公开(公告)号：US10418309B1

公开(公告)日：2019-09-17

申请号：US16018760

申请日：2018-06-26

Applicant: Intel Corporation

Inventor： Bijoyraj Sahu ,  Thomas A. Boyd ,  Jeffory L. Smalley

IPC: H01L23/40 ,  H01L21/48 ,  H01L23/367

Abstract: Described herein are microelectronics packages and methods for manufacturing the same. The microelectronics package may include a substrate, a first die, a gasket, and a thermal interface. The first die may be connected to the substrate. The gasket may be connected to the substrate and may encircle the first die to form a space between the first die and the gasket. The thermal interface material may be located within the space formed by the first die and the gasket.