公开(公告)号：US20170309685A1

公开(公告)日：2017-10-26

申请号：US15516692

申请日：2015-10-14

Applicant: Heptagon Micro Optics Pte. Ltd.

Inventor： Stephan Heimgartner ,  Alexander Bietsch ,  Peter Riel

IPC: H01L27/32 ,  G02B27/42 ,  G02B27/09 ,  H01L31/0232

Abstract: The present disclosure describes optical element stack assemblies that include multiple substrates stacked one over another. At least one of the substrates includes an optical element, such as a DOE, on its surface. The stack assemblies can be fabricated, for example, in wafer-level processes.

公开(公告)号：USD799103S1

公开(公告)日：2017-10-03

申请号：US29565446

申请日：2016-05-20

Applicant: Heptagon Micro Optics Pte. Ltd.

Designer： Matthias Gloor ,  Martin Lukas Balimann ,  Peter Riel