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公开(公告)号：US20190028791A1
公开(公告)日：2019-01-24
申请号：US16139890
申请日：2018-09-24
Applicant: Apple Inc.
Inventor： John Bruss , Robert A. Boyd , Carlos M. Santana , Vijay Koneru
Abstract: Earphone assemblies with multiple subassembly housings are provided.
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公开(公告)号：USD1016782S1
公开(公告)日：2024-03-05
申请号：US29886203
申请日：2023-03-06
Applicant: Apple Inc.
Designer： Christopher Wiita , Robert Boyd , Duy P. Le , Carlos M. Santana
Abstract: FIG. 1 is a front view of earphones showing the claimed design;
FIG. 2 is a rear view thereof;
FIG. 3 is a top view thereof;
FIG. 4 is a bottom view thereof;
FIG. 5 is a right side view thereof; and,
FIG. 6 is a left side view thereof.
The broken lines in the figures show portions of the earphones that form no part of the claimed design.-
公开(公告)号：USD995474S1
公开(公告)日：2023-08-15
申请号：US29881974
申请日：2023-01-09
Applicant: Apple Inc.
Designer： Christina J. Smiechowski , Carlos M. Santana , Kevin P. Blasko , Guillaume Raoult , Christopher Kuh , Robert Brunner
Abstract: FIG. 1 is a top front perspective view of headphones showing the claimed design;
FIG. 2 is a top rear perspective view thereof;
FIG. 3 is a front view thereof;
FIG. 4 is a rear view thereof;
FIG. 5 is a left side view thereof;
FIG. 6 is a right side view thereof;
FIG. 7 is a top view thereof; and,
FIG. 8 is a bottom view thereof.
The broken lines in the figures show portions of the headphones that form no part of the claimed design.-
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Patent Agency Ranking
公开(公告)号：US20180070164A1
公开(公告)日：2018-03-08
申请号：US15696525
申请日：2017-09-06
Applicant: Apple Inc.
Inventor： John Bruss , Robert A. Boyd , Carlos M. Santana , Vijay Koneru
CPC classification number: H04R1/1016 , H01H13/50 , H01R12/53 , H01R12/57 , H01R43/205 , H04R1/1033 , H04R1/1041 , H04R1/1066 , H04R2201/103 , H04R2201/105 , H04R2201/107 , H04R2420/03 , H04R2420/07 , H04R2460/07 , H05K5/0017
Abstract: Earphone assemblies with multiple subassembly housings are provided.
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公开(公告)号：USD1066286S1
公开(公告)日：2025-03-11
申请号：US29930700
申请日：2024-03-01
Applicant: Apple Inc.
Designer： Christopher Wiita , Robert Boyd , Duy P. Le , Carlos M. Santana
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公开(公告)号：USD1022951S1
公开(公告)日：2024-04-16
申请号：US29880709
申请日：2023-07-26
Applicant: Apple Inc.
Designer： Christina J. Smiechowski , Carlos M. Santana , Kevin P. Blasko , Guillaume Raoult , Christopher Kuh , Robert Brunner
Abstract: FIG. 1 is a top front perspective view of headphones showing the claimed design;
FIG. 2 is a top rear perspective view thereof;
FIG. 3 is a front view thereof;
FIG. 4 is a rear view thereof;
FIG. 5 is a left side view thereof;
FIG. 6 is a right side view thereof;
FIG. 7 is a top view thereof; and,
FIG. 8 is a bottom view thereof.
The broken lines in the figures show portions of the headphones that form no part of the claimed design.-
公开(公告)号：USD1021852S1
公开(公告)日：2024-04-09
申请号：US29858396
申请日：2022-10-31
Applicant: Apple Inc.
Designer： Ryan Ott , Carlos M. Santana , William R. Rochowicz , Robert Boyd , Martin Gschwandtl , Guillaume Raoult , Christopher Kuh , Robert Brunner
Abstract: FIG. 1 is a top front perspective view of earphones showing the claimed design;
FIG. 2 is a bottom rear perspective view thereof;
FIG. 3 is a front view thereof;
FIG. 4 is a rear view thereof;
FIG. 5 is a left side view thereof;
FIG. 6 is a right side view thereof;
FIG. 7 is a top view thereof; and,
FIG. 8 is a bottom view thereof.
The broken lines in the figures show portions of the earphones that form no part of the claimed design.
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