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    Alkali-free glass
    11.
    发明授权
    Alkali-free glass 有权

    公开(公告)号：US11414339B2

    公开(公告)日：2022-08-16

    申请号：US17017891

    申请日：2020-09-11

    Applicant: AGC Inc.

    Inventor： Hirofumi Tokunaga ,  Kazutaka Ono

    IPC: C03C3/087 ,  C03C3/091

    Abstract: An alkali free glass has an average coefficient of thermal expansion at 50 to 350° C. of 30×10−7 to 43×10−7/° C., a Young's modulus of 88 GPa or more, a strain point of 650 to 725° C., a temperature T4 at which a viscosity reaches 104 dPa·s of 1,290° C. or lower, a glass surface devitrification temperature (Tc) of T4+20° C. or lower, and a temperature T2 at which the viscosity reaches 102 dPa·s of 1,680° C. or lower. The alkali free glass contains, as represented by mol % based on oxides, 62 to 67% of SiO2, 12.5 to 16.5% of Al2O3, 0 to 3% of B2O3, 8 to 13% of MgO, 6 to 12% of CaO, 0.5 to 4% of SrO, and 0 to 0.5% of BaO. MgO+CaO+SrO+BaO is 18 to 22%, and MgO/CaO is 0.8 to 1.33.

    Glass for chemical tempering, chemically tempered glass, and glass plate for display device
    13.
    发明授权
    Glass for chemical tempering, chemically tempered glass, and glass plate for display device 有权

    公开(公告)号：US10370286B2

    公开(公告)日：2019-08-06

    申请号：US14597587

    申请日：2015-01-15

    Applicant: AGC Inc.

    Inventor： Jun Endo ,  Shusaku Akiba ,  Kazutaka Ono ,  Tetsuya Nakashima

    IPC: C03C21/00 ,  C03C3/085 ,  C03C3/087 ,  C03C3/091 ,  G02F1/1333

    Abstract: To provide glass to be used for chemically tempered glass, of which the strength is less likely to be reduced even when indentations are formed thereon. Glass for chemical tempering, which comprises, as represented by mole percentage based on oxides, from 62 to 68% of SiO2, from 6 to 12% of Al2O3, from 7 to 13% of MgO, from 9 to 17% of Na2O, and from 0 to 7% of K2O, wherein the difference obtained by subtracting the content of Al2O3 from the total content of Na2O and K2O is less than 10%, and when ZrO2 is contained, its content is at most 0.8%. Chemically tempered glass obtained by chemically tempering such glass for chemical tempering. Such chemically tempered glass has a compressive stress layer formed on the glass surface, which has a thickness of at least 30 μm and a surface compressive stress of at least 550 MPa.

    Substrate, liquid crystal antenna and high-frequency device
    14.
    发明授权
    Substrate, liquid crystal antenna and high-frequency device 有权

    公开(公告)号：US12071373B2

    公开(公告)日：2024-08-27

    申请号：US17022264

    申请日：2020-09-16

    Applicant: AGC Inc.

    Inventor： Shuhei Nomura ,  Kazutaka Ono

    IPC: B32B15/04 ,  B32B17/06 ,  C03C3/091 ,  C03C4/16 ,  H01Q1/36

    CPC classification number: C03C4/16 ,  C03C3/091 ,  H01Q1/36 ,  C03C2204/00

    Abstract: The present invention relates to a substrate having a dielectric loss tangent (A) as measured at 20° C. and 10 GHz of 0.1 or less, a dielectric loss tangent (B) as measured at 20° C. and 35 GHz of 0.1 or less, and a ratio [a dielectric loss tangent (C) as measured at an arbitrary temperature in a range of −40 to 150° C. and at 10 GHz]/[the dielectric loss tangent (A)] of 0.90-1.10, or a substrate having a relative permittivity (a) as measured at 20° C. and 10 GHz of 4 or more and 10 or less, a relative permittivity (b) as measured at 20° C. and 35 GHz of 4 or more and 10 or less, and a ratio [a relative permittivity (c) as measured at an arbitrary temperature in a range of −40 to 150° C. and at 10 GHz]/[the relative permittivity (a)] of 0.993-1.007.

    Glass substrate, liquid crystal antenna and high-frequency device
    16.
    发明授权
    Glass substrate, liquid crystal antenna and high-frequency device 有权

    公开(公告)号：US11594811B2

    公开(公告)日：2023-02-28

    申请号：US17550080

    申请日：2021-12-14

    Applicant: AGC Inc.

