公开(公告)号：US20240062364A1

公开(公告)日：2024-02-22

申请号：US18500811

申请日：2023-11-02

Applicant: Applied Materials, Inc.

Inventor： Sivakumar Dhandapani ,  Arash Alahgholipouromrani ,  Dominic J. Benvegnu ,  Jun Qian ,  Kiran Lall Shrestha

IPC: G06T7/00 ,  B24B37/013 ,  G06T7/60

CPC classification number: G06T7/001 ,  B24B37/013 ,  G06T7/60 ,  G06T2207/10024 ,  G06T2207/20021 ,  G06T2207/20081 ,  G06T2207/20084 ,  G06T2207/30148

Abstract: A neural network is trained for use in a substrate thickness measurement system by obtaining ground truth thickness measurements of a top layer of a calibration substrate at a plurality of locations, each location at a defined position for a die being fabricated on the substrate. A plurality of color images of the calibration substrate are obtained, each color image corresponding to a region for a die being fabricated on the substrate. A neural network is trained to convert color images of die regions from an in-line substrate imager to thickness measurements for the top layer in the die region. The training is performed using training data that includes the plurality of color images and ground truth thickness measurements with each respective color image paired with a ground truth thickness measurement for the die region associated with the respective color image.

公开(公告)号：US20230390891A1

公开(公告)日：2023-12-07

申请号：US17952059

申请日：2022-09-23

Applicant: Applied Materials, Inc.

Inventor： Thomas H. Osterheld ,  Benjamin Cherian ,  Jun Qian ,  Haoquan Fang ,  Nicholas A. Wiswell ,  Sohrab Pourmand ,  Jeonghoon Oh ,  Brian J. Brown

IPC: B24B49/00 ,  B24B49/18

CPC classification number: B24B49/003 ,  B24B49/186

Abstract: A chemical mechanical polishing apparatus includes a platen to support a polishing pad, a conditioner head to hold a conditioner disk in contact with the polishing pad, a motor to generate relative motion between the polishing pad and the conditioner disk so as to condition the polishing pad, an in-situ acoustic monitoring system having an acoustic sensor to receive acoustic signals from the conditioner disk, and a controller configured to analyze a signal from the acoustic sensor and determine a characteristic of the conditioner disk or conditioner head based on the signal.

公开(公告)号：US20230390885A1

公开(公告)日：2023-12-07

申请号：US17963143

申请日：2022-10-10

Applicant: Applied Materials, Inc.

Inventor： Nicholas A. Wiswell ,  Benjamin Cherian ,  Jun Qian ,  Thomas H. Osterheld

IPC: B24B37/005 ,  G01H11/08

CPC classification number: B24B37/005 ,  G01H11/08

Abstract: A chemical mechanical polishing apparatus includes a platen to support a polishing pad, a carrier head to hold a surface of a substrate against the polishing pad, a motor to generate relative motion between the platen and the carrier head so as to polish an overlying layer on the substrate, an in-situ acoustic monitoring system comprising an acoustic sensor that receives acoustic signals from the surface of the substrate, and a controller configured to determine an angular orientation of the substrate based on received acoustic signals from the in-situ acoustic monitoring system.

公开(公告)号：US20230267329A1

公开(公告)日：2023-08-24

申请号：US18310520

申请日：2023-05-01

Applicant: Applied Materials, Inc.

Inventor： Benjamin Cherian ,  Nicholas A. Wiswell ,  Jun Qian ,  Thomas H. Osterheld

IPC: G06N3/08 ,  G05B19/4063 ,  G05B19/4155 ,  H01L21/66 ,  G05B13/02 ,  G06N3/045

CPC classification number: G06N3/08 ,  G05B19/4063 ,  G05B19/4155 ,  H01L22/12 ,  G05B13/027 ,  G06N3/045 ,  G05B2219/45199 ,  G05B2219/32335 ,  G05B2219/45031 ,  G05B2219/40066 ,  G05B2219/41054

Abstract: A method of generating training spectra for training of a neural network includes measuring a first plurality of training spectra from one or more sample substrates, measuring a characterizing value for each training spectra of the plurality of training spectra to generate a plurality of characterizing values with each training spectrum having an associated characterizing value, measuring a plurality of dummy spectra during processing of one or more dummy substrates, and generating a second plurality of training spectra by combining the first plurality of training spectra and the plurality of dummy spectra, there being a greater number of spectra in the second plurality of training spectra than in the first plurality of training spectra. Each training spectrum of the second plurality of training spectra having an associated characterizing value.

