公开(公告)号：US07180173B2

公开(公告)日：2007-02-20

申请号：US10718192

申请日：2003-11-20

Applicant: Yian-Liang Kuo ,  Yung-Sheng Huang ,  Yu-Ting Lin

Inventor： Yian-Liang Kuo ,  Yung-Sheng Huang ,  Yu-Ting Lin

IPC: H01L23/34 ,  H01L23/10

CPC classification number: H01L23/36 ,  H01L23/3128 ,  H01L23/42 ,  H01L24/48 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A method of forming a heat spreader ball grid array package, and the resultant heat spreader ball grid array package, comprising the following steps. A semiconductor chip affixed to a ball grid substrate is provided. The semiconductor chip over the ball grid substrate is encased with a molding compound. A heat spreader is mounted over the ball grid substrate and spaced apart from the molding compound to form a gap. Thermal grease is placed into the gap, at least between the heat spreader and the molding compound, to form the heat spreader ball grid array package. It is also possible to place thermal grease over the molding compound and then mounting the heat spreader over the ball grid substrate.

Abstract translation: 一种形成散热器球栅阵列封装的方法，以及所得的散热器球栅阵列封装，包括以下步骤。 提供固定在球栅基板上的半导体芯片。 球形栅极衬底上的半导体芯片被模制化合物封装。 散热器安装在球栅基板上并与模塑料间隔开以形成间隙。 至少在散热器和模塑料之间，将热油脂放置在间隙中，形成散热器球栅阵列封装。 还可以将热油脂放置在模制化合物上，然后将散热器安装在球栅基板上。

公开(公告)号：US07125445B2

公开(公告)日：2006-10-24

申请号：US11085773

申请日：2005-03-21

Applicant: Kai-Pin Chou ,  Yun-I Liu ,  Yu-Ting Lin

Inventor： Kai-Pin Chou ,  Yun-I Liu ,  Yu-Ting Lin

IPC: C09D11/02 ,  C09B67/00 ,  B41J2/01

CPC classification number: C09D11/32 ,  C09B43/16

Abstract: A magenta inkjet ink composition with good pH value stability including at least one reactive red colorant; at least one azo red dye (such as M377); and an aqueous solution medium.

Abstract translation: 具有良好pH值稳定性的品红色喷墨油墨组合物，包括至少一种反应性红色着色剂; 至少一种偶氮红染料（如M377）; 和水溶液介质。

公开(公告)号：US06943103B2

公开(公告)日：2005-09-13

申请号：US10768848

申请日：2004-01-29

Applicant: Yia-Liang Kuo ,  Yu-Chang Lin ,  Yu-Ting Lin

Inventor： Yia-Liang Kuo ,  Yu-Chang Lin ,  Yu-Ting Lin

IPC: H01L21/44 ,  H01L21/60 ,  H01L23/485

CPC classification number: H01L24/10 ,  H01L24/13 ,  H01L24/81 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05085 ,  H01L2224/05572 ,  H01L2224/056 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/81801 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01075 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2224/29099 ,  H01L2924/00 ,  H01L2224/05099

Abstract: Novel methods for reducing shear stress applied to solder bumps on a flip chip. The methods are particularly applicable to reducing temperature-induced shear stress on solder bumps located adjacent to an empty space on a flip chip during high-temperature testing of the chip. According to a first embodiment, the method includes providing an anchoring solder bump in each empty space on the flip chip. The anchoring solder bumps impart additional structural integrity to the flip chip and prevent shear-induced detachment of solder bumps from the flip chip, particularly those solder bumps located adjacent to each anchoring solder bump. According to a second embodiment, the method includes providing an anchoring solder bump in the empty space and then connecting the anchoring solder bump to an adjacent solder bump on the chip using a solder bridge.

Abstract translation: 用于减少施加到倒装芯片上的焊料凸块的剪切应力的新方法。 该方法特别适用于在芯片的高温测试期间减少与倒装芯片上的空白空间相邻的焊料凸块上的温度诱导剪切应力。 根据第一实施例，该方法包括在倒装芯片上的每个空白空间中提供锚定焊​​料凸块。 锚定焊料凸块对倒装芯片赋予额外的结构完整性，并防止焊料凸块从倒装芯片，特别是位于每个锚定焊料凸块附近的焊料凸块的剪切引起的分离。 根据第二实施例，该方法包括在空间中提供锚定焊​​料凸块，然后使用焊接桥将锚定焊料凸块连接到芯片上的相邻焊料凸块。

公开(公告)号：US20050155148A1

公开(公告)日：2005-07-21

申请号：US10759368

申请日：2004-01-15

Applicant: Yu-Ting Lin

Inventor： Yu-Ting Lin

IPC: A47B85/06 ,  A47C17/62 ,  A47D11/00

CPC classification number: A47C17/62

Abstract: The present invention relates to a table structure that can be converted into bed or table according to user's needs. Wherein a base frame of the present invention is respectively provided with a bed having two L-shape side frames and a table having two side shelves. The two side shelves of the table are connected to the base frame through spiral arms, by virtue of the pivotal connection between the L-shape side frames and the side shelves, the bed can be positioned respectively in a horizontal manner or in a vertical manner. Through the spiral arms, the table can be lowered down or raised up relative to the bed, such that the device of the present invention can be converted into a bed or a table as desired.

