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    Wafer-level manufacture of micro-devices and related two-piece devices, in particular micro-optical systems
    12.
    发明授权
    Wafer-level manufacture of micro-devices and related two-piece devices, in particular micro-optical systems 有权

    公开(公告)号：US11867968B2

    公开(公告)日：2024-01-09

    申请号：US16646707

    申请日：2018-08-16

    Applicant: ams Sensors Singapore Pte. Ltd.

    Inventor： Hartmut Rudmann ,  Alexander Bietsch

    IPC: G02B9/04 ,  G02B7/02

    CPC classification number: G02B7/025 ,  G02B7/021

    Abstract: The device (10) comprises a first member (1) and a second member (2) which are stacked upon each other in a direction vertical direction. The first and second members comprise a central portion (C1; C2) each, and the first member (1) comprises at least a first distancing element (4) abutting the second member (2). The device (10) comprises a gap zone (G) and a bonding material (3), wherein the gap zone is peripheral to the central portions (C1; C2), and in the gap zone (G), a gap (5) is present between the first and second members. A portion of the gap (5) is filled by the bonding material (3) bonding the first and second members to each other in a bonding zone (B) comprised in the gap zone. A height (h) of the gap (5) is defined by the first distancing element (4).

    Miniaturized optical devices, such as spectrometers and spectrometer modules, and their manufacture
    14.
    发明授权
    Miniaturized optical devices, such as spectrometers and spectrometer modules, and their manufacture 有权

    公开(公告)号：US11073642B2

    公开(公告)日：2021-07-27

    申请号：US16334239

    申请日：2017-09-15

    Applicant: ams Sensors Singapore Pte. Ltd.

    Inventor： Markus Rossi ,  Hartmut Rudmann ,  Bassam Hallal

    IPC: G02B5/18 ,  G01J3/02 ,  G01J3/18 ,  G02B5/10 ,  G02B27/42

    Abstract: A method for manufacturing an optical device comprising providing a plurality of initials bars each having a first side face presented with a first optical component arrangement; positioning the initial bars in a row with their first side faces facing a neighboring one of the initial bars; fixing the initial bars to obtain a bar arrangement; obtaining prism bars by segmenting the bar arrangement by at least one of the steps: conducting a plurality of cuts so that each prism bar comprises a portion of at least two different ones of the initial bars, separating the bar arrangement into sections along cut lines or by creating cut faces at an angle with initial-bar directions; dividing the first optical component arrangement for obtaining a plurality of passive optical components, wherein each prism bar comprises one or more passive optical components comprising a first reflective face each which is of non-planar shape; segmenting prism bars into parts.

    Sensor module and method of manufacturing the same
    18.
    发明授权
    Sensor module and method of manufacturing the same 有权

    公开(公告)号：US10378931B2

    公开(公告)日：2019-08-13

    申请号：US15385287

    申请日：2016-12-20

    Applicant: ams Sensors Singapore Pte. Ltd.

    Inventor： Hartmut Rudmann ,  Markus Rossi

    IPC: H01L27/146 ,  G01D5/30 ,  G01S17/88 ,  G01S7/481 ,  H01L31/0203 ,  H01L31/0232 ,  G01L9/00 ,  H01L27/144 ,  H01L31/173 ,  H01L31/18

    Abstract: The opto-electronic module (1) comprises a first substrate member (P); a third substrate member (B); a second substrate member (O) arranged between said first and third substrate members and comprising one or more transparent portions (ta, tb) through which light can pass, said at least one transparent portion comprising at least a first optical structure (5a;5a′;5b;5b′); a first spacer member (S1) comprised in said first substrate member (P) or comprised in said second substrate member (O) or distinct from and located between these, which comprises at least one opening (4a;4b); a second spacer member (S2) comprised in said second substrate member (O) or comprised in said third substrate member (B) or distinct from and located between these, which comprises at least one opening (3); a light detecting element (D) arranged on and electrically connected to said first substrate member (P); a light emission element (E) arranged on and electrically connected to said first substrate member (P); and a sensing element (8) comprised in or arranged at said third substrate member (B). Such modules (1) are particularly suitable as sensor modules for sensing a magnitude such as a pressure.

    Optoelectronic modules and wafer-level methods for manufacturing the same
    20.
    发明授权
    Optoelectronic modules and wafer-level methods for manufacturing the same 有权

    公开(公告)号：US12169315B2

    公开(公告)日：2024-12-17

    申请号：US16978736

    申请日：2019-02-27

    Applicant: ams Sensors Singapore Pte. Ltd.

    Inventor： Qi Chuan Yu ,  Hartmut Rudmann ,  Ji Wang ,  Kam Wah Leong ,  Kim Lung Ng

    IPC: G02B6/36 ,  G02B6/42 ,  H01L27/146 ,  H01L31/0232 ,  H01L33/56

    Abstract: An apparatus includes an optoelectronic component mounted to a PCB substrate. A transmissive adhesive is disposed directly on the optoelectronic component and is transmissive to light of a wavelength sensed by, or emitted by, the optoelectronic component. The apparatus includes an optical filter disposed directly on the transmissive adhesive. An epoxy laterally surrounds and is in contact with side surfaces of the transmissive adhesive and the optical filter. The epoxy is non-transmissive to light of a wavelength sensed by, or emitted by, the optoelectronic component. In some cases, the epoxy defines a recess directly over the optical filter to accommodate an optical component, such as an optical diffuser. Methods of fabricating the modules are disclosed as well.

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