公开(公告)号：US20090161396A1

公开(公告)日：2009-06-25

申请号：US12155860

申请日：2008-06-11

Applicant: Chun-Ming Lin ,  Hsin-Yu Pan

Inventor： Chun-Ming Lin ,  Hsin-Yu Pan

IPC: H02M7/00

CPC classification number: H02M3/33592 ,  Y02B70/1475

Abstract: Disclosed are a synchronous rectifier control device and a forward synchronous rectifier circuit. The synchronous rectifier control device is coupled with the secondary side of the forward synchronous rectifier circuit, comprising a condition detecting unit, a reference time circuit and a synchronous signal generator. The condition detecting unit receives at least one reference signal and a detecting signal in response to the condition of the secondary side of the forward synchronous rectifier circuit, and accordingly generates a first synchronous control signal. The reference time circuit is coupled with the condition detecting unit, and generates a reference time signal in response to the first synchronous control signal. The synchronous signal generator generates a second synchronous control signal in response to the first synchronous control signal and the reference time signal.

Abstract translation: 公开了一种同步整流器控制装置和正向同步整流电路。 同步整流器控制装置与正向同步整流电路的次级侧耦合，包括状态检测单元，基准时间电路和同步信号发生器。 条件检测单元响应于正向同步整流电路的次级侧的状态接收至少一个参考信号和检测信号，并且因此产生第一同步控制信号。 参考时间电路与条件检测单元耦合，并响应于第一同步控制信号产生参考时间信号。 同步信号发生器响应于第一同步控制信号和基准时间信号产生第二同步控制信号。

公开(公告)号：US12293966B2

公开(公告)日：2025-05-06

申请号：US18492816

申请日：2023-10-24

Applicant: Chun-Ming Lin

Inventor： Chun-Ming Lin

IPC: C23C18/38 ,  C25D3/38 ,  C25D7/12 ,  H01L21/48 ,  H01L23/498 ,  H05K1/09 ,  H05K1/11 ,  H05K1/18

Abstract: The present disclosure provides a method for forming a multilayer wiring structure, which includes: forming a patterned copper-phosphorous alloy layer over a carrier by performing a plating operation, and forming a dielectric layer over the patterned copper-phosphorous alloy layer. The forming the patterned copper-phosphorous alloy layer includes providing a plating solution having a copper source and a phosphorous source.

公开(公告)号：US12245418B1

公开(公告)日：2025-03-04

申请号：US18931868

申请日：2024-10-30

Applicant: Chun-Ming Lin

Inventor： Chun-Ming Lin

IPC: H01L27/22 ,  H01L29/423 ,  H01L29/49 ,  H01L29/775 ,  H10B12/00 ,  H10B43/30 ,  H10B80/00

Abstract: A semiconductor structure integrating a logic element and a memory element includes a substrate, a logic element and a memory element. The substrate has a first region and a second region laterally adjacent to the first region. The logic element is disposed in the first region of the substrate, and the memory element is disposed in the second region of the substrate. The logic element includes multiple transistors. The memory element includes an upper electrode, a lower electrode, and a dielectric layer disposed between the upper electrode and the lower electrode. The lower electrode includes a first metal layer, and a first copper-phosphorus alloy layer extending along a contour of the first metal layer to surround the first metal layer. The upper electrode includes a second metal layer, and a second copper-phosphorus alloy layer extending along a contour of the second metal layer to surround the second metal layer.

公开(公告)号：US11842958B2

公开(公告)日：2023-12-12

申请号：US17697937

申请日：2022-03-18

Applicant: Chun-Ming Lin

Inventor： Chun-Ming Lin

IPC: H05K1/09 ,  H05K1/11 ,  H01L23/498 ,  C25D7/12 ,  H01L21/48 ,  C25D3/38 ,  H05K1/18

CPC classification number: H01L23/49866 ,  C25D3/38 ,  C25D7/12 ,  H01L21/4857 ,  H01L23/49822 ,  H01L23/49827 ,  H05K1/09 ,  H05K1/112 ,  H05K1/18 ,  H05K2201/0332 ,  H05K2201/0364 ,  H05K2201/095 ,  H05K2201/09509

Abstract: The present disclosure provides a multilayer wiring structure, including a plurality of dielectric layers, a plurality of conductive wiring layers interleaved with the plurality of dielectric layers, wherein the plurality of conductive wiring layers includes copper-phosphorous alloys (such as Cu3P).

