传递板，以及从板的端部边缘延伸的导热延伸件，其将相应的传递板联接到液体冷却的冷轨。 延伸件设置在闩锁的侧面，并且卡可以使用闩锁固定在插座内或从插座中移除，而不移除冷轨或散热器。

公开(公告)号：US20140022725A1

公开(公告)日：2014-01-23

申请号：US13587912

申请日：2012-08-16

Applicant: Mark D. Schultz

Inventor： Mark D. Schultz

IPC: G06F1/20

CPC classification number: H05K7/20836 ,  G05D23/00 ,  H05K7/20281

Abstract: According to one embodiment, a system for removing heat from a rack of information technology equipment may include a sidecar indoor air to liquid heat exchanger that cools warm air generated by the rack of information technology equipment. The system may also include a liquid to liquid heat exchanger and an outdoor heat exchanger. The system may further include configurable pathways to connect and control fluid flow through the sidecar heat exchanger, the liquid to liquid heat exchanger, the rack of information technology equipment, and the outdoor heat exchanger based upon ambient temperature and/or ambient humidity to remove heat from the rack of information technology equipment.

Abstract translation: 根据一个实施例，用于从信息技术设备的机架移除热量的系统可以包括侧面的室内空气 - 液体热交换器，其冷却由信息技术设备的机架产生的热空气。 该系统还可以包括液体与液体热交换器和室外热交换器。 该系统可以进一步包括可配置的路径，以根据环境温度和/或环境湿度连接和控制通过旁侧热交换器，液体到液体热交换器，信息技术设备的机架和室外热交换器的流体流动，以去除热量 从信息技术设备架构。

公开(公告)号：US20140020885A1

公开(公告)日：2014-01-23

申请号：US13551929

申请日：2012-07-18

Applicant: Timothy J. Chainer ,  Hien P. Dang ,  Pritish R. Parida ,  Mark D. Schultz ,  Arun Sharma

Inventor： Timothy J. Chainer ,  Hien P. Dang ,  Pritish R. Parida ,  Mark D. Schultz ,  Arun Sharma

IPC: G05D23/00

CPC classification number: H05K7/20836 ,  G06F1/206

Abstract: A method aspect for removing heat from a data center may use liquid coolant cooled without vapor compression refrigeration on a liquid cooled information technology equipment rack. The method may also include regulating liquid coolant flow to the data center through a range of liquid coolant flow values with a controller-apparatus based upon information technology equipment temperature threshold of the data center.

Abstract translation: 从数据中心去除热量的方法方面可以使用液体冷却剂冷却而不进行蒸气压缩制冷在液冷信息技术设备机架上。 该方法还可以包括通过使用基于数据中心的信息技术设备温度阈值的控制器装置通过一定范围的液体冷却剂流量来调节流向数据中心的液体冷却剂流。

公开(公告)号：US08286855B2

公开(公告)日：2012-10-16

申请号：US13442322

申请日：2012-04-09

Applicant: Russell A. Budd ,  John P. Karidis ,  Mark D. Schultz

Inventor： Russell A. Budd ,  John P. Karidis ,  Mark D. Schultz

IPC: B23K31/02 ,  B23K31/00

CPC classification number: H05K3/3457 ,  B23K1/0016 ,  B23K3/0638 ,  H05K2203/0113 ,  H05K2203/0126 ,  H05K2203/0338

Abstract: A method are provided to deposit conductive bonding material into cavities in a mold. A fill head is placed in substantial contact with a mold that includes cavities. The fill head includes a sealing member that substantially encompasses an entire area to be filled with conductive bonding material. The fill head and mold are transitioned so that the fill head is situated substantially directly above the mold and so that the plurality of cavities are facing in an upward direction with respect to the sealing member. The conductive bonding material is forced out of the fill head toward the mold. The conductive bonding material is provided into at least one cavity of the cavities contemporaneous with the at least one cavity being in proximity to the fill head.

Abstract translation: 提供了一种将导电接合材料沉积在模具中的空腔中的方法。 填充头被放置成与包括空腔的模具基本接触。 填充头包括密封构件，其基本上包围要填充有导电接合材料的整个区域。 填充头和模具被过渡，使得填充头基本上位于模具的正上方，并且使得多个空腔相对于密封构件向上的方向面对。 导电接合材料被迫从模具顶端朝向模具。 导电接合材料设置在与填充头附近的至少一个空腔同时的空腔的至少一个空腔中。

公开(公告)号：US07931249B2

公开(公告)日：2011-04-26

申请号：US11670080

申请日：2007-02-01

Applicant: Mark D. Schultz

Inventor： Mark D. Schultz

IPC: B22D11/00 ,  H05K3/00 ,  H01L21/00

CPC classification number: H05K3/3457 ,  H05K2203/0113

Abstract: A process of reducing friction, which is encountered in molds utilized in injection molded, solder processing, and wherein glass mold plates have mold pits etched therein. The mold pates are subjected to a heat treatment so as to smooth or round-off sharp edges along the periphery of the mold pits.

Abstract translation: 一种降低摩擦的方法，其在注射成型，焊接加工中使用的模具中遇到，并且其中玻璃模板在其中蚀刻有模具凹坑。 对模具进行热处理，以沿着模具凹坑的周边平滑或圆形的锐利边缘。