公开(公告)号：US20230101638A1

公开(公告)日：2023-03-30

申请号：US16975771

申请日：2019-10-12

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Muxin DI ,  Ke WANG ,  Guoqiang WANG ,  Zhiwei LIANG ,  Renquan GU ,  Yingwei LIU ,  Qi YAO ,  Zhanfeng CAO

IPC: H01L33/62 ,  H01L33/38 ,  H01L33/00

Abstract: The present disclosure relates to a display substrate, a display device, and a method for manufacturing a display substrate. The display substrate includes a base substrate having a first side and a second side opposite to the first side, a via provided in the base substrate, a thin film transistor provided on the first side of the base substrate, a first conductive structure provided on the first side of the base substrate, wherein a first sub-portion of the first conductive structure is located in the via, and wherein a material of the first conductive structure is the same as a material of a source/drain electrode of the thin film transistor.

公开(公告)号：US20220262891A1

公开(公告)日：2022-08-18

申请号：US17630631

申请日：2021-04-29

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Shuang LIANG ,  Muxin DI ,  Zhiwei LIANG ,  Ke WANG ,  Zhanfeng CAO ,  Yingwei LIU

IPC: H01L27/32

Abstract: Disclosed are a connecting substrate and a fabrication method, a splicing screen, and a display apparatus. The connecting substrate has panel areas (10) and connecting areas (30) connecting every two adjacent panel areas (10), each panel area including a display area (20) surrounded by the connecting areas (30). The connecting substrate includes, in connecting area: a base (101); connecting wirings (102) on the base (101); an insulating layer (103) covering the plurality of connecting wirings (102) and defining a groove (106) for accommodating a display panel (107) to be spliced; through holes (105) penetrating the insulating layer (103); and connecting electrodes (104) respectively provided in the through holes (105) and coupled to the connecting wirings (102) in one-to-one correspondence. The connecting electrodes (104) are coupled to first pads (P1) on light-emitting surface of the display panel (107) to be spliced in one-to-one correspondence.

公开(公告)号：US20210225823A1

公开(公告)日：2021-07-22

申请号：US16632167

申请日：2019-08-06

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Zhiwei LIANG ,  Yingwei LIU ,  Muxin DI ,  Ke WANG ,  Zhanfeng CAO ,  Shibo JIAO

IPC: H01L25/16 ,  H01L27/12 ,  H01L23/00

Abstract: A display substrate, a method for fabricating the same, and a display device are provided. The display substrate includes: a substrate 100 that includes a first via filled with a first conductive section 4011; a drive thin film transistor that is placed on a first side of the substrate and includes a first terminal 2051; and a light emitting diode chip 300 that is placed on a second side of the substrate distal to the drive thin film transistor; wherein the light emitting diode chip 300 includes a first lead 301 and a second lead 302; the first lead 301 is in electrical contact with the first terminal 2051 through the first conductive section 4011; and the second lead 302 is in electrical contact with a second electrode 402 that is placed on the second side of the substrate.

公开(公告)号：US20230060979A1

公开(公告)日：2023-03-02

申请号：US17800236

申请日：2021-05-14

Applicant: BOE Technology Group Co., Ltd.

Inventor： Zhiwei LIANG ,  Zhanfeng CAO ,  Ke WANG ,  Yingwei LIU ,  Shunyu YAO ,  Shuang LIANG ,  Muxin DI

IPC: H01L33/62 ,  H01L33/00 ,  H01L33/38 ,  G09G3/32

Abstract: A method for manufacturing an array substrate and an array substrate are provided. The method includes: providing a base substrate; forming a driving circuit layer at a side of the base substrate; and forming a functional device layer at a side of the driving circuit layer. Forming the driving circuit layer includes forming at least one first lead layer. Forming the first lead layer includes: forming a conductive seed layer at the side of the base substrate; forming a removable pattern-defining layer on a surface of the conductive seed layer, the removable pattern-defining layer being provided with a lead opening exposing a part of the conductive seed layer; forming, in the lead opening, a metal plating layer on the surface of the conductive seed layer; removing the removable pattern-defining layer; and removing a part of the conductive seed layer not covered by the metal plating layer.

