公开(公告)号：US20190001342A1

公开(公告)日：2019-01-03

申请号：US15638167

申请日：2017-06-29

Applicant: Intel Corporation

Inventor： Amanuel M. Abebaw ,  Mark Saltas ,  Anna M. Prakash ,  Liwei Wang

IPC: B03C1/034 ,  B03C1/00

Abstract: An apparatus for storing magnetic materials may include a tray. The apparatus for storing magnetic materials may include a sheet. The apparatus for storing magnetic materials may include a first set of height modulators. The apparatus for storing magnetic materials may include a diamagnetic material.The tray may include one or more pockets. The one or more pockets may be configured to receive a magnetic device. The sheet may be configured to couple with the tray. The sheet may be located adjacent to a bottom of the one or more pockets. The sheet may include the diamagnetic material. The sheet may include the first set of height modulators. The first set of height modulators may protrude from a surface of the sheet. The first set of height modulators may be configured to extend into the one or more pockets at a first distance.

公开(公告)号：US20200073099A1

公开(公告)日：2020-03-05

申请号：US16336607

申请日：2016-09-30

Applicant: Intel Corporation

Inventor： Chia-Pin Chiu ,  Anna M. Prakash ,  Amanuel M. Abebaw ,  Olga Gorbounova ,  Ching-Ping Janet Shen ,  Shan Zhong ,  Mark Saltas

IPC: G02B19/00 ,  G01J1/04

Abstract: Various embodiments disclosed relate to an assembly. The assembly includes a compound parabolic concentrator including an exit aperture that has a generally circular perimeter, which defines a circumference of the exit aperture. The assembly further includes a photodiode sensor generally that is aligned with the exit aperture of the compound parabolic concentrator. An optical adhesave layer adheres the exit aperture of the compound parabolic concentrator to the photodiode sensor. A protrusion extends between at least a portion of the perimeter of the compound parabolic concentrator exit aperture and the photodiode.

公开(公告)号：US20190355666A1

公开(公告)日：2019-11-21

申请号：US16510295

申请日：2019-07-12

Applicant: Intel Corporation

Inventor： Eric J. Li ,  Timothy A. Gosselin ,  Yoshihiro Tomita ,  Shawna M. Liff ,  Amram Eitan ,  Mark Saltas

IPC: H01L23/538 ,  H01L23/00 ,  H01L23/31 ,  H01L21/48 ,  H01L23/13 ,  H01L21/56 ,  H01L23/48 ,  H01L25/065

Abstract: A microelectronic structure includes a microelectronic substrate having a first surface and a cavity extending into the substrate from the microelectronic substrate first surface, a first microelectronic device and a second microelectronic device attached to the microelectronic substrate first surface, and a microelectronic bridge disposed within the microelectronic substrate cavity and attached to the first microelectronic device and to the second microelectronic device. In one embodiment, the microelectronic structure may include a reconstituted wafer formed from the first microelectronic device and the second microelectronic device. In another embodiment, a flux material may extend between the first microelectronic device and the microelectronic bridge and between the second microelectronic device and the microelectronic bridge.

公开(公告)号：US20190002735A1

公开(公告)日：2019-01-03

申请号：US15637960

申请日：2017-06-29

Applicant: Intel Corporation

Inventor： Mohit Gupta ,  Anna M. Prakash ,  Vladimir Malamud ,  Mark Saltas ,  Ziv Belman

IPC: C09J7/02 ,  H01B1/02 ,  H01L23/36 ,  C09J1/00

Abstract: Aspects of the embodiments are directed to an optoelectronic device that includes one or more pressure sensitive adhesives to secure components during an assembly process. The optoelectronic device includes an electromagnetic interference/radio frequency interference shield. The shield can include an aperture for permitting light to enter a photodetector. An infrared filter can be secured to the shield using a pressure sensitive adhesive (PSA) film. The PSA film can be a templated film that is double sided. A PSA film can also be used to secure the shield to the printed circuit board (PCB) of the optoelectronic device. To promote electromagnetic conduction between the shield and the PCB, the PSA film can include additives. Aspects of the embodiments are directed to methods for assembling the optoelectronic device by picking and placing a PSA film and applying a pressure to certain components to activate the PSA film adhesion.

公开(公告)号：US20180134547A1

公开(公告)日：2018-05-17

申请号：US15354761

申请日：2016-11-17

Applicant: Intel Corporation

Inventor： Robert Starkston ,  Amanuel M. Abebaw ,  Liwei Wang ,  Mark Saltas ,  Sandeep S. Iyer ,  Nick Labanok

IPC: B81C1/00 ,  B29C65/48 ,  B29C65/14 ,  B81B3/00

CPC classification number: B81C1/00182 ,  B29C65/14 ,  B29C65/4805 ,  B29L2031/34 ,  B81B3/0032 ,  B81B3/0051 ,  B81B3/0054 ,  B81B3/0059 ,  B81B3/0062 ,  B81B2201/038 ,  B81B2201/042 ,  B81B2203/0163 ,  B81B2203/051 ,  B81C2203/032

Abstract: Apparatuses, systems, and methods associated with placement of magnets within a microelectromechanical system device are disclosed herein. In embodiments, a method of affixing at least one magnet in a microelectromechanical system, may include affixing an electromagnetic actuator to a base structure of the microelectromechanical system, the affixing including affixing the electromagnetic actuator within a recess formed in the base structure. The method may further include placing a magnet within the recess, wherein the recess includes at least a portion of a spring, the spring affixed to the base structure and extending into the recess, the placing including placing the magnet on a side of the electromagnetic actuator, between the spring and the side of the electromagnetic actuator, the spring pressing the magnet against the side of the electromagnetic actuator and maintaining a position of the magnet in response to the placing the magnet within the recess.