Microlens array with tailored sag profile

    公开(公告)号:US20220229210A1

    公开(公告)日:2022-07-21

    申请号:US17509001

    申请日:2021-10-24

    Applicant: Apple Inc.

    Abstract: An optical device includes a first array of emitters disposed on a substrate and configured to emit respective beams of optical radiation in a direction perpendicular to the substrate. A second array of microlenses is positioned on the substrate in alignment with the respective beams of the emitters, having respective sag profiles that vary over an area of the substrate. The second array includes at least first microlenses in a central region of the substrate and second microlenses in a peripheral region of the substrate, such that the first microlenses have respective first focal powers, while the second microlenses have respective second focal powers, which are less than the first focal powers.

    Electronic Devices with Transmitter-Receiver Array

    公开(公告)号:US20250102631A1

    公开(公告)日:2025-03-27

    申请号:US18673072

    申请日:2024-05-23

    Applicant: Apple Inc.

    Abstract: Disclosed are electronic devices that include an array of light emitting diodes and photosensors formed in a single semiconductor chip. The light emitting diodes may be structured as vertical exterior cavity surface-emitting laser diodes (VECSELs). The photosensors may be formed as resonant cavity photosensors (RCPDs). The VECSELs and the RCPDs of the array may be formed in a common set of semiconductor layers of the single semiconductor chip and separated by isolation regions formed in the common set of semiconductor layers. Also disclosed are dual chip transmitter-receiver systems including a first semiconductor chip having an array of both VECSELs and RCPDs formed in common set of semiconductor layers, and a second semiconductor chip electrically connected to the first semiconductor chip and including control circuitry to enable laser emission from the VECSELs and light reception by the RCPDs.

    Vertical emitters with integrated final-stage transistor switch

    公开(公告)号:US20240088623A1

    公开(公告)日:2024-03-14

    申请号:US17944213

    申请日:2022-09-14

    Applicant: Apple Inc.

    CPC classification number: H01S5/042 H01S5/423 H01S5/343

    Abstract: An integrated emitter device incudes a silicon die, including an array of control circuits, and a plurality of integrated emitter modules disposed on the silicon die. Each integrated emitter module includes a single epitaxial stack comprising multiple layers of III-V semiconductor compounds, which define a vertical emitter including an optically active layer and upper and lower distributed Bragg reflectors (DBRs) on opposing sides of the optically active layer, and a transistor in series with the vertical emitter and including a terminal in contact with a respective one of the control circuits, so as to actuate the vertical emitter in response to a control signal applied to the terminal by the respective one of the control circuits.

    Optical Fiber Illumination by a Set of Light Emitters

    公开(公告)号:US20230034270A1

    公开(公告)日:2023-02-02

    申请号:US17865169

    申请日:2022-07-14

    Applicant: Apple Inc.

    Abstract: An electronic device includes a substrate, a set of light emitters on the substrate and arranged in a plurality of axisymmetric light emitter groups, a set of lenses including a different lens disposed over each axisymmetric light emitter group of the plurality of axisymmetric light emitter groups, and a set of optical fibers. At least one optical fiber in the set of optical fibers has a proximal end, a distal end, and a bend between the proximal end and the distal end. The proximal end is positioned to receive light, through a respective lens in the set of lenses, from the light emitters of a respective axisymmetric light emitter group in the plurality of axisymmetric light emitter groups.

    Vertical emitters with integral microlenses
    17.
    发明申请

    公开(公告)号:US20200251882A1

    公开(公告)日:2020-08-06

    申请号:US16779609

    申请日:2020-02-02

    Applicant: Apple Inc.

    Abstract: An optoelectronic device includes a semiconductor substrate having first and second faces. A first array of emitters are formed on the first face of the semiconductor substrate and are configured to emit respective beams of radiation through the substrate. Electrical connections are coupled to actuate selectively first and second sets of the emitters in the first array. A second array of microlenses are formed on the second face of the semiconductor substrate in respective alignment with the emitters in at least one of the first and second sets and are configured to focus the beams emitted from the emitters in the at least one of the first and second sets so that the beams are transmitted from the second face with different, respective first and second focal properties.

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