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公开(公告)号：US20240282592A1
公开(公告)日：2024-08-22
申请号：US18652529
申请日：2024-05-01
Applicant: 3M INNOVATIVE PROPERTIES COMPANY
Inventor： Ankit Mahajan , Saagar A. Shah , Mikhail L. Pekurovsky , Kayla C. Niccum , Kara A. Meyers , Matthew R.D. Smith , Gino L. Pitera , Graham M. Clarke , Jeremy K. Larsen , Teresa M. Goeddel
CPC classification number: H01L21/56 , H01L23/293 , H01L23/3107 , H01L24/03 , H01L24/05 , H01L2224/03312 , H01L2224/0332 , H01L2224/03505 , H01L2224/03515 , H01L2224/04105 , H01L2224/05567
Abstract: A method includes placing an electronic device on a pliable mating surface on a major surface of a mold such that at least one contact pad on the electronic device presses against the pliable mating surface. The pliable mating surface is on a microstructure in an arrangement of microstructures on the major surface of the mold. A liquid encapsulant material is applied over the electronic device and the major surface of the mold, and then hardened to form a carrier for the electronic device. The mold and the carrier are separated such that the microstructures on the mold form a corresponding arrangement of microchannels in the carrier, and at least one contact pad on the electronic device is exposed in a microchannel in the arrangement of microchannels. A conductive particle-containing liquid is deposited in the microchannel, which directly contacts the contact pad exposed in the microchannel.
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公开(公告)号：US20220367325A1
公开(公告)日：2022-11-17
申请号：US17754028
申请日：2020-09-17
Applicant: 3M INNOVATIVE PROPERTIES COMPANY
Inventor： Kayla C. Niccum , Ankit Mahajan , Saagar A. Shah , Kara A. Meyers , Mikhail L. Pekurovsky , Jonathan W. Kemling , David C. Mercord , Pranati Mondkar
IPC: H01L23/498 , H01L23/00 , H01L23/31
Abstract: A pattern of microchannels is formed on a major surface of a substrate on the side opposite an adhesive surface thereof. Through holes extend through the substrate and are connected to the pattern of microchannels. Solid circuit dies are adhesively bonded to the adhesive surface of the substrate. The contact pads of the solid circuit dies at least partially overlie and face the through holes. Electrically conductive channel traces are formed to electrically connect to the solid circuit dies via the through holes.
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公开(公告)号：US20220111490A1
公开(公告)日：2022-04-14
申请号：US17644864
申请日：2021-12-17
Applicant: 3M INNOVATIVE PROPERTIES COMPANY
Inventor： Joseph B. Eckel , Nicholas T. Gabriel , Ankit Mahajan , Mikhail L. Pekurovsky , Kara A. Meyers , Thomas J. Metzler , Saagar A. Shah
Abstract: A bonded abrasive wheel is disclosed comprising a plurality of abrasive particles disposed in a binder, a first grinding surface, a second surface opposing the first grinding surface, and an outer circumference. The wheel comprises a rotational axis extending through a central hub and a circuit configured as a Radio Frequency Identification (RFID) unit coupled to the abrasive wheel. The circuit comprises an antenna configured to communicate with one or more external devices and comprising a first end and a second end, wherein antenna has a radius of curvature about an axis along at least a portion thereof such that the first end is disposed adjacent to but is spaced from the second end, and an integrated circuit (IC) operably coupled to the antenna and configured to store at least a first data.
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公开(公告)号：US20210178554A1
公开(公告)日：2021-06-17
申请号：US17250673
申请日：2019-08-15
Applicant: 3M INNOVATIVE PROPERTIES COMPANY
Inventor： Joseph B. Eckel , Nicholas T. Gabriel , Ankit Mahajan , Mikhail L. Pekurovsky , Kara A. Meyers , Thomas J. Metzler , Saagar A. Shah
Abstract: A bonded abrasive wheel is disclosed comprising a plurality of abrasive particles disposed in a binder, a first grinding surface, a second surface opposing the first grinding surface, and an outer circumference. The wheel comprises a rotational axis extending through a central hub and a circuit configured as a Radio Frequency Identification (RFID) unit coupled to the abrasive wheel. The circuit comprises an antenna configured to communicate with one or more external devices and comprising a first end and a second end, wherein antenna has a radius of curvature about an axis along at least a portion thereof such that the first end is disposed adjacent to but is spaced from the second end, and an integrated circuit (IC) operably coupled to the antenna and configured to store at least a first data.
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公开(公告)号：US20210035875A1
公开(公告)日：2021-02-04
申请号：US16976126
申请日：2019-02-27
Applicant: 3M INNOVATIVE PROPERTIES COMPANY
Inventor： Ankit Mahajan , Mikhail L. Pekurovsky , Saagar A. Shah , Thomas J. Metzler , Kara A. Meyers , James Zhu , Teresa M. Goeddel , Lyudmila A. Pekurovsky , Jonathan W. Kemling , Jeremy K. Larsen
IPC: H01L23/16 , H01L23/31 , H01L23/544 , H01L23/498 , H01L21/56 , H01L21/54
Abstract: Processes for automatic registration between a solid circuit die and electrically conductive interconnects, and articles or devices made by the same are provided. The solid circuit die is disposed at a registration area of a substrate. Fluid channels extend into the registration area and have a portion underneath the bottom surface of the solid circuit die. Electrically conductive traces are formed by flowing a conductive liquid in the channels toward contact pads on the bottom surface of the circuit die to obtain the automatic registration.
