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公开(公告)号:US20210172788A1
公开(公告)日:2021-06-10
申请号:US17180308
申请日:2021-02-19
Applicant: eXo Imaging, Inc.
Inventor: Sandeep AKKARAJU , Haesung KWON , Brian BIRCUMSHAW
Abstract: A micromachined ultrasonic transducer (MUT). The MUT includes: a substrate; a membrane suspending from the substrate; a bottom electrode disposed on the membrane; a piezoelectric layer disposed on the bottom electrode and an asymmetric top electrode is disposed on the piezoelectric layer. The areal density distribution of the asymmetric electrode along an axis has a plurality of local maxima, wherein locations of the plurality of local maxima coincide with locations where a plurality of anti-nodal points at a vibrational resonance frequency is located.
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12.
公开(公告)号:US20210078042A1
公开(公告)日:2021-03-18
申请号:US17018304
申请日:2020-09-11
Applicant: eXo Imaging, Inc.
Inventor: Brian BIRCUMSHAW , Sandeep AKKARAJU , Haesung KWON
IPC: B06B1/06 , H01L41/083 , H01L41/047
Abstract: Methods for improving the electromechanical coupling coefficient and bandwidth of micromachined ultrasonic transducers, or MUTs, are presented as well as methods of manufacture of the MUTs improved by the presented methods.
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公开(公告)号:US20210069748A1
公开(公告)日:2021-03-11
申请号:US17099545
申请日:2020-11-16
Applicant: eXo Imaging, Inc.
Inventor: Brian BIRCUMSHAW , Sandeep AKKARAJU , Haesung KWON
Abstract: Disclosed herein are ultrasonic transducer systems comprising: an ultrasonic transducer comprising a substrate, a diaphragm, and a piezoelectric element; a first electrical circuitry coupled to the ultrasonic transducer, the first electrical circuitry configured for driving the ultrasonic transducer or detecting motion of the diaphragm; a plurality of electrical ports coupled to the ultrasonic transducer; and a second electrical circuitry connected to two or more of the plurality of electrical ports, the electrical circuitry comprising one or more of: a resistor, a capacitor, a switch, and an amplifier, wherein the second electrical circuitry is independent from the first electrical circuitry, and wherein the second electrical circuitry is configured to dampen the motion of the diaphragm.
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公开(公告)号:US20210041558A1
公开(公告)日:2021-02-11
申请号:US16978139
申请日:2019-03-01
Applicant: eXo Imaging, Inc.
Inventor: Sandeep AKKARAJU
Abstract: Disclosed herein are portable ultrasound imaging systems for thumb-dominant operations comprising: a portable ultrasound probe, wherein the portable ultrasound probe is configured to be operable using a first hand of the user; a mobile device comprising a mobile application installed thereon, the mobile application comprising a user interface, the mobile application configured to be operable using a second hand of the user and; and direct electronic communication between the portable ultrasound probe and the mobile device, the direct electronic communication configured to allow a user to control an operation of the portable ultrasound probe for imaging via user interaction with the user interface.
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公开(公告)号:US20250121408A1
公开(公告)日:2025-04-17
申请号:US19000609
申请日:2024-12-23
Applicant: Exo Imaging, Inc.
Inventor: Brian BIRCUMSHAW , Sandeep AKKARAJU
IPC: B06B1/06 , G01S7/52 , G01S15/89 , H10N30/073 , H10N30/088 , H10N30/80 , H10N30/853 , H10N30/87
Abstract: The present disclosure provides methods to integrate piezoelectric micromachined ultrasonic transducer (pMUT) arrays with an application-specific integrated circuit (ASIC) using thermocompression or eutectic/solder bonding. In an aspect, the present disclosure provides a device comprising a first substrate and a second substrate, the first substrate comprising a pMUT array and the second substrate comprising an electrical circuit, wherein the first substrate and the second substrate are bonded together using thermocompression, wherein any set of individual PMUTs of PMUT array is addressable. In another aspect, the present disclosure provides a device comprising a first substrate and a second substrate, the first substrate comprising a pMUT array and the second substrate comprising an electrical circuit, wherein the first substrate and the second substrate are bonded together using eutectic or solder bonding, wherein any set of individual PMUTs of the PMUT array is addressable.
