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公开(公告)号：US20190001123A1
公开(公告)日：2019-01-03
申请号：US16121716
申请日：2018-09-05
Applicant: Greatbatch Ltd.
Inventor： Robert A. Stevenson , Christine A. Frysz , Thomas Marzano , Keith W. Seitz , Marc Gregory Martino
Abstract: A hermetically sealed filtered feedthrough assembly includes an electrically conductive ferrule sealed by a first gold braze to an insulator disposed at least partially within a ferrule opening. A conductive wire is disposed within a via hole disposed through the insulator extending from a body fluid side to a device side. A second gold braze hermetically seals the conductive leadwire to the via hole. A capacitor is disposed on the device side having a capacitor dielectric body with a dielectric constant k that is greater than 0 and less than 1000. The capacitor is the first filter capacitor electrically connected to the conductive leadwire coming from the body fluid side into the device side. An active electrical connection electrically connects the conductive leadwire to the capacitor active metallization. A ground electrical connection electrically connects the capacitor ground metallization to the ferrule and housing of the active implantable medical device.
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公开(公告)号：US20240390688A1
公开(公告)日：2024-11-28
申请号：US18796784
申请日：2024-08-07
Applicant: Greatbatch Ltd.
Inventor： Robert A. Stevenson , Christine A. Frysz , Keith W. Seitz , Brian P. Hohl , Marc Gregory Martino
Abstract: An AIMD includes a ceramic base closed with a ceramic lid, both cooperatively separating body fluid and device sides. The lid and circuit board both have active and conductive pathways. A circuit board has active and ground conductive pathways. An anisotropic conductive layer disposed between the lid device side and the circuit board has a first thickness where a first conductive particle is in electrical contact with the lid and the circuit board active conductive pathways electrically connected to the active terminal of an electronic component on the circuit board, a second thickness where a second conductive particle is in electrical contact with the lid and the circuit board ground conductive pathways electrically connected to the ground terminal of the electronic component. The anisotropic conductive layer has a third, greater thickness where no conductive particles are in electrical contact with the lid and circuit board conductive active and ground pathways.
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13.发明公开公开(公告)号：US20240322483A1
公开(公告)日：2024-09-26
申请号：US18736643
申请日：2024-06-07
Applicant: Greatbatch Ltd.
Inventor： Thomas Marzano , Keith W. Seitz , Robert A. Stevenson , Christine A. Frysz , Marc Gregory Martino
IPC: H01R13/52 , A61N1/375 , H01G4/35 , H01R13/426 , H01R13/719
CPC classification number: H01R13/5224 , A61N1/3754 , H01G4/35 , H01R13/426 , H01R13/521 , H01R13/719 , Y10T29/49204
Abstract: A feedthrough terminal pin connector assembly for an active implantable medical device (AIMD) includes first and second terminal pin connectors, each comprising a sidewall having an exterior surface spaced from an interior surface defining a connector opening extending along a longitudinal axis. At least a first portion of the sidewall is electrically conductive. An electrically conductive compliant structure is supported by the electrically conductive portion of the sidewall in each of the first and second connector openings. A common housing contains the first and second terminal pin connectors with an insulative material electrically isolating the first and second electrically conductive sidewall portions from each other. The common housing is configured to be supported on a circuit board having at least a first and a second electrical circuits with the first and second electrically conductive portions being electrically connected to the respective first and second electrical circuits.
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公开(公告)号：US11211741B2
公开(公告)日：2021-12-28
申请号：US16809676
申请日：2020-03-05
Applicant: Greatbatch Ltd.
Inventor： Thomas Marzano , Keith W. Seitz , Christine A. Frysz , Marc Gregory Martino , Robert A. Stevenson
IPC: H01R13/52 , H01R13/719 , H01R13/426 , H01G4/35 , A61N1/375
Abstract: A hermetic feedthrough terminal pin connector for an active implantable medical device (AIMD) includes an electrical insulator hermetically sealed to an opening of an electrically conductive ferrule. A feedthrough terminal pin is hermetically sealed to and disposed through the insulator, the feedthrough terminal pin extending outwardly beyond the insulator on the inside of the casing of the AIMD. A circuit board is disposed on the inside of the casing of the AIMD. A terminal pin connector includes: an electrically conductive connector housing disposed on the circuit board, wherein the connector housing is electrically connected to at least one electrical circuit disposed on the circuit board; and at least one electrically conductive prong supported by the connector housing, the at least one prong contacting and compressed against the feedthrough terminal pin, the at least one prong making a removable electrical connection.
