公开(公告)号：US4670084A

公开(公告)日：1987-06-02

申请号：US743287

申请日：1985-06-11

Applicant: David Durand

Inventor： David Durand

IPC: B41F17/00 ,  B32B31/00 ,  B02C11/08 ,  B30B5/02 ,  B44C1/16

CPC classification number: B41F17/006 ,  Y10T156/1705

Abstract: An apparatus for applying preselected dye images to members incident to processes of the type utilizing sheets bearing dyes in the mirror images of the preselected images, wherein the sheets are overlayed on the members and maintained in pressurized engagement therewith while the sheets and the members are heated. The apparatus comprises a bed for receiving a member thereon with a dye bearing sheet on the member and a resiliently flexible membrane which is positionable over the sheet on the member. A vacuum assembly of the apparatus is operable to evacuate the area between the membrane and the bed in order to draw the membrane into pressurized engagement with the sheet on the member. Radiant heating elements of the apparatus are operable to heat the membrane after the vacuum assembly has been actuated, whereby the dye on the sheet is applied to the member to produce the preselected image thereon.

Abstract translation: 一种将预先选定的染料图像应用于使用预先选择的图像的镜像中带有染料的片材进行加工的构件，其中片材被覆盖在构件上并与片材和构件被加热时保持与其加压接合 。 该装置包括用于在其上接收其上具有染料承载片的构件的床和可位于构件上的片上的弹性柔性膜。 该装置的真空组件可操作以抽出膜和床之间的区域，以便使膜与构件上的片材加压接合。 设备的辐射加热元件可操作以在真空组件被致动之后加热膜，由此片上的染料被施加到构件上以在其上产生预选图像。

公开(公告)号：US4656314A

公开(公告)日：1987-04-07

申请号：US789713

申请日：1985-10-21

Applicant: David Durand

Inventor： David Durand

IPC: H05K3/00 ,  H05K3/14 ,  H05K3/38

CPC classification number: H05K3/386 ,  H05K3/146 ,  H05K2201/0108 ,  H05K2201/0166 ,  H05K2203/0522 ,  H05K2203/1572 ,  H05K3/0082 ,  H05K3/143

Abstract: An ultraviolet reactive ink is applied to a translucent substrate in the desired circuit image and partially cured to a tacky state with ultraviolet radiation. A resist material is then applied to the substrate in the negative circuit image and metallic particles are deposited on the ink by vacuum deposition. The ink is then further cured to a hardened state with ultraviolet radiation applied from both above and beneath the substrate to counteract the tendency of the metal to reflect radiation applied only from above the substrate. Finally, the resist material is removed from the substrate leaving the fully formed circuit board comprising the substrate, the fully cured ink circuit image bonded thereto, and a metallic conductive layer on the ink.

Abstract translation: 将紫外线反应性油墨施加到所需电路图像中的半透明基板上，并用紫外线辐射部分固化至发粘状态。 然后将抗蚀剂材料施加到负电路图像中的基板上，并通过真空沉积将金属颗粒沉积在墨上。 然后将墨水进一步固化至硬化状态，并从基材上方和下方施加紫外线辐射，以抵消金属反射仅从基材上方施加的辐射的趋势。 最后，将抗蚀剂材料从衬底上除去，留下完全形成的电路板，其中包括基片，完全固化的墨水回路图象与其上的金属导电层。

公开(公告)号：US4172418A

公开(公告)日：1979-10-30

申请号：US902099

申请日：1978-05-01

Applicant: David Durand

Inventor： David Durand

IPC: B41F16/00 ,  B41M1/42 ,  B41M5/025 ,  B41M1/20 ,  B41F1/06 ,  B41M5/26 ,  B41N1/12

CPC classification number: B41M5/0256 ,  B41F16/00 ,  B41M1/42 ,  Y10S101/37

Abstract: A method and apparatus for effecting sublimation printing of a substrate wherein a matrix comprising the design to be printed is electrostatically charged in a given polarity and then a fine disperse dye powder, oppositely charged, is brought into contact with said matrix wherein the charged matrix attracts the oppositely charged dye particles to effect coating of the matrix with the dye, after which the coated matrix is moved into registry with the substrate to be printed, and specifically in overlying relation with respect to a surface of the substrate that has been coated with a dye receptive coating, after which the matrix is brought into pressurized contact with the coated surface of the substrate to cause sublimation of the dye pattern into said coated substrate surface.

