公开(公告)号：US20230191455A1

公开(公告)日：2023-06-22

申请号：US18170349

申请日：2023-02-16

Applicant: GE Precision Healthcare LLC

Inventor： Edouard Dacruz ,  Flavien Daloz ,  Jason Barrett

IPC: B06B1/02 ,  A61B8/00 ,  B06B1/06 ,  H10N30/03

CPC classification number: B06B1/0269 ,  A61B8/4494 ,  B06B1/0607 ,  B06B1/0614 ,  H10N30/03 ,  A61B8/4488 ,  B06B2201/76 ,  H10N30/20

Abstract: An example of a method for a multi-frequency transducer array can include forming a first comb structure with a first sub-element having a first resonance frequency, forming a second comb structure, complementary in geometry to the first comb structure with a second sub-element having a second resonance frequency, combining the first and second comb structures to form an interdigitated structure, forming a third acoustic stack by coupling the interdigitated structure to a base package, and coupling the third acoustic stack to a matching layer block and a backing layer block to form a plurality of multi-frequency transducers.

公开(公告)号：US20230028329A1

公开(公告)日：2023-01-26

申请号：US17938567

申请日：2022-10-06

Applicant: GE Precision Healthcare LLC

Inventor： Edouard Dacruz ,  Flavien Daloz ,  Jason Barrett

IPC: H01L41/083 ,  A61B8/00 ,  H01L27/20 ,  H01L41/338

Abstract: Various methods and systems are provided for a multi-frequency transducer array. In one example, the transducer array may be fabricated via a wafer scale approach, where a first comb structure, with a first type of element, is formed by dicing a first acoustic stack and a second comb structure, with a second type of element, is formed by dicing a second acoustic stack. Combining the first and second comb structures may form a multi-frequency transducer array.

公开(公告)号：US11495730B2

公开(公告)日：2022-11-08

申请号：US16701048

申请日：2019-12-02

Applicant: GE Precision Healthcare LLC

Inventor： Edouard Dacruz ,  Flavien Daloz ,  Jason Barrett

IPC: H01L41/083 ,  H01L41/338 ,  A61B8/00 ,  H01L27/20

Abstract: Various methods and systems are provided for a multi-frequency transducer array. In one example, the transducer array may be fabricated via a wafer scale approach, where a first comb structure, with a first type of element, is formed by dicing a first acoustic stack and a second comb structure, with a second type of element, is formed by dicing a second acoustic stack. Combining the first and second comb structures may form a multi-frequency transducer array.

公开(公告)号：US20210167273A1

公开(公告)日：2021-06-03

申请号：US16701048

申请日：2019-12-02

Applicant: GE Precision Healthcare LLC

Inventor： Edouard Dacruz ,  Flavien Daloz ,  Jason Barrett

IPC: H01L41/083 ,  H01L41/338 ,  H01L27/20 ,  A61B8/00

Abstract: Various methods and systems are provided for a multi-frequency transducer array. In one example, the transducer array may be fabricated via a wafer scale approach, where a first comb structure, with a first type of element, is formed by dicing a first acoustic stack and a second comb structure, with a second type of element, is formed by dicing a second acoustic stack. Combining the first and second comb structures may form a multi-frequency transducer array.