公开(公告)号：US11764153B1

公开(公告)日：2023-09-19

申请号：US17815613

申请日：2022-07-28

Applicant: Chun-Ming Lin

Inventor： Chun-Ming Lin

IPC: H01L23/538 ,  H01L23/528 ,  H01L23/522 ,  H01L21/768

CPC classification number: H01L23/5283 ,  H01L21/76816 ,  H01L21/76834 ,  H01L21/76877 ,  H01L23/5226

Abstract: The present disclosure provides an interconnect structure and a method for forming an interconnect structure. The interconnect structure includes a first metal line, a first interlayer dielectric (ILD) layer over the first metal line, a first conductive feature over the first metal line, wherein at least a portion of the first conductive feature is laterally surrounded by the first ILD layer, and a sidewall of the first conductive feature has a corrugated profile.

公开(公告)号：US07952894B2

公开(公告)日：2011-05-31

申请号：US12155353

申请日：2008-06-03

Applicant: Chun-Ming Lin ,  Ta-Ching Hsu ,  Yun-Kang Chu

Inventor： Chun-Ming Lin ,  Ta-Ching Hsu ,  Yun-Kang Chu

IPC: H02M3/335 ,  H02M7/217

CPC classification number: H02M3/33592 ,  Y02B70/1475

Abstract: A synchronous rectifier control device comprises a status detecting unit, an analog circuit, a first counter, a second counter and a signal process unit. The status detecting unit receives at least one reference signal and a detecting signal to generate a first synchronous control signal. The analog circuit generates a delay signal in accordance with the first synchronous control signal. The first counter receives a clock signal and generates a first counter signal in accordance with the first synchronous control signal, the clock signal, and the delay signal. The second counter receives the clock signal and generates a second counter signal in accordance with the first synchronous control signal, the clock signal, and the first counter signal. The signal process unit generates a second synchronous control signal in accordance with the first synchronous control signal and the second signal.

Abstract translation: 同步整流器控制装置包括状态检测单元，模拟电路，第一计数器，第二计数器和信号处理单元。 状态检测单元接收至少一个参考信号和检测信号以产生第一同步控制信号。 模拟电路根据第一同步控制信号产生延迟信号。 第一计数器接收时钟信号，并根据第一同步控制信号，时钟信号和延迟信号产生第一计数器信号。 第二计数器接收时钟信号，并根据第一同步控制信号，时钟信号和第一计数器信号产生第二计数器信号。 信号处理单元根据第一同步控制信号和第二信号产生第二同步控制信号。

公开(公告)号：US20100056860A1

公开(公告)日：2010-03-04

申请号：US12461390

申请日：2009-08-11

Applicant: Shih-Chieh Lu ,  Chun-Ming Lin

Inventor： Shih-Chieh Lu ,  Chun-Ming Lin

IPC: A61B1/00

CPC classification number: A61B1/041

Abstract: A capsule endoscope for observing the conditions inside a patient's digestive tract system includes a capsular housing, a substrate, and a plurality of metal-insert molded contacts. The capsular housing defines a sealed inner space and has an outer surface. The substrate is arranged in the sealed inner space of the capsular housing and is mounted with at least an electronic element provided thereon. The metal-insert molded contacts are embedded in the capsular housing at predetermined positions thereof and each includes a contact base and an exposed contact portion formed on the contact base. The contact bases each have a connecting section extended into the sealed inner space of the capsular housing to electrically connect to the substrate. The exposed contact portions each have a front surface exposed from the outer surface of the capsular housing for contacting with a signal contact correspondingly provided on a capsule holder that holds the capsular housing thereto.

