公开(公告)号：US11158612B2

公开(公告)日：2021-10-26

申请号：US16830859

申请日：2020-03-26

Applicant: GIO Optoelectronics Corp

Inventor： Chin-Tang Li

IPC: H01L25/075 ,  H01L27/12 ,  H01L33/62

Abstract: An electronic device comprises at least one sub matrix unit, a driving circuit board, and at least one surface mount device. The sub matrix unit comprises a substrate, thin-film circuits and first connecting pads. The thin-film circuits and the first connecting pads are disposed on the operation face of the substrate. The sub matrix unit defines a loading face and comprises second connecting pads, at least one first conductive line, and at least one second conductive line all together arranged on the loading face. A second height defined between a top of the surface mount device and the loading face of the driving circuit board is no less than a first height defined between an uppermost face of the sub matrix unit and the loading face of the driving circuit board.

公开(公告)号：US10797034B2

公开(公告)日：2020-10-06

申请号：US16220610

申请日：2018-12-14

Applicant: GIO Optoelectronics Corp

Inventor： Chin-Tang Li

IPC: H01L25/18 ,  H01L23/31 ,  H01L25/00 ,  H01L27/12 ,  H01L33/52 ,  H01L33/62 ,  H01L21/48 ,  H01L33/00 ,  H01L25/16 ,  H01L23/00

Abstract: An electronic package unit, a manufacturing method thereof and an electronic device are disclosed. The manufacturing method includes: providing an insulation substrate, wherein the insulation substrate has a first surface and a second surface opposite to the first surface; forming a plurality of sub-matrix circuits on the insulation substrate, wherein each sub-matrix circuit comprises at least one thin film transistor; disposing at least one functional chip on the first surface, wherein the functional chip is electrically connected with the sub-matrix circuit; forming a plurality of through-holes on the insulation substrate and disposing a conductive material in the through-holes, so that the functional chip is electrically connected to the second surface through the sub-matrix circuits and the conductive material; forming a protection layer on the first surface to cover the functional chips; and cutting the insulation substrate and the protection layer to form a plurality of electronic package units.