-
11.发明申请LIGHTGUIDE INCLUDING EXTRACTORS WITH DIRECTIONALLY DEPENDENT EXTRACTION EFFICIENCY 审中-公开包括萃取剂在内的光，具有方向性提取效率公开(公告)号：US20160299280A1
公开(公告)日：2016-10-13
申请号：US15036334
申请日：2014-12-30
Applicant: 3M INNOVATIVE PROPERTIES COMPANY
Inventor： David A. Ender , Michael A. Haase , Bing Hao , Michael E. Griffin , Jeremy K. Larsen , Karl A. Vick
IPC: F21V8/00
CPC classification number: G02B6/0036 , G02B6/006 , G02B6/0068
Abstract: Lightguides are disclosed. In particular, lightguides including extractors with directionally dependent extraction efficiency are disclosed. The lightguide may include a series or array of directionally dependent light extractors. Certain configurations enabling the display of indicia and exemplary light extractor shapes are also disclosed.
Abstract translation: 公开了光导。 特别地，公开了包括具有定向依赖性提取效率的提取器的光导。 光导可以包括一系列或多个方向依赖的光提取器。 还公开了能够显示标记和示例性光提取器形状的某些配置。
-
公开(公告)号：US12224184B2
公开(公告)日：2025-02-11
申请号：US18652529
申请日：2024-05-01
Applicant: 3M INNOVATIVE PROPERTIES COMPANY
Inventor： Ankit Mahajan , Saagar A. Shah , Mikhail L. Pekurovsky , Kayla C. Niccum , Kara A. Meyers , Matthew R. D. Smith , Gino L. Pitera , Graham M. Clarke , Jeremy K. Larsen , Teresa M. Goeddel
Abstract: A method includes placing an electronic device on a pliable mating surface on a major surface of a mold such that at least one contact pad on the electronic device presses against the pliable mating surface. The pliable mating surface is on a microstructure in an arrangement of microstructures on the major surface of the mold. A liquid encapsulant material is applied over the electronic device and the major surface of the mold, and then hardened to form a carrier for the electronic device. The mold and the carrier are separated such that the microstructures on the mold form a corresponding arrangement of microchannels in the carrier, and at least one contact pad on the electronic device is exposed in a microchannel in the arrangement of microchannels. A conductive particle-containing liquid is deposited in the microchannel, which directly contacts the contact pad exposed in the microchannel.
-
13.发明公开公开(公告)号：US20240239991A1
公开(公告)日：2024-07-18
申请号：US18014783
申请日：2021-07-22
Applicant: 3M INNOVATIVE PROPERTIES COMPANY
Inventor： Jacob P. Podkaminer , Matthew H. Frey , Victor Ho , Matthew T. Johnson , Jeremy K. Larsen , Craig W. Lindsay , Kyle C. Picha , Mario A. Perez
CPC classification number: C08K7/00 , C09K5/14 , C08K2201/001 , C08L33/02
Abstract: A shaped thermal filler particle has an elongate shape defined by a substantially planar first smooth surface and a second smooth surface that contacts the substantially planar first smooth surface along a planar closed path. The planar closed path has a length to width ratio of at least 1.5. The shaped thermal filler particle has a maximum linear dimension normal to the planar first smooth surface that is less than or equal to one half of the length of the closed path. A thermally conductive composition comprises from 1 to 95 percent by volume of the shaped thermal filler particles dispersed in a binder. An assembly comprises a heat source, a heat sink, and the thermally conductive composition at least partially sandwiched between the heat source and the heat sink.
-
公开(公告)号：US12020951B2
公开(公告)日：2024-06-25
申请号：US17594346
申请日：2020-04-14
Applicant: 3M INNOVATIVE PROPERTIES COMPANY
Inventor： Ankit Mahajan , Saagar A. Shah , Mikhail L. Pekurovsky , Kayla C. Niccum , Kara A. Meyers , Matthew R. D. Smith , Gino L. Pitera , Graham M. Clarke , Jeremy K. Larsen , Teresa M. Goeddel
CPC classification number: H01L21/56 , H01L23/293 , H01L23/3107 , H01L24/03 , H01L24/05 , H01L2224/03312 , H01L2224/0332 , H01L2224/03505 , H01L2224/03515 , H01L2224/04105 , H01L2224/05567
Abstract: A method includes placing an electronic device on a pliable mating surface on a major surface of a mold such that at least one contact pad on the electronic device presses against the pliable mating surface. The pliable mating surface is on a microstructure in an arrangement of microstructures on the major surface of the mold. A liquid encapsulant material is applied over the electronic device and the major surface of the mold, and then hardened to form a carrier for the electronic device. The mold and the carrier are separated such that the microstructures on the mold form a corresponding arrangement of microchannels in the carrier, and at least one contact pad on the electronic device is exposed in a microchannel in the arrangement of microchannels. A conductive particle-containing liquid is deposited in the microchannel, which directly contacts the contact pad exposed in the microchannel.
