公开(公告)号：US10675526B2

公开(公告)日：2020-06-09

申请号：US15583246

申请日：2017-05-01

Applicant: Intel Corporation

Inventor： Stephanie Moyerman ,  James Brian Hall ,  Braxton Lathrop

IPC: A63B67/14 ,  A63B71/06 ,  A63B24/00 ,  A63B69/00 ,  A63B102/24

Abstract: Illustrative examples of a sports apparatus and methods for manufacturing a sports apparatus for sensing a scoring event, including but not limited to hockey pucks. In some examples, the sports apparatus includes a body formed of a substrate material and an additive embedded in the substrate material. The additive may be used by a sensor array to locate the position of the sports apparatus in relation to a sports goal. Example additives include an electronic object or a doping material.

公开(公告)号：US10327331B2

公开(公告)日：2019-06-18

申请号：US15762811

申请日：2015-09-25

Applicant: Intel Corporation

Inventor： Nadine L. Dabby ,  Adel A. Elsherbini ,  Braxton Lathrop ,  Sasha N. Oster ,  Aleksandar Aleksov

IPC: H05K1/02 ,  G06F1/16 ,  H05K1/11

Abstract: Some forms relate to a stretchable computing device. The stretchable computing device includes a first layer that includes electrical interconnects at a first density wherein the first layer includes a first electronic component; a stretchable second layer electrically connected to the first layer, wherein the stretchable second layer includes electrical interconnects at a second density that is less than the first density, wherein the second layer includes a second electronic component; and a stretchable third layer electrically connected to the stretchable second layer, wherein the stretchable third layer includes electrical interconnects at a third density that is less than the second density.

公开(公告)号：US10327330B2

公开(公告)日：2019-06-18

申请号：US15762791

申请日：2015-09-24

Applicant: Intel Corporation

Inventor： Aleksandar Aleksov ,  Adel A. Elsherbini ,  Javier Soto Gonzalez ,  Dilan Seneviratne ,  Shruti R. Jaywant ,  Sashi S. Kandanur ,  Srinivas Pietambaram ,  Nadine L. Dabby ,  Braxton Lathrop ,  Rajat Goyal ,  Vivek Raghunathan

IPC: H05K1/02 ,  H01L23/14 ,  H01L23/538 ,  H05K1/03 ,  H05K1/11 ,  H05K1/18 ,  H05K3/00 ,  H05K3/18 ,  H05K3/28 ,  H05K3/34 ,  H05K3/42 ,  H05K3/46 ,  H05K3/20

Abstract: Some forms relate to an example stretchable electronic assembly. The stretchable electronic assembly includes a stretchable body that includes electronic components. A plurality of meandering conductors electrically connect the electronic components. The plurality of meandering conductors may be exposed from the stretchable body. A plurality of conductive pads are electrically connected to at least one of the electronic components or some of the plurality of meandering conductors. The plurality of conductive pads may be exposed from the stretchable body. The stretchable body includes an upper surface and lower surface. The plurality of meandering conductors may be exposed from the lower surface (in addition to, or alternatively to, the upper surface) of the stretchable body.

公开(公告)号：US20180311562A1

公开(公告)日：2018-11-01

申请号：US15583246

申请日：2017-05-01

Applicant: Intel Corporation

Inventor： Stephanie Moyerman ,  James Brian Hall ,  Braxton Lathrop

IPC: A63B71/06 ,  A63B24/00

Abstract: Illustrative examples of a sports apparatus and methods for manufacturing a sports apparatus for sensing a scoring event, including but not limited to hockey pucks. In some examples, the sports apparatus includes a body formed of a substrate material and an additive embedded in the substrate material. The additive may be used by a sensor array to locate the position of the sports apparatus in relation to a sports goal. Example additives include an electronic object or a doping material.

公开(公告)号：US20180295720A1

公开(公告)日：2018-10-11

申请号：US15762791

申请日：2015-09-24

Applicant: Intel Corporation

Inventor： Aleksandar Aleksov ,  Adel A. Elsherbini ,  Javier Soto Gonzalez ,  Dilan Seneviratne ,  Shruti R. Jaywant ,  Sashi S. Kandanur ,  Srinivas Pietambaram ,  Nadine L. Dabby ,  Braxton Lathrop ,  Rajat Goyal ,  Vivek Raghunathan

IPC: H05K1/02 ,  H05K1/18 ,  H05K1/11 ,  H05K1/03 ,  H05K3/18 ,  H05K3/46 ,  H05K3/00 ,  H05K3/34 ,  H05K3/28 ,  H05K3/42

CPC classification number: H05K1/0283 ,  H01L23/145 ,  H01L23/5387 ,  H05K1/038 ,  H05K1/111 ,  H05K1/189 ,  H05K3/0023 ,  H05K3/0047 ,  H05K3/0052 ,  H05K3/0055 ,  H05K3/18 ,  H05K3/205 ,  H05K3/284 ,  H05K3/341 ,  H05K3/429 ,  H05K3/4661 ,  H05K3/4682 ,  H05K2201/0133 ,  H05K2201/0329 ,  H05K2201/09263 ,  H05K2201/10098 ,  H05K2201/10151 ,  H05K2203/1316 ,  H05K2203/1327

Abstract: Some forms relate to an example stretchable electronic assembly. The stretchable electronic assembly includes a stretchable body that includes electronic components. A plurality of meandering conductors electrically connect the electronic components. The plurality of meandering conductors may be exposed from the stretchable body. A plurality of conductive pads are electrically connected to at least one of the electronic components or some of the plurality of meandering conductors. The plurality of conductive pads may be exposed from the stretchable body. The stretchable body includes an upper surface and lower surface. The plurality of meandering conductors may be exposed from the lower surface (in addition to, or alternatively to, the upper surface) of the stretchable body.