Abstract translation: 用于观察患者消化道系统内的状况的胶囊型内窥镜包括：胶囊壳体，基板，以及多个金属嵌入成形接头。 胶囊壳体限定密封的内部空间并具有外表面。 衬底布置在胶囊壳体的密封内部空间中，并且至少安装有设置在其上的电子元件。 金属嵌入模制的触点嵌入到胶囊壳体的预定位置处，并且每个包括接触基部和形成在接触基底上的暴露的接触部分。 接触底座各自具有延伸到胶囊壳体的密封内部空间中的电连接到基板的连接部分。 暴露的接触部分各自具有从胶囊壳体的外表面露出的前表面，用于与相应地设置在将胶囊保持器保持在其上的胶囊保持器上的信号触点接触。

公开(公告)号：US07382320B2

公开(公告)日：2008-06-03

申请号：US11493017

申请日：2006-07-24

Applicant: The-Nan Chang ,  Chun-Ming Lin

Inventor： The-Nan Chang ,  Chun-Ming Lin

IPC: H01Q1/38

CPC classification number: H01Q9/0428 ,  H01Q1/2216 ,  H01Q9/0457

Abstract: The present invention relates to a circularly polarized antenna and, more particularly, to a compact circularly polarized antenna for transmitting and receiving a circularly polarized signal. The circularly polarized antenna comprises a substrate having an upper surface and a lower surface; a signal distributor; an antenna for transmitting and receiving the circularly polarized signal; and a plurality of support units. The upper surface of the substrate comprises a plurality of slots. One end of each slot overlaps with the respective ends of the other slots at a central region. The lower surface of the substrate comprises a coupling unit being electrically connected with the signal distributor, and the center of the coupling unit corresponds to the central region.

Abstract translation: 圆极化天线技术领域本发明涉及圆极化天线，更具体地，涉及用于发送和接收圆偏振信号的紧凑圆极化天线。 圆极化天线包括具有上表面和下表面的基板; 信号分配器; 用于发送和接收圆偏振信号的天线; 和多个支撑单元。 基板的上表面包括多个槽。 每个狭槽的一端在中央区域与其它槽的相应端重叠。 基板的下表面包括与信号分配器电连接的耦合单元，耦合单元的中心对应于中心区域。

公开(公告)号：US20070257844A1

公开(公告)日：2007-11-08

申请号：US11493017

申请日：2006-07-24

Applicant: The-Nan Chang ,  Chun-Ming Lin

Inventor： The-Nan Chang ,  Chun-Ming Lin

IPC: H01Q1/38

CPC classification number: H01Q9/0428 ,  H01Q1/2216 ,  H01Q9/0457

Abstract: The present invention relates to a circularly polarized antenna and, more particularly, to a compact circularly polarized antenna for transmitting and receiving a circularly polarized signal. The circularly polarized antenna comprises a substrate having an upper surface and a lower surface; a signal distributor; an antenna for transmitting and receiving the circularly polarized signal; and a plurality of support units. The upper surface of the substrate comprises a plurality of slots. One end of each slot overlaps with the respective ends of the other slots at a central region. The lower surface of the substrate comprises a coupling unit being electrically connected with the signal distributor, and the center of the coupling unit corresponds to the central region.

Abstract translation: 圆极化天线技术领域本发明涉及圆极化天线，更具体地，涉及用于发送和接收圆偏振信号的紧凑圆极化天线。 圆极化天线包括具有上表面和下表面的基板; 信号分配器; 用于发送和接收圆偏振信号的天线; 和多个支撑单元。 基板的上表面包括多个槽。 每个狭槽的一端在中央区域与其它槽的相应端重叠。 基板的下表面包括与信号分配器电连接的耦合单元，耦合单元的中心对应于中心区域。