公开(公告)号：US20210043619A1

公开(公告)日：2021-02-11

申请号：US16920771

申请日：2020-07-06

Applicant: BOE Technology Group Co., Ltd.

Inventor： Yingwei LIU ,  Ke WANG ,  Zhiwei LIANG ,  Muxin DI ,  Zhanfeng CAO ,  Shuang LIANG ,  Guangcai YUAN ,  Qi YAO ,  Dongni LIU

IPC: H01L25/18 ,  H01L23/538 ,  H01L23/00 ,  H01L25/00

Abstract: Provided are a display structure and a preparation method thereof, and a display apparatus. The display structure includes a flexible back plate and a display substrate which are stacked, the flexible back plate including a bonding electrode for bonding to an integrated circuit chip, and the flexible back plate being bent to form a bent portion on which the bonding electrode is located.

公开(公告)号：US20250143112A1

公开(公告)日：2025-05-01

申请号：US18692796

申请日：2023-07-31

Applicant: BOE Technology Group Co., Ltd.

Inventor： Dapeng XUE ,  Yingwei LIU ,  Ke WANG ,  Zhanfeng CAO

IPC: H10K59/131 ,  H10K59/12

Abstract: Disclosed are a display substrate. The display substrate of the present disclosure includes a base substrate, a pixel drive circuit, and a connection structure. The base substrate is provided with a connection via hole penetrating in a thickness direction of the base substrate, and the base substrate includes a first surface and a second surface disposed oppositely along the thickness direction of the base substrate; the pixel drive circuit is disposed on the first surface; the signal wiring is disposed on the second surface; and the connection structure is disposed in the connection via hole and electrically connects the signal wiring with the pixel drive circuit. The connection via hole is partially filled by the connection structure.

公开(公告)号：US20250096763A1

公开(公告)日：2025-03-20

申请号：US18576747

申请日：2022-08-25

Applicant: BOE Technology Group Co., Ltd.

Inventor： Yingwei LIU ,  Zhonglan ZHAO ,  Zhanfeng CAO ,  Ke WANG

IPC: H03H1/00 ,  H03H3/00 ,  H03H7/01

Abstract: A filter, a manufacturing method therefor, and an electronic device are provided. The filter includes a first substrate and a second substrate disposed opposite to each other, and a connection substrate disposed therebetween, wherein at least one first substrate electrode is disposed on the first substrate, at least one second substrate electrode is disposed on the second substrate, the connection substrate comprises, at least, a connection base substrate and at least one conductive post penetrating the connection base substrate in a thickness direction, an end of the conductive post close to the first substrate is provided with a first bump structure, an end of the conductive post close to the second substrate is provided with a second bump structure, and the first bump structure is connected with the first substrate electrode, the second bump structure is connected with the second substrate electrode, both in a bonding manner.

公开(公告)号：US20240365478A1

公开(公告)日：2024-10-31

申请号：US18769438

申请日：2024-07-11

Applicant: BOE Technology Group Co., Ltd.

Inventor： Guoteng LI ,  Shuilang DONG ,  Xinhong LU ,  Liuqing LI ,  Jingshang ZHOU ,  Baoman LI ,  Zhao CUI ,  Yingwei LIU

IPC: H05K3/46 ,  H05K1/11 ,  H05K3/16 ,  H05K3/40 ,  H05K5/00

CPC classification number: H05K3/4691 ,  H05K1/111 ,  H05K3/16 ,  H05K3/4007 ,  H05K5/0069 ,  H05K2203/0143 ,  H05K2203/0723 ,  H05K2203/1377

Abstract: Embodiments of the present disclosure provide a circuit board, a display apparatus, and a manufacturing method for a circuit board. The manufacturing method for the circuit board includes: providing a precursor substrate; forming seed patterns and an auxiliary seed pattern on a side of the precursor substrate, where the seed patterns are located in the patterned areas, the auxiliary seed pattern is located in the non-patterned area, and the seed pattern and the auxiliary seed pattern are separated from each other; and forming a pad at a position of the seed pattern and an auxiliary pattern at a position of the auxiliary seed pattern by an electroplating process.

公开(公告)号：US20230097502A1

公开(公告)日：2023-03-30

申请号：US16982217

申请日：2019-12-19

Applicant: BOE Technology Group Co., Ltd.

Inventor： Zhiwei LIANG ,  Yingwei LIU ,  Zhijun LV ,  Ke WANG ,  Zhanfeng CAO ,  Hsuanwei MAI ,  Guangcai YUAN ,  Muxin DI

IPC: H01L33/62 ,  H01L25/075 ,  H01L23/00

Abstract: A display backboard and a manufacturing method thereof, and a display device are provided. The display backboard includes: a driving substrate; a plurality of driving electrodes on the driving substrate; and a plurality of connection structures respectively on the plurality of driving electrodes. The connection structure includes: at least one conductive component on the driving electrode; and a restriction component on a side of the driving electrodes provided with the at least one conductive component and in at least a part of a peripheral region of the at least one conductive component. The restriction component protrudes from the driving electrode and has a first height in a direction perpendicular to the driving substrate.

