Abstract:
A threshold compensating circuit generates a bias potential VBIAS, that is, a threshold voltage of a MOS transistor offset by a given value. A gate-source voltage having compensation for variation in threshold voltage is thus applied to a transistor. By using a differential amplifier having this transistor as a current source, a voltage down-converter less susceptible to variation in threshold voltage caused by process variation and temperature can be implemented.
Abstract:
In a network in which a plurality of terminals share one communication channel, signal collision is avoided and a predetermined signal is transmitted with a higher priority level. Priority levels are defined so that they are common to all the packets to be sent by nodes (including terminals and relating devices) on a network. Respective slots that regulate timing for sending out packets are assigned to the respective priority levels. Each slot is determined with reference to a time at which an ongoing packet transmission on the communication channel has finished. The priority levels are allocated in such a manner that packets having higher priority levels (packets to be sent out with higher priority) are allocated to slots having earlier timing.
Abstract:
Each of N memory blocks of first to Nth stages includes a plurality of first and second driver units. The plurality of first and second driver units are respectively provided corresponding to one end and another end of a plurality of digit lines included in each memory block. Each of the first driver units in memory blocks before a selected memory block connects a corresponding digit line to a first voltage according to a voltage level on a digit line of the same row in a memory block of a previous stage. A second driver unit in the selected memory block connects a corresponding digit line to a second voltage in order to supply a data write current. In other words, digit lines in the memory blocks before the selected memory block are not used as current lines but as signal lines.
Abstract:
A processing technique of a semiconductor substrate which can improve a capability of a solid immersion lens in case of processing the semiconductor substrate and forming the solid immersion lens on its surface is provided. A focused ion beam (5) is irradiated on a semiconductor substrate (1), and a salient part (2) acting as a solid immersion lens is formed on its main surface (3a). At this time, a cutting amount of the semiconductor substrate (1) by the focused ion beam (5) is adjusted by making the irradiation time of the focused ion beam (5) to the semiconductor substrate (1) change. According to this, a surface of the salient part (2) has a curved surface of high precision, and a capability of the salient part (2) as the solid immersion lens is improved.
Abstract:
An asynchronous data transmitting apparatus includes data signal transmission lines; two control transmission lines having a minimum delay and maximum delay respectively; a transmitter; and a receiver. The transmitter includes a data transmitting unit that transmits a data signal through the data signal transmission lines, depending on a transmit clock; and control transmitting units that transmit control signals through the control transmission lines, depending on the transmit clock. The receiver includes a receive clock generator that generates a read clock from the control signals; and a data receiving unit that receives the data signal through the data signal transmission line, depending on the read clock.
Abstract:
In a potential interconnection layer, when viewed from a plane, a plurality of power supply potential regions and ground potential regions are alternately provided, with an interlayer insulation layer lying therebetween. A contact plug penetrating a second insulation layer is provided to electrically connect a source/drain (S/D) region on one side of a selected field effect transistor with a selected power supply potential region. Similarly, a contact plug penetrating the second insulation layer is provided to electrically connect a source/drain (S/D) region on the other side of another selected field effect transistor with a selected ground potential region. By employing this structure, a semiconductor device having a plurality of semiconductor circuits in which a power supply potential and a ground potential can be stabilized regardless of the cross-sectional structure of the semiconductor device is provided.
Abstract:
A method of manufacturing a semiconductor device, comprises providing a wiring substrate having a main surface, an insulating film formed on the main surface, and electrodes formed on the main surface so as to be exposed from the insulating film. A semiconductor chip is adhesively fixed to the insulating film. Conductive wires connect the electrodes on the main surface of the wiring substrate and electrodes on the chip. A groove is formed between the chip and the electrodes on the substrate. A protruding portion of the adhesive stays within the groove and does not reach the electrodes on the substrate.
Abstract:
A reference cell is connected to two reference bit lines. In data access, when one reference bit line is driven to a selected state in response to a reference column select signal which is a decode result of a column address, a potential of a selected reference bit line is transmitted to a reference data bus line. A potential difference between the reference data bus line and a data bus line is amplified by a sense amplifier, and read data is output from an external terminal. During the access period, a reference bit line in a non-selected state is precharged to a ground potential in response to a reset signal at H level. In the next data access, when the non-selected reference bit line is selected, successive data reading is attained without waiting for a time period for precharging a bit line.
Abstract:
Disclosed here is a method for speeding up data writing and reducing power consumption by reducing the variation of the threshold voltage of each of non-volatile memory cells at data writing. When writing data in a memory cell, a voltage of about 8V is applied to the memory gate line, a voltage of about 5V is applied to the source line, a voltage of about 1.5V is applied to the selected gate line respectively. At that time, in the writing circuit, the writing pulse is 0, the writing latch output a High signal, and a NAND-circuit outputs a Low signal. And, a constant current of about 1 iA flows in a constant current source transistor and the bit line is discharged by a constant current of about 1 iA to flow a current in the memory cell.
Abstract:
A semiconductor device includes a lower-layer substrate, a fuse above the lower-layer substrate and blown by radiation with light, a silicon oxide film on the fuse and on an exposed portion of the surface of the lower-layer substrate, and a silicon nitride film on the silicon oxide film. The portion of the silicon oxide film on the surface of the lower-layer substrate is thicker than the fuse, and the silicon oxide film has an opening opposite the fuse.