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公开(公告)号：US11198014B2
公开(公告)日：2021-12-14
申请号：US16004569
申请日：2018-06-11
Applicant: Greatbatch Ltd.
Inventor： Robert A. Stevenson , Christine A. Frysz , Keith W. Seitz , Thomas Marzano , Marc Gregory Martino
IPC: A61N1/375 , H01G4/40 , H01G4/005 , A61N1/08 , H01R43/00 , C22C29/12 , H02G3/22 , H01G4/30 , B23K35/30 , H01G2/10 , H01G4/35 , H01R13/52 , H01G4/236 , B23K35/32 , H01R4/02 , H01R13/719 , B23K35/02 , A61N1/05 , H01G4/12 , A61N1/372 , B22F1/00 , B22F7/08
Abstract: A hermetically sealed filtered feedthrough assembly attachable to an AIMD includes an insulator hermetically sealing a ferrule opening of an electrically conductive ferrule with a gold braze. A co-fired and electrically conductive sintered paste is disposed within and hermetically seals at least one via hole extending in the insulator. At least one capacitor is disposed on the device side. An active electrical connection electrically connects a capacitor active metallization and the sintered paste. A ground electrical connection electrically connects the gold braze to a capacitor ground metallization, wherein at least a portion of the ground electrical connection physically contacts the gold braze. The dielectric of the capacitor may be less than 1000 k. The ferrule may include an integrally formed peninsula portion extending into the ferrule opening spatially aligned with a ground passageway and metallization of an internally grounded feedthrough capacitor. The sintered paste may be of substantially pure platinum.
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Patent Agency Ranking
16.发明授权公开(公告)号：US11071858B2
公开(公告)日：2021-07-27
申请号：US16827171
申请日：2020-03-23
Applicant: Greatbatch Ltd.
Inventor： Robert A. Stevenson , Christine A. Frysz , Thomas Marzano , Keith W. Seitz , Marc Gregory Martino
IPC: A61N1/08 , H01G4/005 , H01G4/30 , H01G4/35 , A61N1/375 , H01G4/236 , H01G4/12 , H03H1/00 , A61N1/37
Abstract: A hermetically sealed filtered feedthrough assembly attachable to an AIMD includes an insulator hermetically sealing a ferrule opening of an electrically conductive ferrule with a gold braze. A co-fired and electrically conductive sintered paste is disposed within and hermetically seals at least one via hole extending in the insulator. At least one capacitor is disposed on the device side. An active electrical connection electrically connects a capacitor active metallization and the sintered paste. A ground electrical connection electrically connects the gold braze to a capacitor ground metallization, wherein at least a portion of the ground electrical connection physically contacts the gold braze. The dielectric of the capacitor may be less than 1000 k. The ferrule may include an integrally formed peninsula portion extending into the ferrule opening spatially aligned with a ground passageway and metallization of an internally grounded feedthrough capacitor. The sintered paste may be of substantially pure platinum.
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公开(公告)号：US10272252B2
公开(公告)日：2019-04-30
申请号：US15603521
申请日：2017-05-24
Applicant: Greatbatch Ltd.
Inventor： Keith W. Seitz , Thomas Marzano , Robert A. Stevenson , Christine A. Frysz , Jason Woods , Richard L. Brendel , Marc Gregory Martino
Abstract: An insulative feedthrough attachable to an active implantable medical device includes a feedthrough body having a material which is both electrically insulative, biocompatible and separates a body fluid side from a device side. A passageway is disposed through the feedthrough body. A composite conductor is disposed within the passageway and has a body fluid side metallic wire electrically conductive to a device side metallic wire. The body fluid side metallic wire extends from a first end disposed inside the passageway to a second end on the body fluid side. The device side metallic wire extends from a first end disposed inside the passageway to a second end on the device side. The body fluid side metallic wire is hermetically sealed to the feedthrough body. The body fluid side metallic wire is biocompatible and is not the same material as the device side metallic wire.
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公开(公告)号：US11344734B2
公开(公告)日：2022-05-31
申请号：US16589752
申请日：2019-10-01
Applicant: Greatbatch Ltd.