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16.
公开(公告)号:US20250044446A1
公开(公告)日:2025-02-06
申请号:US18799921
申请日:2024-08-09
Applicant: Exo Imaging, Inc.
Inventor: Miles WERNICK , Sandeep AKKARAJU , Drake GUENTHER , Kutay ÜSTÜNER , Yusuf HAQUE
Abstract: Computer-implemented medical ultrasound imaging methods and systems for performing the methods can be performed using a plurality of frames of an ultrasound image sequence that each having a high image quality to improve the image quality of lower-image-quality frame of the ultrasound image sequence.
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公开(公告)号:US20240427014A1
公开(公告)日:2024-12-26
申请号:US18751986
申请日:2024-06-24
Applicant: Exo Imaging, Inc.
Inventor: Yusuf HAQUE , Sandeep AKKARAJU , Janusz BRYZEK , Brian BIRCUMSHAW
IPC: G01S15/89 , A61B8/00 , A61B8/08 , B06B1/06 , B81B3/00 , G01N29/02 , G01N29/04 , G01N29/06 , G01N29/24 , G01N29/26 , G01N29/34 , G01S7/52 , G10K11/34 , H10N30/20
Abstract: An imaging device can include a transducer that includes an array of piezoelectric elements formed on a substrate. Each piezoelectric element can include at least one membrane suspended from the substrate, at least one bottom electrode disposed on the membrane, at least one piezoelectric layer disposed on the bottom electrode, and at least one top electrode disposed on the at least one piezoelectric layer. Adjacent piezoelectric elements can be configured to be isolated acoustically from each other. The device is utilized to measure flow or flow along with imaging anatomy.
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公开(公告)号:US20240075500A1
公开(公告)日:2024-03-07
申请号:US17929521
申请日:2022-09-02
Applicant: Exo Imaging, Inc.
Inventor: Haesung KWON , Brian BIRCUMSHAW , Sandeep AKKARAJU
CPC classification number: B06B1/0666 , A61B8/4488 , G01S15/8915
Abstract: Provided herein are micromachined ultrasonic transducers as well as imaging devices and assemblies comprising micromachined ultrasonic transducers (MUTs). The MUTs described herein have a plurality of membranes so as to improve acoustic power at higher frequencies.
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公开(公告)号:US20220233168A1
公开(公告)日:2022-07-28
申请号:US17156058
申请日:2021-01-22
Applicant: eXo Imaging, Inc.
Inventor: Yusuf HAQUE , Sandeep AKKARAJU , Janusz BRYZEK , Andalib CHOWDHURY
Abstract: Disclosed herein are ultrasonic transducer systems comprising: an ultrasonic imager comprising a plurality of pMUT transducer elements; and one or more circuitries connected electronically to the plurality of transducer element, the one or more circuitries configured to enable: pulse transmission and reception of reflected signal for the ultrasonic transducer, where inductors are used to equalize impedance to obtain greater pressure output. Also disclosed are methods of altering a pressure of an ultrasonic wave emitted by an ultrasonic transducer.
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公开(公告)号:US20210086231A1
公开(公告)日:2021-03-25
申请号:US17095333
申请日:2020-11-11
Applicant: eXo Imaging, Inc.
Inventor: Brian BIRCUMSHAW , Sandeep AKKARAJU
IPC: B06B1/06 , H01L41/04 , H01L41/047 , H01L41/187 , H01L41/313 , H01L41/338 , G01S15/89 , G01S7/52
Abstract: The present disclosure provides methods to integrate piezoelectric micromachined ultrasonic transducer (pMUT) arrays with an application-specific integrated circuit (ASIC) using thermocompression or eutectic/solder bonding. In an aspect, the present disclosure provides a device comprising a first substrate and a second substrate, the first substrate comprising a pMUT array and the second substrate comprising an electrical circuit, wherein the first substrate and the second substrate are bonded together using thermocompression, wherein any set of individual PMUTs of PMUT array is addressable. In another aspect, the present disclosure provides a device comprising a first substrate and a second substrate, the first substrate comprising a pMUT array and the second substrate comprising an electrical circuit, wherein the first substrate and the second substrate are bonded together using eutectic or solder bonding, wherein any set of individual PMUTs of the PMUT array is addressable.
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