公开(公告)号：US09392687B2

公开(公告)日：2016-07-12

申请号：US14946764

申请日：2015-11-19

Applicant: BOARDTEK ELECTRONICS CORPORATION

Inventor： Chien-Cheng Lee

IPC: H05K1/16 ,  H05K1/00 ,  H05K1/02 ,  H05K7/00 ,  H05K1/18 ,  H05K1/03 ,  H05K1/09

CPC classification number: H05K1/0204 ,  H05K1/183 ,  H05K3/4688 ,  H05K2201/0187 ,  H05K2201/09036 ,  H05K2201/10106

Abstract: A circuit board includes a multi-layer structure, a ceramic member, and a first conductive layer. The multi-layer structure has a thru-hole penetrating two opposite board surfaces thereof. The multi-layer structure includes a plurality of stacked plates and an adhesive connecting any two stacked plates. The ceramic member is arranged in the thru-hole of the multi-layer structure, and a surface of the ceramic member is approximately coplanar with a board surface of the multi-layer structure. The adhesive is adhered on the lateral surface of the ceramic member for connecting the ceramic member and the plates. The first conductive layer is formed on the board surface of the multi-layer structure and the surface of the ceramic member. Thus, the circuit board of the instant disclosure can be applied to a high-heat-generating product and is different from a conventional circuit board.

Abstract translation: 电路板包括多层结构，陶瓷构件和第一导电层。 多层结构具有通过其两个相对的板表面的通孔。 多层结构包括多个堆叠的板和连接任何两个堆叠的板的粘合剂。 陶瓷构件布置在多层结构的通孔中，并且陶瓷构件的表面与多层结构的板表面大致共面。 粘合剂粘附在陶瓷构件的侧表面上，用于连接陶瓷构件和板。 第一导电层形成在多层结构的板表面和陶瓷构件的表面上。 因此，本公开的电路板可以应用于高发热产品，并且与常规电路板不同。