-
公开(公告)号：US11503720B2
公开(公告)日：2022-11-15
申请号：US17270912
申请日：2019-09-12
Applicant: 3M INNOVATIVE PROPERTIES COMPANY
Inventor： Saagar Shah , Mikhail L. Pekurovsky , Ankit Mahajan , Lyudmila A. Pekurovsky , Jessica Chiu , Jeremy K. Larsen , Kara A. Meyers , Teresa M. Goeddel , Thomas J. Metzler , Jonathan W. Kemling , Richard J. Pokorny , Benjamin R. Coonce , Chad M. Amb , Thomas P. Klun
Abstract: Flexible devices including conductive traces with enhanced stretchability, and methods of making and using the same are provided. The circuit die is disposed on a flexible substrate. Electrically conductive traces are formed in channels on the flexible substrate to electrically contact with contact pads of the circuit die. A first polymer liquid flows in the channels to cover a free surface of the traces. The circuit die can also be surrounded by a curing product of a second polymer liquid.
-
Patent Agency Ranking
公开(公告)号：US20220342126A1
公开(公告)日：2022-10-27
申请号：US17753281
申请日：2020-08-28
Applicant: 3M INNOVATIVE PROPERTIES COMPANY
Inventor： Daniel M. Lentz , Kevin W. Gotrik , Jeremy K. Larsen , Caleb T. Nelson , Daniel J. Schmidt , Fei Peng
Abstract: A method of manufacturing an optical film includes providing a base film. The base film includes a substrate defining a first surface and a second surface. The base film also includes a plurality of structures defining an upper surface and at least one side surface extending from the corresponding upper surface to a base portion. The method also includes depositing a catalyst material on each of the plurality of structures and the base portion to form a catalyst layer thereon. The method further includes selectively removing the catalyst layer from the upper surface of each of the plurality of structures and the base portion while retaining an activity of the catalyst layer on the at least one side surface of each of the plurality of structures. The method includes forming a metallic layer on the at least one side surface of each of the plurality of structures.
-
公开(公告)号：US20210319955A1
公开(公告)日：2021-10-14
申请号：US16949910
申请日：2019-05-16
Applicant: 3M INNOVATIVE PROPERTIES COMPANY
Inventor： Ankit Mahajan , Saagar A. Shah , Mikhail L. Pekurovsky , Thomas J. Metzler , Kayla C. Niccum , Eric A. Vandre , Aniruddha Upadhye , Robert R. Owings , Jeremy K. Larsen , Zohaib Hameed
IPC: H01G4/33 , H01F17/00 , H01F41/04 , H01C17/075 , H01C7/00 , H01C1/01 , H01C1/034 , H01C17/00 , H01G2/06 , H01G4/005 , H01G4/224
Abstract: Ultrathin and flexible electrical devices including circuit dies such as, for example, a capacitor chip, a resistor chip, and/or an inductor chip, and methods of making and using the same are provided. Circuit dies are attached to a major surface of a flexible substrate having channels Electrically conductive traces are formed in the channels, self-aligned with the circuit dies, and in direct contact with the bottom surface of the circuit dies.
-
公开(公告)号：US20210212216A1
公开(公告)日：2021-07-08
申请号：US17270912
申请日：2019-09-12
Applicant: 3M INNOVATIVE PROPERTIES COMPANY
Inventor： Saagar Shah , Mikhail L. Pekurovsky , Ankit Mahajan , Lyudmila A. Pekurovsky , Jessica Chiu , Jeremy K. Larsen , Kara A. Meyers , Teresa M. Goeddel , Thomas J. Metzler , Jonathan W. Kemling , Richard J. Pokorny , Benjamin R. Coonce , Chad M. Amb , Thomas P. Klun
Abstract: Flexible devices including conductive traces with enhanced stretchability, and methods of making and using the same are provided. The circuit die is disposed on a flexible substrate. Electrically conductive traces are formed in channels on the flexible substrate to electrically contact with contact pads of the circuit die. A first polymer liquid flows in the channels to cover a free surface of the traces. The circuit die can also be surrounded by a curing product of a second polymer liquid.
-
公开(公告)号：US20180370205A1
公开(公告)日：2018-12-27
申请号：US16064657
申请日：2016-12-22
Applicant: 3M INNOVATIVE PROPERTIES COMPANY
Inventor： Przemyslaw P. Markowicz , Neeraj Sharma , Jeremy K. Larsen , Jeffrey O. Emslander , Jung-Sheng Wu , Richard G. Anderson , Frank C. Piras
Abstract: Provided are adhesive-backed films and related methods useful in laser cutting a substrate protected by an adhesive-backed film. The adhesive-backed film includes a base layer comprised of a polymer and having opposing first and second major surfaces and an adhesive layer comprising a pressure-sensitive adhesive directly or indirectly coupled to the second major surface. An infrared absorber is present in one or both of the polymer and the pressure-sensitive adhesive, and the adhesive-backed film is sufficiently transparent to enable visual inspection of a surface having the adhesive-backed film disposed thereon.
-
公开(公告)号：US20170108628A1
公开(公告)日：2017-04-20
申请号：US15316882
申请日：2015-06-19
Applicant: 3M INNOVATIVE PROPERTIES COMPANY
Inventor： Jeremy K. Larsen , Kurt J. Halverson , Jeffrey L. Solomon
Abstract: Light control films are provided that confine light transmitted therethrough to be within a 360° view region and block light outside of this view region. The light control films can provide security in all directions including right-and-left and up-and-down of the films, without compromising light transmittance compared to one-dimensional light control films. The light control films include an array of light transmissive, tapered posts and absorptive regions disposed between the posts.
-
-
-
-
-
-
-
-
-
Search Results
26
records
(took 0.024 seconds)
