公开(公告)号：US20240052226A1

公开(公告)日：2024-02-15

申请号：US18271129

申请日：2021-12-28

Applicant: DENKA COMPANY LIMITED

Inventor： Kosuke WADA ,  Kiyotaka FUJI

IPC: C09K5/14

CPC classification number: C09K5/14

Abstract: Aggregated boron nitride particles in which hexagonal boron nitride primary particles are aggregated and which include an alkyl group-containing silane coupling agent. The present invention can provide boron nitride powder for obtaining a heat-dissipation sheet with excellent thermal conductivity, a heat-dissipation sheet with excellent thermal conductivity, and a method of producing a heat-dissipation sheet with excellent thermal conductivity.

公开(公告)号：US20230052370A1

公开(公告)日：2023-02-16

申请号：US17792835

申请日：2021-03-18

Applicant: DENKA COMPANY LIMITED

Inventor： Kosuke WADA ,  Yoshitaka TANIGUCHI

IPC: C09K5/14 ,  C08K3/38 ,  C08J3/20 ,  C08J5/18

Abstract: A heat dissipation sheet containing a silicone resin and a thermally conductive filler, wherein with respect to the cross-sectional shape of the thermally conductive filler, the average value of an aspect ratio of the 1st to 24th particles from the largest of biaxial average diameters, is in a range of 0.4 or more and 1.4 or less. In addition, an area ratio (Sr) of a total area S of cross-sectional shapes of the particles to a whole area of the cross-sectional view may be in a range of 20% or more and 80% or less, and the particle number ratio may be less than 1. Further, a thermal resistance ratio of a thermal resistance value when a pressure of 0.4 MPa is applied to a thermal resistance value when a pressure of 1.0 MPa is applied may be 1 or more.

公开(公告)号：US20160358840A1

公开(公告)日：2016-12-08

申请号：US15119052

申请日：2015-02-20

Applicant: Denka Company Limited

Inventor： Ryota AONO ,  Kosuke WADA ,  Masao TSUICHIHARA ,  Takeshi MIYAKAWA

IPC: H01L23/373 ,  H01L23/498 ,  C04B37/02

Abstract: [Problem] To obtain a ceramic circuit substrate having high bonding strength, excellent heat cycle resistance, enhanced reliability of operation as an electronic device, and excellent heat dissipation properties.[Solution] A ceramic circuit substrate in which metal plates and both main surfaces of a ceramic substrate are bonded via silver-copper brazing material layers, the ceramic Cit quit substrate characterized in that the silver-copper brazing material layers are formed from a silver-copper brazing material including 0.3-7.5 parts by mass of carbon fibers and 1.0-9.0 parts by mass of at least one active metal selected from titanium, zirconium, hafnium, niobium, tantalum, vanadium, and tin with respect to 75-98 parts by mass of silver powder and 2-25 parts by mass of copper powder totaling 100 part by mass, with the carbon fibers having an average length of 15-400 μm, an average diameter of 5-25 μm and an average aspect ratio of 3-28.

Abstract translation: [解决方案]陶瓷电镀基板，其中金属板和陶瓷基板的两个主表面通过银 - 铜钎料层接合，陶瓷Cit离子基板的特征在于，银 - 铜钎焊材料层由银 - 含有0.3〜7.5质量份的碳纤维的铜钎焊材料和选自钛，锆，铪，铌，钽，钒和锡中的至少一种活性金属相对于75-98份的1.0-9.0质量份 银粉的质量和总计100质量份的2〜25质量份的铜粉，碳纤维的平均长度为15〜400μm，平均直径为5〜25μm，平均长径比为3〜 28。