公开(公告)号：US20050006750A1

公开(公告)日：2005-01-13

申请号：US10888410

申请日：2004-07-08

Applicant: Mark Pavier ,  Tim Sammon ,  Chris Davis

Inventor： Mark Pavier ,  Tim Sammon ,  Chris Davis

IPC: H01L21/60 ,  H01L23/482 ,  H01L23/52

CPC classification number: H01L24/81 ,  H01L23/4824 ,  H01L2224/81801 ,  H01L2924/01005 ,  H01L2924/01033 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/13091 ,  H01L2924/00

Abstract: An integrated semiconductor device which includes a plurality of power semiconductor devices formed in a common semiconductor die.

Abstract translation: 一种集成半导体器件，包括形成在公共半导体管芯中的多个功率半导体器件。