Abstract translation: 本发明涉及一种可根据用户需要转换成床或桌的桌面结构。 其中，本发明的基架分别设有具有两个L形侧框架的台架和具有两个侧架的工作台。 桌子的两侧架子通过螺旋臂连接到基架上，由于L形侧框架和侧架之间的枢转连接，床可以分别以水平方式或垂直方式定位 。 通过螺旋臂，桌子可以相对于床下降或升高，使得本发明的装置可以根据需要被转换成床或桌子。

公开(公告)号：US06706099B2

公开(公告)日：2004-03-16

申请号：US10293437

申请日：2002-11-14

Applicant: In-Shan Sir ,  Yu-Chang Shen ,  Chia-Hsin Chien ,  Yu-Ting Lin

Inventor： In-Shan Sir ,  Yu-Chang Shen ,  Chia-Hsin Chien ,  Yu-Ting Lin

IPC: C09D1100

CPC classification number: C09D11/38

Abstract: A composition of a fragrant ink, at least comprising a microcapsule compound, a colorant, a media, a dispersing agent, and an emulsifier, and a preparation method thereof are disclosed. The microcapsule compound encapsulates a fragrant agent for providing the fragrant ink with fragrance. The colorant provides the fragrant ink with at least one color. The media is used as a solvent. The dispersing agent is for evenly dispersing the microcapsule compound in the media. The emulsifier emulsifies the fragrant agent released from the microcapsule compound and evenly disperses the fragrant agent in the media.

Abstract translation: 公开了至少包含微胶囊化合物，着色剂，介质，分散剂和乳化剂的芳香油墨的组合物及其制备方法。 微胶囊化合物包封用于提供芳香剂的芳香剂的芳香剂。 着色剂提供至少一种颜色的香料油墨。 介质用作溶剂。 分散剂用于将微胶囊化合物均匀分散在介质中。 乳化剂将从微胶囊化合物中释出的香料乳化，并均匀地将芳香剂分散在培养基中。

公开(公告)号：US06342398B1

公开(公告)日：2002-01-29

申请号：US09213452

申请日：1998-12-17

Applicant: Yu-Ting Lin

Inventor： Yu-Ting Lin

IPC: G01R3126

CPC classification number: G01R31/2851 ,  G01R31/2886 ,  G01R31/2898 ,  G01R31/311

Abstract: A novel approach to detection of leakage site detection for BGA chips. The invention prevents damaging the semiconductor circuit that is a problem during conventional preparation for backside leakage detection for BGA chips. The invention teaches removing the backside from the BGA device and separating the BGA device into two parts. The back surface of the molded part within which the BGA chip is embedded remains undamaged within the scope of the present invention and can be electrically accessed to perform BGA die analysis.

Abstract translation: 一种用于检测BGA芯片泄漏点检测的新方法。 本发明可防止在用于BGA芯片的背面泄漏检测的常规准备期间的问题的半导体电路损坏。 本发明教导从BGA器件中去除背面并将BGA器件分离成两部分。 嵌入BGA芯片的模制部件的背面在本发明的范围内保持不损伤，并且可以被电气访问以执行BGA模具分析。

公开(公告)号：US09021427B2

公开(公告)日：2015-04-28

申请号：US13488129

申请日：2012-06-04

Applicant: Bo-Fu Liu ,  Yu-Ting Lin ,  Shih-Chun Chou ,  Jih-Yiing Lin

Inventor： Bo-Fu Liu ,  Yu-Ting Lin ,  Shih-Chun Chou ,  Jih-Yiing Lin

IPC: G06F9/44 ,  G06F9/45

CPC classification number: G06F8/51 ,  G06F8/76 ,  G06F9/451

Abstract: A conversion method of applications of mobile devices is provided. The method includes the steps of obtaining a device feature information and a platform information of a mobile device, modifying, by a convertor, a first description data of a first application according to the obtained device feature information and platform information, and converting the modified first application to a second application in which the first application is represented by a platform-neutral language and at least includes the first description data for describing the interaction design of a user interface, and the second application is represented by a language corresponding to the platform information and can be executed on the mobile device.

