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公开(公告)号:US10215389B2
公开(公告)日:2019-02-26
申请号:US15859409
申请日:2017-12-30
Applicant: Fluence Bioengineering
Inventor: Dung Duong , Randy Johnson , Nick Klase
IPC: H05B33/08 , H05B37/02 , F21V23/00 , H05K1/05 , H05K1/18 , H05K1/02 , H05K3/32 , F21K9/90 , F21V29/74 , F21Y115/10
Abstract: Examples of the present disclosure are related to systems and methods for lighting fixtures. More particularly, embodiments disclose directly embedded a smart module with a lighting fixture utilizing metal core PCB (MCPCB).
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公开(公告)号:US10208940B2
公开(公告)日:2019-02-19
申请号:US15678880
申请日:2017-08-16
Applicant: Fluence Bioengineering
Inventor: Dung Duong , Randall Johnson , Nicholas Klase
IPC: F21V29/00 , F21V29/502 , H05K7/20 , H05K1/02 , F28F3/02 , H01L23/367
Abstract: Embodiments may utilize a series of exposed fins, which increase the surface area of the heat sink creating additional air flow. As hotter air rises within the system, cooler is drawn into the heatsink. The fins may be exposed on both sides of the longitudinal axis, allowing cooler air to be drawn towards the longitudinal axis above the heatsink and flow upward. This process may cool the fins. Additionally, the spacing between the fins may have to be wide enough to allow for air to freely enter the heatsink.
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公开(公告)号:US20180356048A1
公开(公告)日:2018-12-13
申请号:US15697149
申请日:2017-09-06
Applicant: Fluence Bioengineering
Inventor: Dung Duong , Randy Johnson , Nick Klase
CPC classification number: F21V23/005 , A01G7/045 , F21K9/232 , F21K9/90 , F21S4/28 , F21V7/005 , F21V7/0066 , F21V7/05 , F21V15/015 , F21V17/107 , F21V19/0015 , F21V19/003 , F21V23/001 , F21V23/02 , F21V23/0442 , F21V29/70 , F21V29/74 , F21V29/83 , F21Y2103/10 , F21Y2105/16 , F21Y2115/10 , H05B33/0854 , H05B37/0227 , H05B37/0272 , H05K1/0203 , H05K1/0209 , H05K1/0274 , H05K1/0277 , H05K1/05 , H05K1/056 , H05K1/181 , H05K1/182 , H05K1/185 , H05K3/0014 , H05K3/28 , H05K3/32 , H05K3/44 , H05K2201/066 , H05K2201/09009 , H05K2201/10106
Abstract: Examples of the present disclosure are related to systems and methods for lighting fixtures. More particularly, embodiments disclose lighting fixtures utilizing metal core PCB (MCPCB) for thermal, mechanical, and/or optical controls.
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公开(公告)号:US20180324980A1
公开(公告)日:2018-11-08
申请号:US15651941
申请日:2017-07-17
Applicant: Fluence Bioengineering
Inventor: Dung Duong , Randall Johnson , Nicholas Klase
IPC: H05K7/20
CPC classification number: F21V29/745 , F21V19/0055 , F21V23/009 , F21V29/502 , F21V29/67 , F21V29/75 , F21Y2115/10 , F28F3/02 , H01L23/367 , H05K1/021 , H05K7/20409
Abstract: Embodiments may utilize a series of exposed fins, which increase the surface area of the heat sink creating additional air flow. As hotter air rises within the system, cooler is drawn into the heatsink. The fins may be exposed on both sides of the longitudinal axis, allowing cooler air to be drawn towards the longitudinal axis above the heatsink and flow upward. This process may cool the fins. Additionally, the spacing between the fins may have to be wide enough to allow for air to freely enter the heatsink.
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公开(公告)号:US20180320878A1
公开(公告)日:2018-11-08
申请号:US15636923
申请日:2017-06-29
Applicant: Fluence Bioengineering
Inventor: Dung Duong , Randall Johnson , Nicholas Klase
CPC classification number: F21V29/745 , F21V19/0055 , F21V23/009 , F21V29/502 , F21V29/67 , F21V29/75 , F21Y2115/10 , F28F3/02 , H01L23/367 , H05K1/021 , H05K7/20409
Abstract: Embodiments may utilize a series of exposed fins, which increase the surface area of the heat sink creating additional air flow. As hotter air rises within the system, cooler is drawn into the heatsink. The fins may be exposed on both sides of the longitudinal axis, allowing cooler air to be drawn towards the longitudinal axis above the heatsink and flow upward. This process may cool the fins. Additionally, the spacing between the fins may have to be wide enough to allow for air to freely enter the heatsink.
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公开(公告)号:US20180320876A1
公开(公告)日:2018-11-08
申请号:US15678880
申请日:2017-08-16
Applicant: Fluence Bioengineering
Inventor: Dung Duong , Randall Johnson , Nicholas Klase
IPC: F21V29/502 , H05K7/20 , H05K1/02 , F28F3/02 , H01L23/367
CPC classification number: F21V29/745 , A01G9/20 , F21V19/0055 , F21V23/009 , F21V29/502 , F21V29/67 , F21V29/75 , F21V29/76 , F21V29/83 , F21Y2115/10 , F28F3/02 , F28F3/025 , H01L23/367 , H05K1/021 , H05K7/20409
Abstract: Embodiments may utilize a series of exposed fins, which increase the surface area of the heat sink creating additional air flow. As hotter air rises within the system, cooler is drawn into the heatsink. The fins may be exposed on both sides of the longitudinal axis, allowing cooler air to be drawn towards the longitudinal axis above the heatsink and flow upward. This process may cool the fins. Additionally, the spacing between the fins may have to be wide enough to allow for air to freely enter the heatsink.
