公开(公告)号：US20180266877A1

公开(公告)日：2018-09-20

申请号：US15984278

申请日：2018-05-18

Applicant: Heptagon Micro Optics Pte. Ltd.

Inventor： Qichuan Yu ,  Hartmut Rudmann ,  Ji Wang ,  Kian Siang Ng ,  Simon Gubser ,  Sonja Hanselmann

IPC: G01J1/02 ,  H01L31/173

CPC classification number: G01J1/0209 ,  G01J1/0214 ,  G01J1/0271 ,  G01J1/0295 ,  H01L31/173

Abstract: Disclosed are optical devices and methods of manufacturing optical devices. An optical device can include a substrate; an optical emitter chip affixed to the front surface of the substrate; and an optical sensor chip affixed to the front surface of the substrate. The optical sensor chip can include a main sensor and a reference sensor. The optical device can include an opaque dam separating the main optical sensor and the reference sensor. The optical device can include a first transparent encapsulation block encapsulating the optical emitter chip and the reference optical sensor and a second transparent encapsulation block encapsulating the main optical sensor. The optical device can include an opaque encapsulation material encapsulating the first transparent encapsulation block and the second transparent encapsulation block with a first opening above the main optical sensor and a second opening above the optical emitter chip.

公开(公告)号：US20170229505A1

公开(公告)日：2017-08-10

申请号：US15329112

申请日：2015-07-22

Applicant: Heptagon Micro Optics Pte. Ltd.

Inventor： Simon Gubser ,  Sonja Hanselmann ,  Qichuan Yu ,  Cris Calsena ,  Guo Xiong Wu ,  Hartmut Rudmann

IPC: H01L27/146 ,  H01L25/04

CPC classification number: H01L27/14618 ,  H01L25/042 ,  H01L27/14623 ,  H01L27/14634 ,  H01L27/14636 ,  H01L27/14685 ,  H01L27/14687 ,  H01L2224/48091 ,  H01L2924/00014

Abstract: This disclosure describes optoelectronic modules that include an image sensor having at least two regions separated optically from one another by a wall. The wall can include a bridge portion that extends over the image sensor and further can include a cured adhesive portion, part of which is disposed between a lower surface of the bridge portion and an upper surface of the image sensor. Various techniques are described for fabricating the modules so as to help prevent the adhesive from contaminating sensitive regions of the image sensor. The wall can be substantially light-tight so as to prevent undesired optical cross-talk, for example, between a light emitter located to one side of the wall and a light sensitive region of the image sensor located to the other side of the wall.