公开(公告)号：US11651207B2

公开(公告)日：2023-05-16

申请号：US16449104

申请日：2019-06-21

Applicant: Applied Materials, Inc.

Inventor： Benjamin Cherian ,  Nicholas Wiswell ,  Jun Qian ,  Thomas H. Osterheld

IPC: G06N3/08 ,  G06N3/04 ,  G05B19/4063 ,  G05B19/4155 ,  H01L21/66 ,  G05B13/02

CPC classification number: G06N3/08 ,  G05B13/027 ,  G05B19/4063 ,  G05B19/4155 ,  G06N3/0454 ,  H01L22/12 ,  G05B2219/32335 ,  G05B2219/40066 ,  G05B2219/41054 ,  G05B2219/45031 ,  G05B2219/45199

Abstract: A method of generating training spectra for training of a neural network includes measuring a first plurality of training spectra from one or more sample substrates, measuring a characterizing value for each training spectra of the plurality of training spectra to generate a plurality of characterizing values with each training spectrum having an associated characterizing value, measuring a plurality of dummy spectra during processing of one or more dummy substrates, and generating a second plurality of training spectra by combining the first plurality of training spectra and the plurality of dummy spectra, there being a greater number of spectra in the second plurality of training spectra than in the first plurality of training spectra. Each training spectrum of the second plurality of training spectra having an associated characterizing value.

公开(公告)号：US20190143475A1

公开(公告)日：2019-05-16

申请号：US16191263

申请日：2018-11-14

Applicant: Applied Materials, Inc.

Inventor： Sivakumar Dhandapani ,  Jun Qian

IPC: B24B37/013 ,  B24B37/04 ,  B24B37/20

Abstract: An apparatus for chemical mechanical polishing includes a platen having a surface to support a polishing pad, a carrier head to hold a substrate against a polishing surface of the polishing pad, a pad conditioner to hold a conditioning disk against the polishing surface, an in-situ polishing pad thickness monitoring system; and, a controller configured to receive a signal from the monitoring system and generate a measure of polishing pad wear rate by applying a predictive filter to the signal.

公开(公告)号：US20160284615A1

公开(公告)日：2016-09-29

申请号：US15173584

申请日：2016-06-03

Applicant: Applied Materials, Inc.

Inventor： Tomohiko Kitajima ,  Jeffrey Drue David ,  Jun Qian ,  Taketo Sekine ,  Garlen C. Leung ,  Sidney P. Huey

IPC: H01L21/66 ,  H01L21/321 ,  B24B49/10 ,  H01L21/311 ,  B24B37/013 ,  H01L21/3105 ,  H01L21/67

CPC classification number: H01L22/26 ,  B24B37/013 ,  B24B49/105 ,  H01L21/31053 ,  H01L21/3212 ,  H01L21/67075 ,  H01L21/67092 ,  H01L21/67253 ,  H01L22/14 ,  H01L22/20 ,  H01L22/34

Abstract: A method of controlling polishing includes storing a base measurement, the base measurement being a measurement of a substrate after deposition of at least one layer overlying a semiconductor wafer and before deposition of an outer layer over the at least one layer, after deposition of the outer layer over the at least one layer and during polishing of the outer layer on substrate, receiving a sequence of raw measurements of the substrate from an in-situ monitoring system, normalizing each raw measurement in the sequence of raw measurement to generate a sequence of normalized measurements using the raw measurement and the base measurement, and determining at least one of a polishing endpoint or an adjustment for a polishing rate based on at least the sequence of normalized measurements.