Inventor： Robert A. Stevenson , Christine A. Frysz , Keith W. Seitz , Thomas Marzano , Marc Gregory Martino
IPC: A61N1/375 , H01G4/40 , H01G4/005 , A61N1/08 , H01R43/00 , C22C29/12 , H02G3/22 , H01G4/30 , B23K35/30 , H01G2/10 , H01G4/35 , H01R13/52 , H01G4/236 , B23K35/32 , H01R4/02 , H01R13/719 , B23K35/02 , A61N1/05 , H01G4/12 , A61N1/372 , B22F7/08 , B22F1/10
Abstract: A hermetically sealed filtered feedthrough assembly attachable to an AIMD includes an insulator hermetically sealing the opening of a ferrule with a gold braze. The ferrule includes a peninsula extending into the ferrule opening and the insulator has a cutout matching the peninsula. A sintered platinum-containing paste hermetically seals at least one via hole extending through the insulator. At least one capacitor is disposed on the device side. An active electrical connection electrically connects the capacitor active metallization to the sintered paste. A ground electrical connection electrically connects the capacitor ground metallization disposed within a capacitor ground passageway to the portion of the gold braze along the ferrule peninsula. The dielectric of the capacitor may be less than 1,000 k.
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公开(公告)号：US20210154483A1
公开(公告)日：2021-05-27
申请号：US17165500
申请日：2021-02-02
Applicant: Greatbatch Ltd.
Inventor： Robert A. Stevenson , Christine A. Frysz , Keith W. Seitz , Brian P. Hohl , Marc Gregory Martino
Abstract: A feedthrough for an AIMD includes a ferrule with an insulator hermetically sealing a ferrule opening, both cooperatively separating a body fluid side from a device side. A circuit board disposed adjacent to the insulator device side has a ground plate or ground trace electrically connected to a circuit board ground conductive pathway disposed in a circuit board ground via hole. An anisotropic conductive layer disposed between the circuit board and the insulator device side has an electrically insulative matrix supporting a plurality of electrically conductive particles. The anisotropic conductive layer has a first thickness where at least one first electrically conductive particle is longitudinally aligned and in electrical contact with the ferrule and the circuit board ground conductive pathway electrically connected to the at least one circuit board ground plate or ground trace. The anisotropic conductive layer has a second, greater thickness where the ferrule and the circuit board ground conductive pathway are not longitudinally aligned, and no electrically conductive particles are in electrical contact with the ferrule and the circuit board ground conductive pathway.
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公开(公告)号：US20180304084A1
公开(公告)日：2018-10-25
申请号：US16004569
申请日：2018-06-11
Applicant: Greatbatch Ltd.
Inventor： Robert A. Stevenson , Christine A. Frysz , Keith W. Seitz , Thomas Marzano , Marc Gregory Martino
IPC: A61N1/375 , H02G3/22 , H01R43/00 , A61N1/05 , A61N1/08 , H01G4/40 , H01G4/35 , H01G4/30 , H01G4/12 , H01G4/005 , H01G2/10 , C22C29/12 , B23K35/30 , A61N1/372
CPC classification number: A61N1/3754 , A61N1/05 , A61N1/08 , A61N1/372 , A61N1/375 , B23K35/3013 , C22C29/12 , H01G2/103 , H01G4/005 , H01G4/12 , H01G4/30 , H01G4/35 , H01G4/40 , H01R43/00 , H02G3/22 , Y10T156/1052
Abstract: A hermetically sealed filtered feedthrough assembly attachable to an AIMD includes an insulator hermetically sealing a ferrule opening of an electrically conductive ferrule with a gold braze. A co-fired and electrically conductive sintered paste is disposed within and hermetically seals at least one via hole extending in the insulator. At least one capacitor is disposed on the device side. An active electrical connection electrically connects a capacitor active metallization and the sintered paste. A ground electrical connection electrically connects the gold braze to a capacitor ground metallization, wherein at least a portion of the ground electrical connection physically contacts the gold braze. The dielectric of the capacitor may be less than 1000 k. The ferrule may include an integrally formed peninsula portion extending into the ferrule opening spatially aligned with a ground passageway and metallization of an internally grounded feedthrough capacitor. The sintered paste may be of substantially pure platinum.
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