公开(公告)号：US20180255635A1

公开(公告)日：2018-09-06

申请号：US15762811

申请日：2015-09-25

Applicant: Intel Corporation

Inventor： Nadine L. Dabby ,  Adel A. Elsherbini ,  Braxton Lathrop ,  Sasha N. Oster ,  Aleksandar Aleksov

IPC: H05K1/02 ,  H05K1/11 ,  G06F1/16

CPC classification number: H05K1/0283 ,  G06F1/163 ,  G06F1/1656 ,  H05K1/118 ,  H05K2201/0133

Abstract: Some forms relate to a stretchable computing device. The stretchable computing device includes a first layer that includes electrical interconnects at a first density wherein the first layer includes a first electronic component; a stretchable second layer electrically connected to the first layer, wherein the stretchable second layer includes electrical interconnects at a second density that is less than the first density, wherein the second layer includes a second electronic component; and a stretchable third layer electrically connected to the stretchable second layer, wherein the stretchable third layer includes electrical interconnects at a third density that is less than the second density.

公开(公告)号：US20170163178A1

公开(公告)日：2017-06-08

申请号：US14961116

申请日：2015-12-07

Applicant: Intel Corporation

Inventor： Nadine L. Dabby ,  Feras Eid ,  Adel A. Elsherbini ,  Braxton Lathrop ,  Aleksandar Aleksov ,  Sasha Oster

IPC: H02N2/18 ,  F03G5/08

CPC classification number: F03G5/08 ,  H01L41/113 ,  H02N2/18

Abstract: A device for harvesting energy from fabric or clothing includes a piece of fabric or clothing. One or more piezoelectric harvesters are coupled with the piece of fabric or clothing. The piezoelectric harvesters are capable of producing electric energy in response to the movement of the piece of fabric or clothing. Additionally, the device includes one or more energy storage mediums coupled to the one or more piezoelectric harvesters. The energy storage mediums are capable of storing the energy produced by the one or more piezoelectric harvesters. Further, the method for harvesting energy from fabric or clothing involves moving a piece of fabric such that one or more piezoelectric harvesters generate electricity. The method for harvesting energy from fabric or clothing also involves storing the generated electricity in one or more energy storage mediums.

公开(公告)号：US20200004290A1

公开(公告)日：2020-01-02

申请号：US16567479

申请日：2019-09-11

Applicant: Intel Corporation

Inventor： Nadine L. Dabby ,  Sasha N. Oster ,  Aleksandar Aleksov ,  Braxton Lathrop ,  Racquel L. Fygenson

IPC: G06F1/16

Abstract: Systems and methods describe herein provide a solution to the technical problem of creating a wearable electronic devices. In particular, these systems and methods enable electrical and mechanical attachment of stretchable or flexible electronics to fabric. A stretchable or flexible electronic platform is bonded to fabric using a double-sided fabric adhesive, and conductive adhesive is used to join pads on the electronic platform to corresponding electrical leads on the fabric. An additional waterproofing material may be used over and beneath the electronic platform to provide a water-resistant or waterproof device This stretchable or flexible electronic platform integration process allows the platform to bend and move with the fabric while protecting the conductive connections. By using flexible and stretchable conductive leads and adhesives, the platform is more flexible and stretchable than traditional rigid electronics enclosures.

公开(公告)号：US20180073897A1

公开(公告)日：2018-03-15

申请号：US15264361

申请日：2016-09-13

Applicant: Intel Corporation

Inventor： Xue Yang ,  Zhen Yao ,  Haibin Liu ,  Stephanie Moyerman ,  Braxton Lathrop ,  James Hall ,  Jeremy Parra

IPC: G01D5/20 ,  A63B71/06 ,  A63B63/00

CPC classification number: G01D5/2006 ,  A63B63/004 ,  A63B71/0605 ,  A63B71/0622 ,  A63B2102/24 ,  A63B2209/08 ,  A63B2220/20 ,  A63B2220/36 ,  A63B2220/40 ,  A63B2220/89

Abstract: Methods and apparatus for high speed location determinations are disclosed. An example apparatus includes at least two coils arranged along a zone of interest to generate a magnetic field, and a sensor to measure a change in the magnetic field associated with the at least two coils as an object of interest moves within or into the zone of interest. The example apparatus also includes a processor to determine a position of the object of interest based on the measured change.

公开(公告)号：US09915978B2

公开(公告)日：2018-03-13

申请号：US14859894

申请日：2015-09-21

Applicant: Intel Corporation

Inventor： Nadine L. Dabby ,  Lakshman Krishnamurthy ,  Braxton Lathrop ,  Aleksandar Aleksov ,  Adel Elsherbini ,  Sasha Oster ,  Tom L. Simmons

IPC: H05K3/30 ,  G06F1/16

CPC classification number: G06F1/1633 ,  H01L23/5385 ,  H01L23/5387 ,  H01L25/105 ,  H01L2225/1017 ,  H01L2225/1047 ,  H01L2924/00

Abstract: Some forms relate to a method of making a stretchable computing system. The method includes attaching a first set of conductive traces to a stretchable member; attaching a first electronic component to the first set of conductive traces; adding a first set of flexible conductors to the stretchable member such that the first set of flexible conductors is electrically connected to the first set of conductive traces; adding stretchable material to the stretchable member such that the first set of conductive traces is surrounded by the stretchable member; forming an opening in the stretchable member that exposes the first set of conductive traces; and attaching a second set of conductive traces to the stretchable member such that the second set of conductive traces fills the opening to form a via in the stretchable member that electrically connects the first set of conductive traces with the second set of conductive traces.