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    Nets and devices for facilitating capture of unmanned aerial vehicles
    12.
    发明授权
    Nets and devices for facilitating capture of unmanned aerial vehicles 有权

    公开(公告)号：US10435153B2

    公开(公告)日：2019-10-08

    申请号：US15841199

    申请日：2017-12-13

    Applicant: Sanmina Corporation

    Inventor： Max Edward Klein

    IPC: B64C39/00 ,  B64C39/02 ,  F41B11/80 ,  F41H11/02 ,  F41H13/00 ,  G05D1/00 ,  B64D1/02 ,  F41H11/04 ,  B64D3/00

    Abstract: Unmanned aerial vehicle (UAV) capture nets, netting systems, UAVs, and methods of making netting systems are disclosed. A UAV capture net may include an open-mesh material, and a plurality of streamers coupled to the open-mesh material, where each of the plurality of streamers includes a free longitudinal end. Netting systems may include a container, a propellant disposed within the container, and a net disposed with in the container, where the net includes an open-mesh structure and a plurality of streamers coupled to the open-mesh structure. UAVs may include an airframe coupled with a propulsion system and a netting system. Methods of making netting systems may include disposing a propellant and a net into a container, where the net includes an open-meshed fabric and a plurality of streamers connected to a portion of the open-mesh fabric. Other aspects, embodiments, and features are also included.

    Peripheral component interconnect express (PCIe) solid state drive (SSD) accelerator
    13.
    发明授权
    Peripheral component interconnect express (PCIe) solid state drive (SSD) accelerator 有权

    公开(公告)号：US10324642B2

    公开(公告)日：2019-06-18

    申请号：US14300231

    申请日：2014-06-09

    Applicant: Sanmina Corporation

    Inventor： Paul Sweere ,  Jay Patel ,  Irfan Syed

    IPC: G06F3/06 ,  G06F12/02 ,  G06F13/40 ,  G06F11/30 ,  G06F1/20 ,  G06F1/3206 ,  G06F1/3234 ,  G11C7/04

    Abstract: A peripheral component interconnect express (PCIe) solid state drive (SSD) accelerator, having a PCIe card and separate a flash daughter-card, is provided. By including flash memory devices on a separate daughter-card, the flash memory devices are thermally decoupled from the hotter devices on the main PCIe providing additional thermal operating margins for the entire design. Furthermore, as flash memory devices are the most likely part of the subsystem to wear out over time due, including flash memory devices on a separate daughter-card allows the flash memory devices to become a field replaceable unit that can be easily replaced. EEPROMs may be included on the flash daughter-card to record the current wear state of the NAND flash devices. Knowing the wear history of the flash memory device allows the seller to replace the flash daughter-card of a customer with a daughter-card having a similar wear state.

    System and method for glucose monitoring
    14.
    发明授权
    System and method for glucose monitoring 有权

    公开(公告)号：US10321860B2

    公开(公告)日：2019-06-18

    申请号：US14866500

    申请日：2015-09-25

    Applicant: Sanmina Corporation

    Inventor： Robert Steven Newberry

    IPC: A61B5/1455 ,  A61B5/145 ,  A61B5/00 ,  G06F19/00 ,  G16H40/67

    Abstract: A glucose biosensor includes a plurality of optical fibers configured for placement within the ear canal. A first optical fiber emits light into the ear canal. A plurality of other optical fibers capture and transmit the reflected light back to the glucose biosensor. A plurality of photodetectors are configured in the glucose biosensor to detect the reflected light from the plurality of optical fibers. The glucose biosensor processes the detected light from each photodetector to determine a glucose level measurement. In an embodiment, the glucose biosensor also includes a wireless interface to transmit the glucose level measurements to a glucose meter and/or a gateway.

    System and method for a biosensor integrated in a vehicle
    16.
    发明授权
    System and method for a biosensor integrated in a vehicle 有权

    公开(公告)号：US10238346B2

    公开(公告)日：2019-03-26

    申请号：US15811479

    申请日：2017-11-13

    Applicant: Sanmina Corporation

    Inventor： Robert Steven Newberry

    IPC: A61B5/1455 ,  A61B5/00 ,  A61B5/024 ,  A61B5/145

    Abstract: A vehicle includes one or more integrated biosensors, such as finger sensors or other user touchpoints. The integrated biosensors are configured to obtain biosensor data, such as a patient's vitals or concentrations of substances in the blood flow of a user. A control module of a vehicle receives the biosensor data and controls operation of one or more systems of the vehicle in response to the biosensor data. The control module may also present the biosensor data on a display of the vehicle and receive user commands to control the biosensors. The control module may also generate warnings for display in response to the biosensor data exceeding one or more predetermined thresholds.

    MODULAR MOTHERBOARD FOR A COMPUTER SYSTEM AND METHOD THEREOF
    17.
    发明申请
    MODULAR MOTHERBOARD FOR A COMPUTER SYSTEM AND METHOD THEREOF 审中-公开

    公开(公告)号：US20190045634A1

    公开(公告)日：2019-02-07

    申请号：US16057580

    申请日：2018-08-07

    Applicant: Sanmina Corporation

    Inventor： Charles C. Hill ,  Franz Michael Schuette

    IPC: H05K1/18 ,  H05K1/14 ,  H05K3/36 ,  H05K3/30

    Abstract: One feature pertains to a modular design of a motherboard for a computer system. The mother board is disaggregated into a CPU board and an IO board. The CPU board contains at least one CPU, the associated memory subsystem and the voltage regulator module. The integrated IO ports escape to a high speed connector mating with its counterpart on an IO board which contains all peripheral devices including system logic not part of the CPU. In a multi-socket configuration the CPUs are on the CPU board and the processor interconnects are routed directly in a point to point manner.

    Non-volatile dual in-line memory module (NVDIMM) multichip package
    18.
    发明授权
    Non-volatile dual in-line memory module (NVDIMM) multichip package 有权

    公开(公告)号：US10199364B2

    公开(公告)日：2019-02-05

    申请号：US15600690

    申请日：2017-05-19

    Applicant: Sanmina Corporation

    Inventor： Arvindhkumar Lalam ,  Alec C. Shen

    IPC: H01L23/34 ,  H01L25/18 ,  H01L23/00 ,  H01L23/31 ,  H01L23/367 ,  H01L23/538 ,  H01L25/065 ,  H01L23/498

    Abstract: A single multichip package is provided, comprising: a substrate having opposing upper and lower surfaces. A first die is mounted on the upper surface of the substrate and includes one or more non-volatile memory devices. A second die is mounted on the upper surface of the substrate, and includes at least one of: (a) a non-volatile memory controller that facilitates transfer of data to/from the one or more non-volatile memory devices, (b) a register clock driver for volatile memory devices, and/or (c) one or more multiplexer switches configured to switch between two or more of the volatile memory devices. A plurality of wire bonds connect the first and second dies. A plurality of solder balls are located on the lower surface of the substrate for mounting the single multichip package to a printed circuit board, the plurality of solder balls electrically coupled to the first die and the second die.

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