公开(公告)号：US20080072791A1

公开(公告)日：2008-03-27

申请号：US11895118

申请日：2007-08-23

Applicant: John William Ashmore ,  David Michael Laganella ,  Tirthankar Ghosh ,  Nilesh Shah

Inventor： John William Ashmore ,  David Michael Laganella ,  Tirthankar Ghosh ,  Nilesh Shah

IPC: C09D113/02

CPC classification number: B27K3/0292 ,  B27K3/153 ,  B27K3/22 ,  B27K3/52 ,  C08K3/10 ,  C09D133/14 ,  C08L2666/54

Abstract: A method for treating wood to inhibit leaching of copper compounds into the environment. The method comprises treating the wood with a copper-containing wood preservative and a latex copolymer.

Abstract translation: 一种处理木材以抑制铜化合物浸入环境中的方法。 该方法包括用含铜木材防腐剂和胶乳共聚物处理木材。

公开(公告)号：US07335613B2

公开(公告)日：2008-02-26

申请号：US11082667

申请日：2005-03-17

Applicant: Stephanie Nussbaum Cottrell ,  Tirthankar Ghosh ,  Barry Weinstein

Inventor： Stephanie Nussbaum Cottrell ,  Tirthankar Ghosh ,  Barry Weinstein

IPC: B32B27/04 ,  B32B27/12

CPC classification number: A01N59/16 ,  Y10T442/2525 ,  Y10T442/277 ,  Y10T442/2861 ,  Y10T442/60 ,  A01N43/50 ,  A01N25/34 ,  A01N25/10 ,  A01N2300/00

Abstract: Treated fiber substrates and methods of making and using the same are disclosed. The disclosed treated fiber substrates provide persistent, durable, broad spectrum, antimicrobial activity. The treated fiber substrates may be used in a variety of materials to impart antimicrobial activity thereto.

Abstract translation: 公开了处理的纤维基材及其制备和使用方法。 所公开的经处理的纤维底物提供持久的，持久的，广谱的抗微生物活性。 经处理的纤维基材可以用于各种材料以赋予其抗微生物活性。

公开(公告)号：US20070282063A1

公开(公告)日：2007-12-06

申请号：US11803460

申请日：2007-05-15

Applicant: Tirthankar Ghosh ,  Morris C. Wills

Inventor： Tirthankar Ghosh ,  Morris C. Wills

IPC: C08G73/02

CPC classification number: C08F220/18 ,  C08F222/1006 ,  C08F222/385 ,  C08F226/06

Abstract: A latex copolymer composition comprising >5 wt % of polymerized units derived from a monomer X containing an unsaturated heterocycle, wherein the latex copolymer composition comprises ≦1,000 ppm of residual monomer X is disclosed. Also disclosed are methods of making and using the latex copolymer compositions.

Abstract translation: 公开了一种胶乳共聚物组合物，其包含大于5重量％的衍生自含有不饱和杂环的单体X的聚合单元，其中所述胶乳共聚物组合物包含<= 1,000ppm的残余单体X。 还公开了制备和使用胶乳共聚物组合物的方法。

公开(公告)号：US20050227895A1

公开(公告)日：2005-10-13

申请号：US11070908

申请日：2005-03-03

Applicant: Tirthankar Ghosh ,  Barry Weinstein

Inventor： Tirthankar Ghosh ,  Barry Weinstein

IPC: A01N25/10 ,  A01N25/22 ,  A01N43/36 ,  A01N43/50 ,  A01N55/00 ,  A01N55/02 ,  A01N55/04 ,  A01N59/16 ,  A01N59/20 ,  A01N61/00 ,  C08F8/42 ,  C08K3/08 ,  C08L101/00 ,  C11D3/16 ,  C11D3/37 ,  C11D3/48 ,  C11D17/00 ,  D06M11/83 ,  D06M15/263 ,  D06M15/356 ,  D06M16/00

CPC classification number: A01N59/16 ,  A01N25/22 ,  C11D3/168 ,  C11D3/3776 ,  C11D3/48 ,  D06M11/83 ,  D06M15/263 ,  D06M15/3562 ,  D06M16/00 ,  D06M2101/32 ,  A01N25/10 ,  A01N43/50 ,  A01N2300/00 ,  A01N25/34

Abstract: Antimicrobial compositions and methods of making and using the same are disclosed. The disclosed antimicrobial compositions provide persistent, broad spectrum, antimicrobial activity. The antimicrobial compositions may be used in the preparation of antimicrobial articles. The antimicrobial compositions may also be used to inhibit the growth of microorganisms by introducing those compositions onto or into an environment subject to microbial attack.