Abstract translation: 一种用于进行基板的升华印刷的方法和装置，其中将包含要印刷的设计的基体以给定的极性静电充电，然后使相反带电的细分散染料粉末与所述基质接触，其中带电矩阵吸引 带有相反电荷的染料颗粒以用染料涂覆基体，之后将涂覆的基质移动到待印刷的基底对准，并且具体地涉及相对于已涂覆有基底的基底的表面的重叠关系 染料接受涂层，然后将基质与基底的涂覆表面加压接触，以使染料图案升华到所述涂覆的基底表面。

公开(公告)号：US20090222074A1

公开(公告)日：2009-09-03

申请号：US12467978

申请日：2009-05-18

Applicant: Paul E. Zarembo ,  Mohan Krishnan ,  David Durand

Inventor： Paul E. Zarembo ,  Mohan Krishnan ,  David Durand

IPC: A61N1/05 ,  H01R43/00

CPC classification number: A61N1/056 ,  H01R13/18 ,  H01R2201/12 ,  Y10T29/49117

Abstract: An implantable lead comprises a lead body extending from a lead proximal end portion to a lead distal end portion. The lead body includes one or more longitudinally extending lumens. A conductor is received in, and extends along, a lumen. In varying examples, the implantable lead further comprises a tubular electrode co-axial with, and overlying portions of, the lead body. In one example, a lumen wall is sized and shaped to urge an electrically conductive interposer coupled with the conductor toward an inner surface of the electrode. In another example, a ring member is disposed within a lumen and the conductor is drawn and coupled thereto. In yet another example, an electrically conductive connector couples a first and a second conductor via grooves or threads. In a further example, an axial support member couples a distal end electrode and the lead body. Methods associated with the foregoing are also discussed.

Abstract translation: 可植入引线包括从引线近端部分延伸到引线远端部分的引线体。 引线体包括一个或多个纵向延伸的腔。 导体被容纳在内腔中并沿着其延伸。 在可变示例中，可植入引线还包括与引线主体同轴并且覆盖引线主体的部分的管状电极。 在一个示例中，腔壁的尺寸和形状被设计成将与导体耦合的导电插入件推向电极的内表面。 在另一示例中，环构件设置在管腔内并且导体被拉伸并与其连接。 在又一示例中，导电连接器通过凹槽或螺纹将第一和第二导体连接。 在另一示例中，轴向支撑构件将远端电极和引线体联接。 还讨论了与前述相关的方法。

公开(公告)号：US07546165B2

公开(公告)日：2009-06-09

申请号：US11305925

申请日：2005-12-19

Applicant: Paul E. Zarembo ,  Mohan Krishnan ,  David Durand

Inventor： Paul E. Zarembo ,  Mohan Krishnan ,  David Durand

IPC: A61N1/05

CPC classification number: A61N1/056 ,  H01R13/18 ,  H01R2201/12 ,  Y10T29/49117

Abstract: An implantable lead comprises a lead body extending from a lead proximal end portion to a lead distal end portion. The lead body includes one or more longitudinally extending lumens. A conductor is received in, and extends along, a lumen. In varying examples, the implantable lead further comprises a tubular electrode co-axial with, and overlying portions of, the lead body. In one example, a lumen wall is sized and shaped to urge an electrically conductive interposer coupled with the conductor toward an inner surface of the electrode. In another example, a ring member is disposed within a lumen and the conductor is drawn and coupled thereto. In yet another example, an electrically conductive connector couples a first and a second conductor via grooves or threads. In a further example, an axial support member couples a distal end electrode and the lead body. Methods associated with the foregoing are also discussed.