Abstract translation: 控制抛光的方法包括存储基底测量，所述基底测量是沉积覆盖在半导体晶片上的至少一个层之后并且在外层沉积外层之后在所述至少一个层上沉积之后的衬底的测量值 层，并且在衬底上的外层的抛光期间，从原位监测系统接收衬底的原始测量序列，对原始测量序列中的每个原始测量进行归一化，以生成标准化的序列 使用原始测量和基础测量的测量，以及至少基于归一化测量的顺序来确定抛光终点或抛光速率的调整中的至少一个。

公开(公告)号：US12136574B2

公开(公告)日：2024-11-05

申请号：US18471893

申请日：2023-09-21

Applicant: Applied Materials, Inc.

Inventor： Kun Xu ,  Kiran Lall Shrestha ,  Doyle E. Bennett ,  David Maxwell Gage ,  Benjamin Cherian ,  Jun Qian ,  Harry Q. Lee

IPC: H01L21/304 ,  B24B37/013 ,  B24B49/10 ,  G06F17/15 ,  G06N3/08 ,  H01L21/321 ,  H01L21/66

Abstract: A method of polishing a substrate includes polishing a conductive layer on the substrate at a polishing station, monitoring the layer with an in-situ eddy current monitoring system to generate a plurality of measured signals values for a plurality of different locations on the layer, generating thickness measurements the locations, and detecting a polishing endpoint or modifying a polishing parameter based on the thickness measurements. The conductive layer is formed of a first material having a first conductivity. Generating includes calculating initial thickness values based on the plurality of measured signals values and processing the initial thickness values through a neural network that was trained using training data acquired by measuring calibration substrates having a conductive layer formed of a second material having a second conductivity that is lower than the first conductivity to generated adjusted thickness values.

公开(公告)号：US12090599B2

公开(公告)日：2024-09-17

申请号：US18365527

申请日：2023-08-04

Applicant: Applied Materials, Inc.

Inventor： Kun Xu ,  Benjamin Cherian ,  Jun Qian ,  Kiran Lall Shrestha

IPC: B24B37/00 ,  B24B37/013 ,  G05B19/418 ,  G06N3/045 ,  G06N3/08 ,  H01L23/00

CPC classification number: B24B37/013 ,  G05B19/4188 ,  G06N3/045 ,  G06N3/08 ,  H01L23/00 ,  G05B2219/32335

Abstract: A method of training a neural network includes obtaining two ground truth thickness profiles a test substrate, obtaining two thickness profiles for the test substrate as measured by an in-situ monitoring system while the test substrate is on polishing pads of different thicknesses, generating an estimated thickness profile for another thickness value that is between the two thickness values by interpolating between the two profiles, and training a neural network using the estimated thickness profile.

公开(公告)号：US20240139905A1

公开(公告)日：2024-05-02

申请号：US18365482

申请日：2023-08-04

Applicant: Applied Materials, Inc.

Inventor： Benjamin Cherian ,  Thomas H. Osterheld ,  Brian J. Brown ,  Haoquan Fang ,  Jeonghoon Oh ,  Jun Qian ,  Nicholas A. Wiswell ,  Sohrab Pourmand

IPC: B24B49/00 ,  B24B37/04 ,  B24B49/16 ,  B24B51/00

CPC classification number: B24B49/003 ,  B24B37/042 ,  B24B49/16 ,  B24B51/00

Abstract: A chemical mechanical polishing apparatus has a platen to support a polishing pad, the platen having a recess, a carrier head to hold a surface of a substrate against the polishing pad and comprising a retaining ring to retain the substrate below the carrier head, a motor to generate relative motion between the platen and the carrier head so as to polish the substrate, an in-situ acoustic monitoring system comprising an acoustic sensor arranged in the recess that receives acoustic energy from friction between the substrate and the polishing pad and from friction between the retaining ring and the polishing pad, and a controller configured to generate a value for a carrier head status parameter based on received acoustic signals from the in-situ acoustic monitoring system, and change or polishing parameter or generate an alert based on the carrier head status parameter.