公开(公告)号：US20220123024A1

公开(公告)日：2022-04-21

申请号：US17281015

申请日：2020-01-03

Applicant: BOE Technology Group Co., Ltd.

Inventor： Zhanfeng CAO ,  Yingwei LIU ,  Ke WANG ,  Guocai ZHANG ,  Jianguo WANG ,  Zhiwei LIANG ,  Haixu LI ,  Muxin DI

IPC: H01L27/12 ,  H01L27/15

Abstract: An array substrate, a method for preparing the array substrate, and a backlight module are disclosed. Before electroplating a first metal layer on a pattern of a seed layer, the method further includes: forming a pattern of a compensation electrode wire electrically connected with a lead electrode on a side, where the lead electrode is formed, of a base substrate. The compensation electrode wire is at least on a second side of a wiring region, the pattern of the lead electrode is formed at a first side of the wiring region, and the first side and the second side are different sides. In the electroplating process, the lead electrode is connected with a negative pole of a power supply, the compensation electrode wire is electrically connected with the lead electrode, thus an area of an electroplating negative pole generating electric field lines is increased by utilizing the compensation electrode wire.

公开(公告)号：US20210264852A1

公开(公告)日：2021-08-26

申请号：US17254088

申请日：2020-03-20

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Renquan GU ,  Qi YAO ,  Jaiil RYU ,  Yingwei LIU ,  Zhiwei LIANG ,  Muxin DI ,  Wusheng LI

IPC: G09G3/3225 ,  H01L51/56 ,  H01L27/32

Abstract: A display substrate, a manufacturing method thereof and a display apparatus are provided. The display substrate includes a base substrate structure and a display structure on the base substrate structure, the display structure includes a plurality of light emitting units and is divided into multiple light-transmissive regions and multiple opaque regions; and a driving circuit for driving the display structure to display and comprising a pixel driving circuit between the base substrate structure and the display structure, and a peripheral circuit driving the pixel driving circuit and arranged on a side of the base substrate structure distal to the display structure and in the opaque regions, and the peripheral circuit is coupled to the pixel driving circuit through at least one through hole formed in the base substrate structure. The display substrate can realize frameless display, which is beneficial to realize seamless splicing display of a plurality of display substrates.

公开(公告)号：US20210210522A1

公开(公告)日：2021-07-08

申请号：US16650690

申请日：2019-10-08

Applicant: BOE Technology Group Co., Ltd.

Inventor： Yingwei LIU ,  Shuang LIANG ,  Zhiwei LIANG ,  Muxin DI ,  Ke WANG ,  Zhanfeng CAO

IPC: H01L27/12 ,  H01L25/16 ,  H01L25/065

Abstract: The disclosure relates to the technical field of display devices and discloses a display substrate, a splicing screen and a manufacturing method thereof. The display substrate includes a flexible substrate; a plurality of signal lines located at one side of the flexible substrate; a plurality of plating electrodes located at one side of the signal lines toward the flexible substrate and electrically connected to the signal lines in one-to-one correspondence; a plurality of first through holes in one-to-one correspondence to the plating electrodes and penetrating the flexible substrate and exposing the plating electrodes, the first through roles being filled with a conductive material inside; and a plurality of binding electrodes located at one side of the flexible substrate away from the signal lines and in one-to-one correspondence to the first through holes, the binding electrodes being electrically connected to corresponding plating electrode through conductive material in corresponding first through hole.

公开(公告)号：US20210066425A1

公开(公告)日：2021-03-04

申请号：US16641560

申请日：2019-08-26

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Muxin DI ,  Yingwei LIU ,  Zhiwei LIANG ,  Haixu LI ,  Zhanfeng CAO

IPC: H01L27/32 ,  H01L51/56 ,  G09G3/3225

Abstract: An Organic Light-emitting Diode (OLED) display substrate, a method of forming the same and a display device are provided. The OLED display substrate includes: a driving thin film transistor located on a base substrate and configured to drive an OLED light-emitting unit to emit light; and a photosensitive thin film transistor located on the base substrate and configured to be capable of detecting light emitted by the OLED light-emitting unit and generating an electrical signal, at least a part of film layers of the photosensitive thin film transistor and at least a part of film layers of the driving thin film transistor are disposed at a same layer and made of a same material.