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公开(公告)号：US20200216603A1
公开(公告)日：2020-07-09
申请号：US16623456
申请日：2018-04-24
Applicant: DIC Corporation
Inventor： Yutaka Satou , Kazuhisa Yamoto , Koji Hayashi
Abstract: The present invention aims to provide a means by which a cured product to be obtained has a low dielectric loss tangent and higher heat resistance. Specifically, provided is an active ester resin that is a reaction product of a first aromatic compound having two or more phenolic hydroxy groups, a second aromatic compound having a phenolic hydroxy group, and a third aromatic compound having two or more carboxy groups and/or an acid halide thereof or an esterified compound thereof, in which at least one of the first aromatic compound, the second aromatic compound, and the third aromatic compound and/or the acid halide thereof or the esterified compound thereof has an unsaturated bond-containing substituent.
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公开(公告)号：US20190153215A1
公开(公告)日：2019-05-23
申请号：US16313293
申请日：2017-06-22
Applicant: DIC Corporation
Inventor： Yutaka Satou , Akito Kawasaki , Tatsuya Okamoto , Kazuhisa Yamoto
Abstract: Provided are an active ester composition capable of exhibiting high curability and forming a cured product with various excellent properties such as low dielectric properties, a cured product thereof, and a semiconductor encapsulating material and a printed wiring board which are obtained using the active ester composition. The active ester composition includes, as essential components, an active ester compound (A) and a phenolic hydroxyl group-containing compound (B), in which the active ester compound (A) is an esterification product of a compound having one phenolic hydroxyl group in the molecular structure (a1) and an aromatic polycarboxylic acid or an acid halide thereof (a2). Also provided are a cured product thereof, and a semiconductor encapsulating material and a printed wiring board which are obtained using the active ester composition.
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