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公开(公告)号:US20190056794A1
公开(公告)日:2019-02-21
申请号:US15681322
申请日:2017-08-18
Applicant: Apple Inc.
Inventor: Michelle R. Goldberg , Kathleen A. Bergeron , Paul X. Wang , Alex J. Lehmann , William P. Yarak, III , Kevin C. Armendariz , Zheng Gao
IPC: G06F3/02 , H01H13/14 , H01H13/83 , H01H13/705 , H01H11/00
Abstract: Embodiments are directed to a low profile key for a keyboard having an overmolded support structure. In one aspect, an embodiment includes a key cap having an illuminable symbol. A support structure having a pair of overmolded wings may pivotally couple to the key cap. A switch housing may surround the support structure and connect each of the first and second wings. A tactile dome may be at least partially positioned within the switch housing and configured to bias the key cap upward. A sensing membrane may be positioned along an underside surface of the tactile dome and configured to trigger a switch event in response to a collapsing of the tactile dome caused by a depression of the key cap. A feature plate may be positioned below the sensing membrane. A light guide panel may define at least one light extraction feature that may be configured to propagate light toward the key cap and cause illumination of the illuminable symbol.
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公开(公告)号:US10025401B2
公开(公告)日:2018-07-17
申请号:US14848277
申请日:2015-09-08
Applicant: Apple Inc.
Inventor: Priyanka Bhandari , Blake R. Marshall , Li-Quan Tan , Reza Nasiri Mahalati , Aidan N. Zimmerman , Ryan P. Brooks , Kevin C. Armendariz
IPC: G06F3/044 , G06F3/038 , G06F3/0354 , H01G5/12 , H01G5/14
Abstract: A ring electrode to determine the orientation of the stylus relative to the surface. The stylus can include a ring electrode configuration which can improve capacitive coupling between the ring electrode and the touch panel. The ring electrode configuration can include a ring electrode and ground ring, and ground plate. By varying the lengths of ring electrode, ground ring, ground plate, and the distance between these elements, the electric field emanating from the ring electrode can be tuned to optimize the capacitive coupling between the ring electrode and surface. In some examples, the ring electrode can include multiple sub-rings. In some examples, the ring electrode can comprise a crown shape including projections, each having a width that tapers to a minimum width along the length of the ring electrode.
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13.
公开(公告)号:US20160091991A1
公开(公告)日:2016-03-31
申请号:US14502949
申请日:2014-09-30
Applicant: Apple Inc.
Inventor: Aidan N. Zimmerman , Bruce E. Berg , Gleen Aune , Kevin C. Armendariz , Ryan P. Brooks
CPC classification number: G06F3/03545 , G06F3/044 , H01L2223/6677 , H01L2224/16227 , H01L2924/3025 , H01Q1/243 , H05K1/0274 , H05K1/115 , H05K3/0014 , H05K3/284 , H05K3/4038 , H05K2201/09027 , H05K2201/09545
Abstract: An electronic device may have printed circuits to which electrical components are mounted. Plastic may be molded over a printed circuit. Vias may be formed in the printed circuit that connect metal traces on the surface of the molded plastic to metal traces on the printed circuit. The vias may be formed by drilling or by covering the metal traces on the printed circuit with mold pins in a molding tool during plastic molding operations. Plated metal traces or other metal traces may extend onto the interior surface of via holes. Vias may also be filled with conductive material such as solder or conductive adhesive. Metal members that are soldered or otherwise connected to printed circuit traces may be used in coupling surface metal traces to printed circuit traces. Antenna structure, shielding structures, and electrodes for a stylus may be formed using the metal traces on the molded plastic.
Abstract translation: 电子设备可以具有安装电气部件的印刷电路。 塑料可以在印刷电路上模制。 可以在印刷电路中形成通孔,其将模制塑料表面上的金属迹线连接到印刷电路上的金属迹线。 可以通过在塑料模制操作期间通过钻孔或通过在模制工具中的模具销覆盖印刷电路上的金属迹线来形成通孔。 镀金属痕迹或其他金属迹线可延伸到通孔的内表面。 通孔也可以填充导电材料,例如焊料或导电粘合剂。 焊接或以其他方式连接到印刷电路迹线的金属构件可用于将表面金属迹线耦合到印刷电路迹线。 用于触针的天线结构,屏蔽结构和电极可以使用模制塑料上的金属迹线形成。
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