公开(公告)号：US20180319081A1

公开(公告)日：2018-11-08

申请号：US15970283

申请日：2018-05-03

Applicant: Formlabs Inc.

Inventor： Eduardo Torrealba ,  Luke Plummer ,  Brian Chan ,  Maxim Lobovsky ,  Shane Wighton ,  Ian Ferguson

IPC: B29C64/259 ,  B29C64/153 ,  B29C64/393 ,  B33Y30/00

CPC classification number: B29C64/259 ,  B29C64/153 ,  B29C64/218 ,  B29C64/393 ,  B33Y30/00

Abstract: Techniques for producing removable build modules for additive fabrication devices are described. According to some aspects, a removable build module may comprise an enclosure having an open top, a fabrication platform arranged in an interior of the enclosure, and at least one actuator incorporated into the enclosure and configured to move the fabrication platform towards and away from the open top of the enclosure.