Abstract translation: 可植入引线包括从引线近端部分延伸到引线远端部分的引线体。 引线体包括一个或多个纵向延伸的腔。 导体被容纳在内腔中并沿着其延伸。 在可变示例中，可植入引线还包括与引线主体同轴并且覆盖引线主体的部分的管状电极。 在一个示例中，腔壁的尺寸和形状被设计成将与导体耦合的导电插入件推向电极的内表面。 在另一示例中，环构件设置在管腔内并且导体被拉伸并与其连接。 在又一示例中，导电连接器通过凹槽或螺纹将第一和第二导体连接。 在另一示例中，轴向支撑构件将远端电极和引线体联接。 还讨论了与前述相关的方法。

公开(公告)号：US20070142890A1

公开(公告)日：2007-06-21

申请号：US11305925

申请日：2005-12-19

Applicant: Paul Zarembo ,  Mohan Krishnan ,  David Durand

Inventor： Paul Zarembo ,  Mohan Krishnan ,  David Durand

IPC: A61N1/00

CPC classification number: A61N1/056 ,  H01R13/18 ,  H01R2201/12 ,  Y10T29/49117

Abstract: An implantable lead comprises a lead body extending from a lead proximal end portion to a lead distal end portion. The lead body includes one or more longitudinally extending lumens. A conductor is received in, and extends along, a lumen. In varying examples, the implantable lead further comprises a tubular electrode co-axial with, and overlying portions of, the lead body. In one example, a lumen wall is sized and shaped to urge an electrically conductive interposer coupled with the conductor toward an inner surface of the electrode. In another example, a ring member is disposed within a lumen and the conductor is drawn and coupled thereto. In yet another example, an electrically conductive connector couples a first and a second conductor via grooves or threads. In a further example, an axial support member couples a distal end electrode and the lead body. Methods associated with the foregoing are also discussed.

Abstract translation: 可植入引线包括从引线近端部分延伸到引线远端部分的引线体。 引线体包括一个或多个纵向延伸的腔。 导体被容纳在内腔中并沿着其延伸。 在可变示例中，可植入引线还包括与引线主体同轴并且覆盖引线主体的部分的管状电极。 在一个示例中，腔壁的尺寸和形状被设计成将与导体耦合的导电插入件推向电极的内表面。 在另一示例中，环构件设置在管腔内并且导体被拉伸并与其连接。 在又一示例中，导电连接器通过凹槽或螺纹将第一和第二导体连接。 在另一示例中，轴向支撑构件将远端电极和引线体联接。 还讨论了与前述相关的方法。

公开(公告)号：US5061551A

公开(公告)日：1991-10-29

申请号：US472194

申请日：1990-01-30

Applicant: David Durand

Inventor： David Durand

IPC: C09D11/00 ,  C09D11/10 ,  H01B1/22 ,  H01F41/16 ,  H05K1/09 ,  H05K3/10 ,  H05K3/12 ,  H05K3/24

CPC classification number: H05K3/1283 ,  C09D11/101 ,  C09D11/52 ,  H01B1/22 ,  H01F41/16 ,  H05K1/095 ,  H05K3/10 ,  H05K3/245 ,  H05K2201/083 ,  H05K2203/104 ,  Y10S428/907 ,  Y10T428/24917 ,  Y10T428/25 ,  Y10T428/254 ,  Y10T428/2991

Abstract: A method for producing a circuit board involves printing a U.V. curable ink onto a substrate in a desired circuit pattern and curing the ink by exposing it to a pulsed U.V. source or subjecting the circuit pattern prepared from a U.V. curable ink containing magnetite particles to a magnetic field to move the magnetite particles to the upper surface of the U.V. curable ink. Other embodiments include circuit boards made in accordance with these methods and the use of the U.V. curable ink as a shielding composition for enclosures housing electronic equipment.