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Patent Agency Ranking
公开(公告)号：US20190273061A1
公开(公告)日：2019-09-05
申请号：US16461015
申请日：2017-11-16
Applicant: 3M INNOVATIVE PROPERTIES COMPANY
Inventor： Ankit Mahajan , Mikhail L. Pekurovsky , Matthew S. Stay , Daniel J. Theis , Ann M. Gillman , Shawn C. Dodds , Thomas J. Metzler , Matthew R.D. Smith , Roger W. Barton , Joseph E. Hernandez , Saagar A. Shah , Kara A. Meyers , James Zhu , Teresa M. Goeddel , Lyudmila A. Pekurovsky , Jonathan W. Kemling , Jeremy K. Larsen , Jessica Chiu , Kayla C. Niccum
IPC: H01L23/00
Abstract: Processes for automatic registration between a solid circuit die and electrically conductive interconnects, and articles or devices made by the same are provided. The solid circuit die is disposed on a substrate with contact pads aligned with channels on the substrate. Electrically conductive traces are formed by flowing a conductive liquid in the channels toward the contact pads to obtain the automatic registration.
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公开(公告)号：US12205882B2
公开(公告)日：2025-01-21
申请号：US17754028
申请日：2020-09-17
Applicant: 3M INNOVATIVE PROPERTIES COMPANY
Inventor： Kayla C. Niccum , Ankit Mahajan , Saagar A. Shah , Kara A. Meyers , Mikhail L. Pekurovsky , Jonathan W. Kemling , David C. Mercord , Pranati Mondkar
IPC: H01L23/498 , H01L23/00 , H01L23/31
Abstract: A pattern of microchannels is formed on a major surface of a substrate on the side opposite an adhesive surface thereof. Through holes extend through the substrate and are connected to the pattern of microchannels. Solid circuit dies are adhesively bonded to the adhesive surface of the substrate. The contact pads of the solid circuit dies at least partially overlie and face the through holes. Electrically conductive channel traces are formed to electrically connect to the solid circuit dies via the through holes.
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公开(公告)号：US11996380B2
公开(公告)日：2024-05-28
申请号：US17309705
申请日：2019-12-23
Applicant: 3M INNOVATIVE PROPERTIES COMPANY
Inventor： Ankit Mahajan , Saagar A. Shah , Daniel B. Taylor , Mikhail L. Pekurovsky , Kara A. Meyers , Kayla C. Niccum , David J. Rowe , Gino L. Pitera
IPC: H01L23/00 , H01L21/56 , H01L23/31 , H01M50/109
CPC classification number: H01L24/19 , H01L21/568 , H01L23/3121 , H01L23/3135 , H01L24/20 , H01L24/24 , H01L24/82 , H01L2224/19 , H01L2224/211 , H01L2224/215 , H01L2224/24137 , H01L2224/24195 , H01L2224/82101 , H01L2924/186 , H01M50/109
Abstract: An article includes a solid circuit die on a first major surface of a substrate, wherein the solid circuit die includes an arrangement of contact pads, and wherein at least a portion of the contact pads in the arrangement of contact pads are at least partially exposed on the first major surface of the substrate to provide an arrangement of exposed contact pads; a guide layer including an arrangement of microchannels, wherein the guide layer contacts the first major surface of the substrate such that at least some microchannels in the arrangement of microchannels overlie the at least some exposed contact pads in the arrangement of exposed contact pads; and a conductive particle-containing liquid in at least some of the microchannels. Other articles and methods of manufacturing the articles are described.
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公开(公告)号：US11937381B2
公开(公告)日：2024-03-19
申请号：US17309699
申请日：2019-12-30
Applicant: 3M INNOVATIVE PROPERTIES COMPANY
Inventor： Ankit Mahajan , Mikhail L Pekurovsky , Saagar A. Shah , Kayla C. Niccum , Kara A. Meyers , Christopher G. Walker
IPC: H05K3/32 , H01L21/48 , H01L23/00 , H01L23/498 , H01R12/62 , H05K3/12 , H05K3/36 , H05K3/40 , H01R4/04
CPC classification number: H05K3/321 , H01L21/486 , H01L23/49827 , H01L23/4985 , H01L24/32 , H01R12/62 , H05K3/1258 , H05K3/1283 , H05K3/361 , H05K3/4069 , H01L2224/32235 , H01R4/04 , H05K2203/1545
Abstract: A method for manufacturing an electronic device includes providing a substrate with a first major surface having a microchannel, wherein the microchannel has a first end and a second end; dispensing a conductive liquid in the microchannel to cause the conductive liquid to move, primarily by capillary pressure, in a first direction toward the first end of the microchannel and in a second direction toward the second end of the microchannel; and solidifying the conductive liquid to form an electrically conductive trace electrically connecting a first electronic device at the first end of the microchannel to a second electronic device at the second end of the microchannel.
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公开(公告)号：US11628541B2
公开(公告)日：2023-04-18
申请号：US17644864
申请日：2021-12-17
Applicant: 3M INNOVATIVE PROPERTIES COMPANY
Inventor： Joseph B. Eckel , Nicholas T. Gabriel , Ankit Mahajan , Mikhail L. Pekurovsky , Kara A. Meyers , Thomas J. Metzler , Saagar A. Shah
Abstract: A bonded abrasive wheel is disclosed comprising a plurality of abrasive particles disposed in a binder, a first grinding surface, a second surface opposing the first grinding surface, and an outer circumference. The wheel comprises a rotational axis extending through a central hub and a circuit configured as a Radio Frequency Identification (RFID) unit coupled to the abrasive wheel. The circuit comprises an antenna configured to communicate with one or more external devices and comprising a first end and a second end, wherein antenna has a radius of curvature about an axis along at least a portion thereof such that the first end is disposed adjacent to but is spaced from the second end, and an integrated circuit (IC) operably coupled to the antenna and configured to store at least a first data.
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