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公开(公告)号:US11774082B2
公开(公告)日:2023-10-03
申请号:US17734105
申请日:2022-05-01
Applicant: FLUENCE BIOENGINEERING, INC.
Inventor: Dung Duong , Randall Johnson , Nicholas Klase
IPC: F21V29/00 , F21V21/20 , F21V29/502 , F21V29/74 , F21V29/76 , A01G9/24 , F21V29/75 , F21V23/00 , H05K7/20 , F28F3/02 , H01L23/367 , H05K1/02 , F21V29/83 , A01G9/20 , H05K1/05 , H05K3/00 , F28D21/00 , F21W131/40 , F21Y103/10 , F21V29/67 , F21Y115/10 , F21V19/00
CPC classification number: F21V29/502 , A01G9/20 , A01G9/249 , F21V23/009 , F21V29/745 , F21V29/75 , F21V29/76 , F21V29/763 , F21V29/83 , F28F3/02 , H01L23/367 , H05K1/021 , H05K7/20409 , F21V19/0055 , F21V29/67 , F21W2131/40 , F21Y2103/10 , F21Y2115/10 , F28D2021/0029 , F28F3/025 , H05K1/05 , H05K3/0061
Abstract: Embodiments may utilize a series of exposed fins, which increase the surface area of the heat sink creating additional air flow. As hotter air rises within the system, cooler is drawn into the heatsink. The fins may be exposed on both sides of the longitudinal axis, allowing cooler air to be drawn towards the longitudinal axis above the heatsink and flow upward. This process may cool the fins. Additionally, the spacing between the fins may have to be wide enough to allow for air to freely enter the heatsink.
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公开(公告)号:US11333341B2
公开(公告)日:2022-05-17
申请号:US17096165
申请日:2020-11-12
Applicant: Fluence Bioengineering, Inc.
Inventor: Dung Duong , Randall Johnson , Nicholas Klase
IPC: F21V29/00 , F21V21/20 , F21V29/502 , F21V29/76 , A01G9/24 , F21V29/74 , F21V29/75 , F21V23/00 , H05K7/20 , F28F3/02 , H01L23/367 , H05K1/02 , F21V29/83 , A01G9/20 , H05K1/05 , H05K3/00 , F28D21/00 , F21W131/40 , F21Y103/10 , F21V29/67 , F21Y115/10 , F21V19/00
Abstract: Embodiments may utilize a series of exposed fins, which increase the surface area of the heat sink creating additional air flow. As hotter air rises within the system, cooler is drawn into the heatsink. The fins may be exposed on both sides of the longitudinal axis, allowing cooler air to be drawn towards the longitudinal axis above the heatsink and flow upward. This process may cool the fins. Additionally, the spacing between the fins may have to be wide enough to allow for air to freely enter the heatsink.
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公开(公告)号:US10816180B2
公开(公告)日:2020-10-27
申请号:US16542442
申请日:2019-08-16
Applicant: Fluence Bioengineering, Inc.
Inventor: Dung Duong , Randy Johnson , Nick Klase
IPC: F21V23/00 , H05K1/05 , H05K1/18 , H05K1/02 , H05K3/32 , F21K9/90 , F21V29/74 , F21V23/04 , F21V29/70 , F21V29/83 , F21K9/232 , A01G7/04 , F21V7/00 , F21V7/05 , H05K3/00 , H05K3/28 , H05K3/44 , F21S4/28 , F21V15/015 , F21V17/10 , F21V19/00 , F21V23/02 , F21Y115/10 , H05B45/10 , H05B47/19 , H05B47/105 , F21Y105/16 , F21Y103/10
Abstract: Examples of the present disclosure are related to systems and methods for lighting fixtures. More particularly, embodiments disclose lighting fixtures utilizing metal core PCB (MCPCB) for thermal, mechanical, and/or optical controls.
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公开(公告)号:US20200217490A1
公开(公告)日:2020-07-09
申请号:US16742991
申请日:2020-01-15
Applicant: Fluence Bioengineering, Inc.
Inventor: Dung Duong , Randy Johnson , Nick Klase
IPC: F21V23/00 , H05K1/05 , H05K1/18 , H05K1/02 , H05K3/32 , F21K9/90 , F21V29/74 , F21V23/04 , F21V29/70 , F21V29/83 , F21K9/232 , A01G7/04 , F21V7/00 , F21V7/05 , H05K3/00 , H05K3/28 , H05K3/44 , F21S4/28 , F21V15/015 , F21V17/10 , F21V19/00 , F21V23/02
Abstract: Examples of the present disclosure are related to systems and methods for lighting fixtures. More particularly, embodiments disclose lighting fixtures utilizing metal core PCB (MCPCB) for optical controls.
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