Abstract translation: 公开了抗微生物组合物及其制备和使用方法。 所公开的抗微生物组合物提供持久的，广谱的抗微生物活性。 抗微生物组合物可用于制备抗微生物制品。 抗微生物组合物还可以用于通过将这些组合物引入到微生物侵袭的环境中或进入微生物侵袭的环境中来抑制微生物的生长。

公开(公告)号：US06902590B2

公开(公告)日：2005-06-07

申请号：US10664723

申请日：2003-09-17

Applicant: Barry Weinstein ,  Tirthankar Ghosh

Inventor： Barry Weinstein ,  Tirthankar Ghosh

IPC: B24B37/00 ,  C09G1/02 ,  C09K3/14 ,  H01L21/304 ,  H01L21/321 ,  C09G1/04

CPC classification number: C09G1/02 ,  H01L21/3212

Abstract: A method for chemical mechanical polishing of semiconductor substrates containing a metal layer requiring removal and metal interconnects utilizing a composition containing engineered copolymer molecules comprising hydrophilic functional groups and relatively less hydrophilic functional groups; the engineered copolymer molecules enabling contact-mediated reactions between the polishing pad surface and the substrate surface during CMP resulting in minimal dishing of the metal interconnects in the substrate.

Abstract translation: 包含需要去除的金属层的半导体基板的化学机械抛光方法和利用包含亲水官能团和相对较少亲水官能团的工程共聚物分子的组合物的金属互连的金属互连的方法; 该工程共聚物分子在CMP期间能够在抛光垫表面和衬底表面之间进行接触介导的反应，导致衬底中金属互连的最小凹陷。

公开(公告)号：US06646082B2

公开(公告)日：2003-11-11

申请号：US10234917

申请日：2002-09-04

Applicant: Tirthankar Ghosh ,  William M. Hann ,  Barry Weinstein

Inventor： Tirthankar Ghosh ,  William M. Hann ,  Barry Weinstein

IPC: C08F12240

CPC classification number: C23F11/173 ,  C08F22/40

Abstract: A new class of polymeric corrosion inhibiting compositions incorporating pendant heterocyclic groups which are surprisingly effective copper corrosion inhibitors are disclosed. The polymers form a protective barrier on metallic components to aqueous systems and remain substantive on metallic surfaces over a wide pH range. Moreover, the polymers are resistant to oxidizing biocides, and are substantially impervious to repeated or prolonged exposure to corrosive agents.

公开(公告)号：US6153633A

公开(公告)日：2000-11-28

申请号：US334440

申请日：1999-06-16

Applicant: Tirthankar Ghosh ,  David Willard Potter

Inventor： Tirthankar Ghosh ,  David Willard Potter

IPC: A01N43/02 ,  A01N25/22 ,  A01N43/80 ,  A61K31/425 ,  A61K31/15

CPC classification number: A01N43/80

Abstract: Disclosed are stable microbicidal compositions of 3-isothiazolone compounds and azobiscarbonyl compounds. Also disclosed are methods of stabilizing 3-isothiazolone compounds against chemical decomposition by combining with the 3-isothiazolones a stabilizing amount of an azobiscarbonyl compound.