    Inventor： Shuhei Nomura ,  Kazutaka Ono

    IPC: H01Q1/38 ,  H01Q1/22 ,  H01Q9/04 ,  H01Q15/00

    Abstract: Provided is a glass substrate with which it is possible to reduce dielectric loss in high-frequency signals, and which also has excellent thermal shock resistance. This invention satisfies the relation {Young's modulus (GPa)×average thermal expansion coefficient (ppm/° C.) at 50-350° C.}≤300 (GPa·ppm/° C.), wherein the relative dielectric constant at 20° C. and 35 GHz does not exceed 10, and the dielectric dissipation factor at 20° C. and 35 GHz does not exceed 0.006.

    Glass substrate, semiconductor device, and display device
    17.
    发明授权
    Glass substrate, semiconductor device, and display device 有权

    公开(公告)号：US11554983B2

    公开(公告)日：2023-01-17

    申请号：US16264722

    申请日：2019-02-01

    Applicant: AGC INC.

    Inventor： Shuhei Nomura ,  Kazutaka Ono

    IPC: C03C3/091 ,  C03C4/20 ,  H01L21/02 ,  H01L27/12 ,  H01L29/786 ,  G02F1/1333 ,  H01L21/762 ,  H01L29/66

    Abstract: A glass substrate has a compaction of 0.1 to 100 ppm. An absolute value |Δα50/100| of a difference between an average coefficient of thermal expansion α50/100 of the glass substrate and an average coefficient of thermal expansion of single-crystal silicon at 50° C. to 100° C., an absolute value |Δα100/200| of a difference between an average coefficient of thermal expansion α100/200 of the glass substrate and an average coefficient of thermal expansion of the single-crystal silicon at 100° C. to 200° C., and an absolute value |Δα200/300| of a difference between an average coefficient of thermal expansion α200/300 of the glass substrate and an average coefficient of thermal expansion of the single-crystal silicon at 200° C. to 300° C. are 0.16 ppm/° C. or less.

    Alkali-free glass substrate, laminated substrate, and glass substrate production method
    18.
    发明授权
    Alkali-free glass substrate, laminated substrate, and glass substrate production method 有权

    公开(公告)号：US11247933B2

    公开(公告)日：2022-02-15

    申请号：US16264734

    申请日：2019-02-01

    Applicant: AGC INC.

    Inventor： Shuhei Nomura ,  Kazutaka Ono

    IPC: B32B15/04 ,  C03C3/093 ,  C03B17/06 ,  B32B17/00 ,  C03C3/091 ,  C03B25/087

    Abstract: An alkali-free glass substrate which is a glass substrate includes, as represented by molar percentage based on oxides, 0.1% to 10% of ZnO. The alkali-free glass substrate has an average coefficient of thermal expansion α50/100 at 50 to 100° C. of from 2.70 ppm/° C. to 3.20 ppm/° C., an average coefficient of thermal expansion α200/300 at 200 to 300° C. of from 3.45 ppm/° C. to 3.95 ppm/° C., and a value α200/300/α50/100 obtained by dividing the average coefficient of thermal expansion α200/300 at 200 to 300° C. by the average coefficient of thermal expansion α50/100 at 50 to 100° C. of from 1.20 to 1.30.

    Glass substrate and laminated substrate
    20.
    发明授权
    Glass substrate and laminated substrate 有权

    公开(公告)号：US10994517B2

    公开(公告)日：2021-05-04

    申请号：US16355613

    申请日：2019-03-15

    Applicant: AGC INC.

    Inventor： Shigeki Sawamura ,  Kazutaka Ono

    IPC: B32B15/04 ,  B32B17/06 ,  B32B17/10 ,  C03C3/087 ,  C03C3/091 ,  H01L23/15 ,  C03B19/00

    Abstract: A first aspect of the present invention relates to a glass substrate having a content of alkali metal oxides, as represented by molar percentage based on oxides, of 0 to 0.1%, a devitrification-temperature viscosity of 103.2 dPa·s or higher, and an average coefficient of thermal expansion α at 30 to 220° C. of 7.80 to 9.00 (ppm/° C.). A second aspect of the present invention relates to a glass substrate which is to be used for a support substrate for semiconductor packages, the glass substrate having a content of alkali metal oxides, as represented by molar percentage based on oxides, of 0 to 0.1% and a photoelastic constant of 10 to 26 nm/cm/MPa.

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