公开(公告)号：US5006397A

公开(公告)日：1991-04-09

申请号：US472310

申请日：1990-01-30

Applicant: David Durand

Inventor： David Durand

IPC: C09D11/00 ,  C09D11/10 ,  H01B1/22 ,  H01F41/16 ,  H05K1/09 ,  H05K3/10 ,  H05K3/12 ,  H05K3/24

CPC classification number: H05K3/1283 ,  C09D11/101 ,  C09D11/52 ,  H01B1/22 ,  H01F41/16 ,  H05K1/095 ,  H05K3/10 ,  H05K3/245 ,  H05K2201/083 ,  H05K2203/104 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T428/25 ,  Y10T428/252 ,  Y10T428/259 ,  Y10T428/29 ,  Y10T428/2973 ,  Y10T428/2982 ,  Y10T428/2991

Abstract: A method for producing a circuit board involves printing a U.V. curable ink onto a substrate in a desired cirucit pattern and curing the ink by exposing it to a pulsed U.V. source or subjecting the circuit pattern prepared from a U.V. curable ink containing magnetite particles to a magnetic field to move the magnetite particles to the upper surface of the U.V. curable ink. Other embodiments include circuit boards made in accordance with these methods and the use of the U.V. curable ink as a shielding composition for enclosures housing electronic equipment.

Abstract translation: 制造电路板的方法包括： 可固化油墨以所需的凝胶图案在基材上固化，并通过将其暴露于脉冲的紫外线 来源或经受由U.V.制备的电路图案。 含有磁铁矿颗粒的可固化油墨到磁场以将磁铁矿颗粒移动到紫外线的上表面。 可固化油墨。 其他实施例包括根据这些方法制造的电路板和使用U.V. 作为容纳电子设备的外壳的屏蔽组合物的可固化油墨。

公开(公告)号：US4587155A

公开(公告)日：1986-05-06

申请号：US712117

申请日：1985-03-15

Applicant: David Durand

Inventor： David Durand

IPC: B41F16/00 ,  B41M1/30 ,  B41M5/035 ,  H01H9/18 ,  B32B5/16 ,  B32B27/36 ,  D06P1/16

CPC classification number: H01H9/18 ,  B41F16/00 ,  B41M5/0358 ,  Y10T428/24802 ,  Y10T428/24901

Abstract: A method of applying a dye image to a plastic member and the image bearing member thereby formed. A disperse dye having a melting point which is below the thermal deflection temperature of the plastic of the member and a vaporization point which is above said deflection temperature is applied to a surface of the member in a desired image. The dye bearing plastic is then heated to a temperature which is above the melting point of the dye and below the thermal deflection temperature of the plastic, but which is nevertheless high enough to cause some softening of said plastic. The dye is then permitted to diffuse into the plastic to provide a sharp, clear and durable image thereon.

Abstract translation: 将染料图像施加到由此形成的塑料构件和图像承载构件的方法。 熔点低于构件的塑料的热变形温度和高于所述挠曲温度的蒸发点的分散染料以期望的图像施加到构件的表面。 然后将染料轴承塑料加热至高于染料熔点并低于塑料的热变形温度的温度，但仍然高到足以引起所述塑料的一些软化。 然后允许染料扩散到塑料中，以在其上提供清晰，透明和持久的图像。

公开(公告)号：US4174250A

公开(公告)日：1979-11-13

申请号：US895229

申请日：1978-04-10

Applicant: David Durand

Inventor： David Durand

IPC: B28B11/00 ,  B41F16/00 ,  B30B15/34 ,  B30B5/02

CPC classification number: B41F16/00 ,  B28B11/001

Abstract: An apparatus and method for imprinting articles such as tiles by the sublimation transfer of dyes into a dye receptive surface coating provided thereon. A platen having a press member formed of liquid metal and a flexible confining membrane is utilized to heat and press a sheet having the dye imprinted design thereon so as to sublimate such designs into the adjacent coated surface of the articles. The press member is accordingly both capable of transmitting heat and pressure to the surface coating of such articles so as to simultaneously transfer said design and the texture of the membrane, sheet or separate texturing member disposed therebetween to the surface of the article.

Abstract translation: 用于通过将染料升华转印到其上提供的染料接收表面涂层中来将诸如瓷砖的物品印刷的设备和方法。 具有由液态金属形成的压制构件和柔性约束膜的压板用于在其上加热和压制其上具有染料印刷设计的片材，以将这种设计升华成制品的相邻涂层表面。 因此，压制构件能够将热和压力传递到这些制品的表面涂层，以便同时将设置在其间的膜，片或单独的纹理构造的设计和结构转移到制品的表面。