Abstract translation: 公开了3-异噻唑酮化合物和偶氮二羰基化合物的稳定的杀微生物组合物。 还公开了通过与3-异噻唑酮与稳定量的偶氮二羰基化合物结合来稳定3-异噻唑酮化合物以抗化学分解的方法。

公开(公告)号：US5160526A

公开(公告)日：1992-11-03

申请号：US795579

申请日：1991-11-21

Applicant: Tirthankar Ghosh ,  John R. Mattox

Inventor： Tirthankar Ghosh ,  John R. Mattox

IPC: A01N25/22 ,  A01N43/80 ,  A61K8/30 ,  A61K8/31 ,  A61K8/34 ,  A61K8/37 ,  A61K8/49 ,  A61K8/86 ,  D06M13/02 ,  D06M13/03 ,  D06M13/07 ,  D06M13/224 ,  D06M13/236 ,  D06M13/322 ,  D06M13/35 ,  D06M13/352 ,  D06M101/00 ,  D06M101/02 ,  D06M101/06 ,  D06M101/08 ,  D21H17/07

CPC classification number: A01N25/22 ,  A01N43/80

Abstract: A method of stabilizing a 3-isothiazolone compound against chemical decomposition comprising introducing a sufficient amount of an alkene to stabilize said 3-isothiazolone compound and a composition comprising 3-isothiazolone and an amount of an alkene sufficient to stabilize said isothiazolone.

公开(公告)号：US07968619B2

公开(公告)日：2011-06-28

申请号：US12713751

申请日：2010-02-26

Applicant: Stephanie Nussbaum Cottrell ,  Tirthankar Ghosh

Inventor： Stephanie Nussbaum Cottrell ,  Tirthankar Ghosh

IPC: C08G79/00 ,  C08L85/00 ,  C09D5/16 ,  D06M13/224

CPC classification number: D06M15/21 ,  A01N59/16 ,  D06M15/507 ,  D06M15/55 ,  D06M15/564 ,  D06M15/568 ,  D06M15/572 ,  D06M16/00 ,  A01N25/10 ,  A01N2300/00

Abstract: A composition useful for treating fabrics. The composition contains a silver-containing copolymer having polymerized units of a monomer X and a monomer Y; wherein monomer X is an ethylenically unsaturated compound having a substituent group selected from an unsaturated or aromatic heterocyclic group having at least one nitrogen atom; wherein monomer Y is selected from carboxylic acids, carboxylic acid salts, carboxylic acid esters, organosulfuric acids, organosulfuric acid salts, sulfonic acids, sulfonic acid salts, phosphonic acids, phosphonic acid salts, vinyl esters, (meth)acrylamides, C8-C20 aromatic monomers containing at least one exocyclic ethylenic unsaturation and combinations thereof.

Abstract translation: 用于处理织物的组合物。 该组合物含有具有单体X和单体Y的聚合单元的含银共聚物; 其中单体X是具有选自具有至少一个氮原子的不饱和或芳族杂环基的取代基的烯属不饱和化合物; 其中单体Y选自羧酸，羧酸盐，羧酸酯，有机硫酸，有机硫酸盐，磺酸，磺酸盐，膦酸，膦酸盐，乙烯基酯，（甲基）丙烯酰胺，C 8 -C 20芳族 含有至少一个环外烯属不饱和基团的单体及其组合。

公开(公告)号：US07435356B2

公开(公告)日：2008-10-14

申请号：US10996689

申请日：2004-11-24

Applicant: Tirthankar Ghosh ,  Robert D. Solomon ,  Hongyu Wang

Inventor： Tirthankar Ghosh ,  Robert D. Solomon ,  Hongyu Wang

IPC: C09K13/00

CPC classification number: H01L21/7684 ,  C09G1/04

Abstract: An aqueous abrasive-free composition is useful for chemical mechanical polishing of a patterned semiconductor wafer containing a nonferrous metal. The composition comprises an oxidizer, an inhibitor for the nonferrous metal, 0 to 15 weight percent water soluble modified cellulose, 0 to 15 weight percent phosphorus compound, 0.005 to 5 weight percent of an amphiphilic polymer, the amphiphilic polymer having an ionic hydrophilic portion with a carbon number of 2 to 250 and water.

Abstract translation: 无水磨料组合物可用于含有有色金属的图案化半导体晶片的化学机械抛光。 该组合物包含氧化剂，有色金属抑制剂，0-15重量％水溶性改性纤维素，0-15重量％磷化合物，0.005-5重量％两亲聚合物，两性聚合物具有离子亲水部分与 碳数为2至250和水。