Abstract translation: 提供了移动设备的应用的转换方法。 该方法包括以下步骤：获取设备特征信息和移动设备的平台信息，根据获得的设备特征信息和平台信息，由转换器修改第一应用的第一描述数据，并将修改的第一 应用于其中第一应用由平台中立语言表示的第二应用，并且至少包括用于描述用户界面的交互设计的第一描述数据，并且第二应用由对应于平台信息的语言表示 并且可以在移动设备上执行。

公开(公告)号：US08502335B2

公开(公告)日：2013-08-06

申请号：US12616652

申请日：2009-11-11

Applicant: Uway Tseng ,  Lin-June Wu ,  Yu-Ting Lin

Inventor： Uway Tseng ,  Lin-June Wu ,  Yu-Ting Lin

IPC: H01L31/00

CPC classification number: H01L24/05 ,  H01L2224/02166 ,  H01L2224/04042 ,  H01L2224/05556 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/48463 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01022 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/12043 ,  H01L2924/14 ,  H01L2924/15788 ,  H01L2924/3025 ,  H01L2924/00

Abstract: An integrated circuit includes a substrate having a bonding pad region and a non-bonding pad region. A relatively large via, called a “big via,” is formed on the substrate in the bonding region. The big via has a first dimension in a top view toward the substrate. The integrated circuit also includes a plurality of vias formed on the substrate in the non-bonding region. The plurality of vias each have a second dimension in the top view, the second dimension being substantially less than the first dimension.

Abstract translation: 集成电路包括具有焊盘区域和非接合焊盘区域的衬底。 在接合区域中的基板上形成了称为“大通孔”的较大通孔。 大通孔在朝向基板的顶视图中具有第一尺寸。 集成电路还包括在非接合区域中形成在衬底上的多个通孔。 多个通孔各自在顶视图中具有第二尺寸，第二尺寸基本上小于第一尺寸。

公开(公告)号：US08435893B1

公开(公告)日：2013-05-07

申请号：US13304235

申请日：2011-11-23

Applicant: Jun-Nan Nian ,  Li-Yen Fang ,  Yu-Ting Lin ,  Shih-Chieh Chang ,  Yu-Ku Lin ,  Ying-Lang Wang

Inventor： Jun-Nan Nian ,  Li-Yen Fang ,  Yu-Ting Lin ,  Shih-Chieh Chang ,  Yu-Ku Lin ,  Ying-Lang Wang

IPC: H01L21/44

CPC classification number: H01L23/53209 ,  H01L21/28518 ,  H01L29/665 ,  H01L29/6659 ,  H01L29/78 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A system and method for forming a semiconductor device is provided. An embodiment comprises forming a silicide region on a substrate along with a transition region between the silicide region and the substrate. The thickness of the silicide precursor material layer along with the annealing conditions are controlled such that there is a larger ratio of one atomic species within the transition region than another atomic species, thereby increasing the hole mobility within the transition region.

Abstract translation: 提供一种用于形成半导体器件的系统和方法。 一个实施例包括在硅化物区域和衬底之间的过渡区域上形成衬底上的硅化物区域。 控制硅化物前体材料层的厚度以及退火条件，使得在过渡区域内的一种原子种类的比例比另一种原子种类更大，从而增加过渡区域内的空穴迁移率。

公开(公告)号：US20130104122A1

公开(公告)日：2013-04-25

申请号：US13538838

申请日：2012-06-29

Applicant: Yu-Ting LIN ,  Ho-Kuang HSIEH

Inventor： Yu-Ting LIN ,  Ho-Kuang HSIEH

IPC: G06F9/445

CPC classification number: G06F13/102 ,  G06F13/385 ,  G06F13/4247

Abstract: Management methods for use in an electronic system having electronic devices and a host device in a daisy-chain configuration are provided. The Management method includes determining that the electronic system has a first connected combination when detecting that first electronic device and second electronic device have been connected with the host device; searching for a first set of software that are suitable for a combination of the first and second electronic devices according to the first connected combination; and installing or activating the first set of software that are suitable for a combination of the first and second electronic devices.

Abstract translation: 提供了在具有电子设备的电子系统中使用的管理方法和具有菊花链配置的主机设备。 所述管理方法包括当检测到所述第一电子设备和所述第二电子设备已经与所述主机设备连接时确定所述电子系统具有第一连接组合; 搜索适合于根据第一连接组合的第一和第二电子设备的组合的第一组软件; 以及安装或激活适合于第一和第二电子设备的组合的第一组软件。