公开(公告)号：US20220406749A1

公开(公告)日：2022-12-22

申请号：US17638703

申请日：2020-02-28

Applicant: BOE Technology Group Co., Ltd.

Inventor： Zhanfeng CAO ,  Jiushi WANG ,  Ke WANG ,  Guocai ZHANG ,  Junwei YAN ,  Yingwei LIU ,  Haitao HUANG ,  Guangcai YUAN

IPC: H01L23/00 ,  H01L33/62 ,  H01L25/075 ,  H01L25/16

Abstract: Disclosed are an electrical connection method for an electronic element, and a backlight module, a display panel, and a display apparatus which include an electronic element to which the electrical connection method is applied. The electrical connection method comprises: providing a driving back plane, wherein the driving back plane comprises multiple contact electrodes; forming an anti-oxidation protection film on the contact electrodes; coating a position of the anti-oxidation protection film corresponding to each contact electrode with a binding material; and transferring multiple electronic elements to the positions of the corresponding contact electrodes, binding each electronic element to the corresponding contact electrode, and removing the anti-oxidation protection film at the position of each contact electrode before completing the binding of each electronic element to the corresponding contact electrode.

公开(公告)号：US20220375966A1

公开(公告)日：2022-11-24

申请号：US17772234

申请日：2021-05-18

Applicant: BOE Technology Group Co., Ltd.

Inventor： Xue DONG ,  Guangcai YUAN ,  Ce NING ,  Zhiwei LIANG ,  Feng GUAN ,  Zhaohui QIANG ,  Yingwei LIU ,  Ke WANG ,  Zhanfeng CAO

IPC: H01L27/12 ,  H01L23/00

Abstract: An array substrate includes a base substrate, a driving circuit layer, and a functional device layer which are sequentially stacked; the driving circuit layer is provided with first driving circuits, and each first driving circuit at least comprises a driving transistor; and the driving circuit layer comprises a first gate layer, a first gate insulation layer, a semiconductor layer, a second gate insulation layer, a second gate layer, an interlayer dielectric layer, and a source-drain metal layer which are sequentially stacked on one side of the base substrate.

公开(公告)号：US20210408168A1

公开(公告)日：2021-12-30

申请号：US16605493

申请日：2019-04-28

Applicant: BOE Technology Group Co., Ltd.

Inventor： Shuang LIANG ,  Yingwei LIU ,  Zhanfeng CAO ,  Zhiwei LIANG ,  Muxin DI

IPC: H01L27/32 ,  H01L41/113

Abstract: Disclosed herein is a photoelectric sensor, display panel and their manufacturing method. The photoelectric sensor may comprise a photodeformable unit and a piezoelectric unit in contact with the photodeformable unit.

公开(公告)号：US20210217646A1

公开(公告)日：2021-07-15

申请号：US16758074

申请日：2019-01-29

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Yingwei LIU ,  Zhanfeng CAO ,  Muxin Dl ,  Ke WANG ,  Zhiwei LIANG ,  Renquan GU

IPC: H01L21/683 ,  H01L21/677 ,  H01L33/62

Abstract: The present disclosure relates to an element pickup device, a method for manufacturing the same and a method for using the same. The element pickup device includes: a first substrate and a second substrate oppositely disposed; a spacing part located between the first substrate and the second substrate, wherein the spacing part is spaced apart from each other to define a flow channel for liquid; and an element pickup part including an opening located in the second substrate and in communication with the flow channel.

公开(公告)号：US20210066538A1

公开(公告)日：2021-03-04

申请号：US16918753

申请日：2020-07-01

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Yingwei LIU ,  Zhiwei LIANG ,  Ke WANG ,  Zhanfeng CAO ,  Shuang LIANG

IPC: H01L33/00 ,  H01L27/15 ,  H01L33/56 ,  H01L33/48

Abstract: A method for manufacturing a display substrate includes: fabricating a first functional structure on a first side of a common substrate, and fabricating a second functional structure on a second side of the common substrate; fabricating a via hole in an edge region of the common substrate; and fabricating a conductive connection portion in the via hole, a first end of the conductive connection portion on the first side extending out of the via hole and coupled to a first functional pattern in the first functional structure, and a second end of the conductive connection portion on the second side extending out of the via hole and coupled to a second functional pattern in the second functional structure. The method provided in embodiments of the present disclosure is applied to the manufacturing of a display substrate.